• Applied Chemistry for Engineering
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• v.21 no.4
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• pp.411-416
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• 2010

In this research, we intended to improve the tolerance of thick film resistor using photosensitive polymer resistor paste which was fabricated with alkali-solution developable photosensitive resin and conductive carbon black. At first, we investigated the effect of the selection of carbon black and photosensitive resin on the resistance range and tolerance level of polymer thick film resistor (PTFR). And then, a difference in resistance tolerance was evaluated according to the coating methods of photosensitive resistor paste on test board. In case that the photosensitive resistor paste was coated on whole surface of test board using screen printing, large positional tolerance was obtained because the formation of the thick film with uniform thickness was difficult. On the other hand, when the paste was coated with roller, the resistive thick film with uniform thickness was formed on the whole board area and the result of resistance evaluation showed low tolerance in ${\pm}10%$ range. The tolerance of PTFR could be improved by combination of the precise patterning using photo-process and the coating process for the resistive thick film with uniform thickness.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.56 no.8
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• pp.1471-1475
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• 2007

In this paper, a novel embedded ultra wideband (UWB) band-pass filter is presented on a FR-4 package substrate including high Dk resin coated copper (${\varepsilon}_r=30$) film. The proposed UWB filter is comprised of a parallel resonator with meander-type uniform impedance resonator (UIR) and two series resonators with high Q circular stacked spiral inductor and metal-insulator-metal (MIM) capacitor. In order to obtain excellent attenuation characteristics by generating attenuation poles in lower and upper stop bands, a single MIM capacitor is added to each resonator. The fabricated FR-4 embedded UWB filter has insertion loss of -1.0dB and return loss of -11dB, respectively. It has also extremely wide bandwidth (over 50%) and small size ($3.7{\times}4{\times}0.77\;mm^3$) which is compatible with LTCC devices.

• Korean Journal of Materials Research
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• v.30 no.12
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• pp.701-708
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• 2020

Irradiation of the metal nanoparticles causes local plasmon resonance in a specific wavelength band, which can improve the absorption and scattering properties of a structure. Since noble metal nanoparticles have better resonance effects than those of other metals, it is easy to identify plasmonic reactions and this is advantageous to find the optical tendency. Compared to having a particle gap or randomly arranged particle structures, densely and evenly packed structures can exhibit more uniform optical properties. Using the uniform properties, the structure can be applied to optical filtering applications. Therefore, in this paper, validation tests about metal nanoparticles and thin film structures are conducted for more accurate analysis. The optical properties of monolayer and bilayer noble metal nanoparticle structures with different diameters, packed in a uniform array, are investigated and their optical trends are analyzed. In addition, a thin film structure under identical conditions as metal nanoparticle structure is evaluated to confirm the improved optical characteristics.

• Electrical & Electronic Materials
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• v.10 no.5
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• pp.461-466
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• 1997

In this paper, we developed the new non-rubbing liquid crystal (LC) alignment techniques in the cell with slanted non-polarized ultraviolet (UV) light irradiation on polyimide (PI) film. It is shown that the uniform alignment for nematic (N) LC is obtained by using slanted non-polarized UV light irradiation on PI surface. We successfully obtained that the pretilt angle of NLC is generated about 3.3 degree in the cell with slanted non-polarized UV light irradiation with 70 degree on PI surface, for the first time. It is considered that the pretilt angle generation in NLC is attributed to interaction between the LC molecular and the PI, which is broken the polymer by slanted non-polarized UV irradiation. Therefore, we concluded that the uniform LC alignment is attributed to anisotropic dispersion force due to photo depolymerization with slanted non-polarized UV light irradiation on PI surface.

