• Journal of the Korean Applied Science and Technology
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• v.21 no.3
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• pp.214-224
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• 2004

Although the structure of carbon nanotubes is important factor characterizing its properties, it is very difficult to control the structure of carbon nanotubes (MWNTs) and to predict the range of their diameter, which is the primary factor of MWNTs' physical properties. We tried to control the diameter of MWNTsby governing the feed injection temperature of floating catalyst method. The structure of MWNTs was influenced by the phase change of ferrocene fed as the catalyst,. The carbon nanotubes were very narrow at injection temperatures close to the sublimation pt. of ferrocene, in which most MWNTs had diameters in the range of 20$^{\sim}$30 nm. At injection temperatures between the boiling pt. and melting pt. of ferrocene, the diameters became larger and had broad distribution. However, at injection temperatures higher than the boiling pt., the diameters became narrow again and had very uniform distribution.

• Journal of the Korean Vacuum Society
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• v.5 no.2
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• pp.139-146
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• 1996

Transparent and conducting Sb-doped $SnO_2$ thin films were prepared by rf magnetron sputtering technology. But it showed a serious damage phenomenon on the surface of as-deposited films. In order to avoid a damage caused in the substrate center and location facing to target erosion, a ring plate of masking glass was installed at 1.5 cm above target surface. The uniformity and electrical characteristic of $SnO_2$ thin films were evaluated by the control of optimal conditions in the magnetron sputtering operation such as rf power, sputtering gas pressure, and substrate temperature. In the experimental results using the operating conditions, the optimum temperature, which produced uniform and damageless films, shifted with the change of gas pressure. The rate was about $100^{\circ}C$/5 mTorr at rf power of 50 W Similarly, the optimum temperature in compensation for an increase of rf power shifted down to a proper rate.

• Journal of the Korean Ceramic Society
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• v.31 no.2
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• pp.129-136
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• 1994

Si3N4 with 6w/o Y2O3 and 1.5w/o Al2O3 has been gas pressure sintered and its densification behavior and the effect of the sintering variables on the microstructure and mechanical properties were investigated. Densification rate was higher at temperature below 1775$^{\circ}C$ and between 187$0^{\circ}C$ and 195$0^{\circ}C$ than between 1775$^{\circ}C$ and 187$0^{\circ}C$. The faster densification at temperature between 187$0^{\circ}C$ and 195$0^{\circ}C$ was thought to be due to the increased amount of liquid phase resulting from the increased amount of Si3N4 dissolving in the liquid. $\beta$-Si3N4 and Y-disilicate at temperatures below 1775$^{\circ}C$, and only $\beta$-Si3N4 at 187$0^{\circ}C$ and above were detected by XRD analysis. Three different two-step schedules were employed to obtain sintered body with above 99% theoretical density and to investigate the effect of the sintering variables on the density, the microstructure and the mechanical properties of the sintered body. The sintered density did not change with the heating rate, and the microstructure became coarser as the temperature increased. The strength decreased with the width of $\beta$-Si3N4 grain, while the fracture toughness increased with the square root of it. A ceramic cutting tool made of the sintered body showed an uniform flank wear after the cutting test.

• ETRI Journal
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• v.24 no.5
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• pp.349-359
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• 2002

With Ni/Au and Pd/Au metal schemes and low temperature processing, we formed low resistance stable Ohmic contacts to p-type GaN. Our investigation was preceded by conventional cleaning, followed by treatment in boiling $HNO_3$:HCl (1:3). Metallization was by thermally evaporating 30 nm Ni/15 nm Au or 25 nm Pd/15 nm Au. After heat treatment in $O_2$ + $N_2$ at various temperatures, the contacts were subsequently cooled in liquid nitrogen. Cryogenic cooling following heat treatment at $600^{\circ}C$ decreased the specific contact resistance from $9.84{\times}10^{-4}$ ${\Omega}cm^2$ to $2.65{\times}10^{-4}$ ${\Omega}cm^2$ for the Ni/Au contacts, while this increased it from $1.80{\times}10^{-4}$ ${\Omega}cm^2$ to $3.34{\times}10^{-4}$ ${\Omega}cm^2$ for the Pd/Au contacts. The Ni/Au contacts showed slightly higher specific contact resistance than the Pd/Au contacts, although they were more stable than the Pd contacts. X-ray photoelectron spectroscopy depth profiling showed the Ni contacts to be NiO followed by Au at the interface for the Ni/Au contacts, whereas the Pd/Au contacts exhibited a Pd:Au solid solution. The contacts quenched in liquid nitrogen following sintering were much more uniform under atomic force microscopy examination and gave a 3 times lower contact resistance with the Ni/Au design. Current-voltage-temperature analysis revealed that conduction was predominantly by thermionic field emission.

• Journal of Advanced Marine Engineering and Technology
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• v.34 no.4
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• pp.485-490
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• 2010

MILD (Moderate and Intense Low Oxygen Dilution) combustion is a technique which is able to reduce NOx formation and to uniform temperature distribution in the furnace by recirculating the exhaust gas to the fresh air and fuel. This study focuses on finding optimal condition of MILD combustor by changing equivalence ratio with fuel and air flow. The present experiment employs six thermocouple sensors in the furnace, and two concentration probes of NOx and CO at the exhaust exit pipe respectively. The MILD combustion phenomena have been observed at the condition of equivalent ratios of 0.71~0.73, and the temperature uniformity, NOx and CO concentration are also examined at the MILD combustion condition.