• Macromolecular Research
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• v.14 no.2
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• pp.205-208
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• 2006

A polymeric film of a biodegradable poly(1,5-dioxepan-2-one) (PDXO) was formed on a gold surface by a combination of the formation of self-assembled monolayers (SAMs) presenting hydroxyl groups and the surface-initiated, ring-opening polymerization (SI-ROP) of 1,5-dioxepan-2-one (DXO). The SI-ROP of DXO was achieved by heating a mixture of $Sn(Oct)_2$, DXO, and the SAM-coated substrate in anhydrous toluene at $55^{\circ}C$. The resulting PDXO film was quite uniform. The PDXO film was characterized by polarized infrared external reflectance spectroscopy, X-ray photoelectron spectroscopy, time-of-flight secondary ion mass spectrometry, atomic force microscopy, ellipsometry, and contact angle goniometry.

• Proceedings of the IEEK Conference
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• 2003.07b
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• pp.727-730
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• 2003

Thin tin oxide film with nano-size particle was prepared on silicon substrate by hydrothermal synthetic method and successive sol-gel spin coating method. The fabrication method of tin oxide film with ultrafine nano-size crystalline structure was tried to be applied to fabrication of micro gas sensor array on silicon substrate. The tin oxide film on silicon substrate was well patterned by chemical etching upto 5${\mu}{\textrm}{m}$width and showed very uniform flatness. The tin oxide film preparation method and patterning method were successfully applied to newly proposed 2-dimensional micro sensor fabrication.

• 한국정보디스플레이학회:학술대회논문집
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• 2009.10a
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• pp.310-311
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• 2009

New X-shaped crystalline molecules have been synthesized through various coupling reactions and their electronic properties were investigated. They exhibit good solubility in common organic solvents and good self-film forming properties. They are intrinsically crystalline as they exhibit well-defined X-ray diffraction patterns from uniform and preferred orientations of molecules. They also exhibited high field effect mobilities in thin film transistor (TFT) and good device performances.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2011.05a
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• pp.115-115
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• 2011

고성능 금속 커패시터 개발을 목적으로 aluminum film에 균일한 etch fit를 형성하는 연구를 진행하였다. Etch mask로 PI를 사용하여 Aluminum film에 균일한 형태의 etch fit를 형성하였다. 균일하게 에칭 된 aluminum film들은 capacitance를 측정하여 에칭 조건에 따른 capacitance 변화를 확인하였다.

• Korean Journal of Materials Research
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• v.21 no.10
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• pp.550-555
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• 2011

A high-quality CIGS film with a selenization process needs to be developed for low-cost and large-scale production. In this study, we used $Cu_2In_3$, CuGa and $Cu_2Se$ sputter targets for the deposition of a precursor. The precursor deposited by sputtering was selenized in Se vapor. The precursor layer deposited by the co-sputtering of $Cu_2In_3$, CuGa and $Cu_2Se$ showed a uniform distribution of Cu, In, Ga, and Se throughout the layer with Cu, In, CuIn, CuGa and $Cu_2Se$ phases. After selenization at $550^{\circ}C$ for 30 min, the CIGS film showed a double-layer microstructure with a large-grained top layer and a small-grained bottom layer. In the AES depth profile, In was found to have accumulated near the surface while Cu had accumulated in the middle of the CIGS film. By adding a Cu-In-Ga interlayer between the co-sputtered precursor layer and the Mo film and adding a thin $Cu_2Se$ layer onto the co-sputtered precursor layer, large CIGS grains throughout the film were produced. However, the Cu accumulated in the middle of CIGS film in this case as well. By supplying In, Ga and Se to the CIGS film, a uniform distribution of Cu, In, Ga and Se was achieved in the middle of the CIGS film.

• Transactions of Materials Processing
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• v.20 no.3
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• pp.250-256
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• 2011

Vacuum-assisted thermoforming is one of the critical steps for the successful application of film insert molding(FIM) to parts of complex shapes. If the thickness distribution of the formed film is non-uniform, cracking, deformation, warping, and wrinkling can easily occur at the injection molding stage. In this study, the effects of processing parameters, which include the film heating time, plug depth, plug speed and vacuum delay time, on film thickness distribution were investigated. It was found that the film thickness at the part sidewall decreases with increasing the film heating time and plug depth, but the thickness at the bottom was found to exhibit the opposite behavior. The film thickness of the sidewall was observed to increase at higher plug speed and vacuum delay time of 0 ~ 0.3sec.