• Proceedings of the IEEK Conference
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• 2001.10a
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• pp.165-170
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• 2001

The main purpose of this study is to generate a fine copper oxide powder of high purity, with a compact structure and a uniform particle size by a spray pyrolysis process. The raw material is a waste copper chloride solution formed in the manufacturing process of Print Circuit Board (PCB). This study also examines the influences of various factors on the properties of the generated powder. These factors include the reaction temperature, the inflow speed of the raw material solution, the inflow speed of the air, the size of the nozzle tip, and the concentration of the raw material solution. It is discovered that, as the reaction temperature increases from 80$0^{\circ}C$ to 100$0^{\circ}C$ , the particle size of the generated powder increases accordingly, and that the structure of the powder becomes much more compact. When the reaction temperature is 100$0^{\circ}C$, the particle size of the generated powder increases as the concentration of copper in the raw material solution increases to 40g/l, decreases as the concentration increases up to 120g/l, and increases again as the concentration reaches 200g/1. In the case of a lower concentration of the raw material solution, the generated powder appears largely in the form of CuO. As the concentration increases, however, the powder appears largely in the form of CuCl. When the concentration of copper in the raw material solution is 120g/1, the particle size of the generated powder increases as the inflow speed of the raw material solution increases. When the concentration of copper in the raw material solution is 120g/1, there is no evident change in the particle size of the generated powder as the size of the nozzle tip and the air pressure increases. When the concentration is 40g/1, however, the particle size keeps increasing until the air pressure increases to 0.5kg/$\textrm{cm}^2$, but decreases remarkably as the air pressure exceeds 0.5kg/$\textrm{cm}^2$.

• Journal of the Microelectronics and Packaging Society
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• v.11 no.4 s.33
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• pp.37-41
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• 2004

As mobile communication devices use wide bands for large data transmission, Low Temperature Co-fired Ceramic(LTCC) has been a candidate for module substrate, for it provides better electrical properties and enables various embedded passive devices compared to conventional PCB. The LTCC, however, has applied in limited area because of non-uniform shrinkage. Hybrid heating was developed to raise sample temperature uniformly in a short period of time This leads to unidirectional sintering which enables sample to be sintered layer by layer from the bottom, resulting in more stable shape of interconnection at the top surface of the sample than conventional electric furnace heating. When sintering properties of substrate and electrical/mechanical properties of interconnection were compared, hybrid heating showed possibility to be applicable to substrate miniaturization and interconnection densification superior to electric furnace heating.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.25 no.6
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• pp.486-490
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• 2012

$La_{7.33}Bi_2(SiO_4)_6O_2$ specimens were fabricated by standard solid-state synthesis route for solid oxide electrolytes. The calcined powders exhibited uniform particles with a mean particle size of about $28{\mu}m$. The room-temperature structure of $La_{7.33}Bi_2(SiO_4)_6O_2$ specimens was analyzed as hexagonal, space group P63 or P63/m, and the unit cell volume increased with increase a sintering temperature. The specimens sintered at $1,175^{\circ}C$ showed X-ray patterns of homogeneous apatite single phase without the second phase such as $La_2Si_2O_7$ and $La_2SiO_5$. The specimen sintered at $1,175^{\circ}C$ showed the maximum sintered density of 5.49 $g/cm^3$. Increasing the sintering temperature, total conductivities increased, activation energy decreased and the values were $1.98{\times}10^{-5}Scm-1$ and 1.23 eV, respectively.

• Korean Journal of Materials Research
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• v.9 no.8
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• pp.775-781
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• 1999

Palladium thin films of uniform and highly dense microstructure were prepared by the eletroplating method using novel PdCl$_2$-based plating bath. Principal variables taken into account in this study were the plating temperature and the current density. Electroplated Pd films were characterized for Crystalline orientation, morphology and hardness. The optimal temperature and current density were found be $50^{\circ}C$ and 5mA/$\textrm{cm}^2$, repectively. The measured hardness value for the Pd films when prepared under the optimal condition was as high as 600kg/$\textrm{mm}^2$. A correlation study between variables and properties seems to indicate that the hardness was significantly affected by the microstructure, but not by crystallite orientation.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.16 no.6
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• pp.490-495
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• 2003

The electromagnetic properties and thermal behavior of Mn-Zn ferrite cores for the blocking filter of Power Line Communication(PLC) application were investigated as a function of additives. The highest density and permeability were 4.98 g/$\textrm{cm}^2$ and 8,221, respectively and were obtained to the specimen with composition of MnO 24 mol%, ZnO 25 mol% and Fe$_2$O$_3$ mol%, added MoO$_3$ of 400 ppm, SiO$_2$ of 100 ppm, and CaO of 200 ppm. The uniform grains were organized, and the microstructures were densified due to reduction of pores in the specimen. The permeability was increased up to 13,904 as the temperature of specimen increased to 110$^{\circ}C$. However, it was decreased precipitously under 100 over 110$^{\circ}C$. The exothermic behavior was observed in the frequency range from 1 kHz to 1 MHz, and the maximum temperature of specimen was 102$^{\circ}C$ at 1 MHz. In the consequence, the Mn-Zn ferrite core developed in this research will maintain the stable electromagnetic properties since the temperature of ferrite core rose to 93$^{\circ}C$ in the range of 100 kHz to 450 kHz bandwidth qualified for PLC. The blocking filters were designed for single phase and three phases using the in-line and non-contact core. The best attenuation ratios of -46.46 dB and -73.9 dB were measured in the range of 100 kHz to 450 kHz bandwidth, respectively.