• Restorative Dentistry and Endodontics
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• 제31권6호
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• pp.445-451
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• 2006

이 연구에서는 미세인장결합강도 실험과 주사전자현미경을 이용하여 unground enamel에 대한 all-in-one adhesive의 1회 또는 2회 적용에 따른 효과를 평가하였다. 발거된 하악 대구치의 설측 치관부를 사용하여 3개씩 5개의 군으로 분류하였다. SE군은 Clearfil$^{tm}$ SE Bond를 적용하였다. LP1 군, LP2 군은 Adper Prompt L-Pop$^{tm}$을 각각 1회 , 2회 적용하였다. XN1 군, XN2 군은 Xeno$^{R}$III를 각각 1회, 2회 적용하였다. 그런 다음 복합 레진 Z100을 적층 충전하였다. 법랑질 표면의 접착제를 아세톤으로 제거하고 주사 전자 현미경을 이용하여 산 부식 양상을 관찰하였다 미세인장결합강도 측정을 위해 표본을 절단하여 레진과 치아의 접착 계면이 1 mm$^2$이 되도록 하여 실험하였다. 실험의 결과는 One-way ANOVA를 사용해 분석한 다음 Duncan's post-hoc test로 사후 검정 하였다. 본 연구의 결과 all-in-one adhesive의 1회와 2회 적용간에는 유의한 차이가 나타나지 않았으며 two-step self-etching adhesive와 all-in-one adhesive의 산 부식 양상 모두 얕고 불규칙 하였다.

• 대한치과보존학회:학술대회논문집
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• 대한치과보존학회 2003년도 제120회 추계학술대회 제 5차 한ㆍ일 치과보존학회 공동학술대회
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• pp.618-618
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• 2003

The purpose of this study was to evaluate the etching effects and bond strength of total etching and self-etching adhesive system on unground enamel using scanning electron microscopy and microtensile bond strength test. The buccal coronal unground enamel from human extracted molars were prepared using low-speed deamond saw. Scotchbond Multi-Purpose(group CM), Clearfil SE Bond(group SE), or Adper Prompt L-pop(group LP) were applied to the prepared teeth, and resin compasite(Z-250) was built up incrementally. Resin tag formation were evaluated by scanning electron microscopy, after removal of enamel surface by acid dissolution and dehydration.(중략)

• Restorative Dentistry and Endodontics
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• 제29권3호
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• pp.273-280
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• 2004

The purpose of this study was to evaluate the etching effects and bond strength of total etching and self-etching adhesive system on unground enamel using scanning electron microscopy and microtensile bond strength test. The buccal coronal unground enamel from human extracted molars were prepared using low-speed diamond saw. Scotchbond Multi-Purpose (group SM). Clearfil SE Bond (group SE), or Adper Prompt L-Pop (group LP) were applied to the prepared teeth. and the blocks of resin composite (Filtek Z250) were built up incrementally. Resin tag formation was evaluated by scanning electron microscopy. after removal of enamel surface by acid dissolution and dehydration. For microtensile bond strength test. resin-bonded teeth were sectioned to give a bonded surface area of $1\textrm{mm}^2$. Microtensile bond strength test was perfomed. The results of this study were as follows. 1. A definite etching pattern was observed in Scotchbond Multi-Purpose group. 2. Self-etching groups were characterized as shallow and irregular etching patterns. 3. The results (mean) of microtensile bond strength were SM: 26.55 MPa, SE: 18.15 MPa, LP: 15.57 MPa. SM had significantly higher microtensile bond strength than 8E and PL (p < 0.05). but there was no significant differance between SE and PL.

• 대한소아치과학회지
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• 제10권1호
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• pp.85-93
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• 1983

In one group that tested for the effects of grinding and etching on the deciduous teeth, S.E.M. examination on the ground or unground labial surface of deciduous maxillary central incisors were made after etching procedure with 40% phosphoric acid for 60 secs., 120 secs., 180 sees. each. In another group that tested for the degree of resin penetration to the ground and etched deciduous teeth, composite resin application was done to the ground deciduous maxillary central incisors that had been acid-etched for 30 secs., 60 secs., 90 sees., 120 sees., 180 secs. each. The tooth-resin specimens were cut at the middle 1/3 of the crown by 2mm thickness, and the adjacent tooth materials were demineralized by 10% hydrochloric acid, the author observed the tags of the resin replica with S.E.M.. Following results were obtained. 1. After 40% phosphoric acid etching, the unground deciduous enamel surface showed various types of etching pattern. 2. For the formation of regular micropores on deciduous enamel surface by acid etching with 40% phosphoric acid, the time over 120 secs. should be requested. 3. After 40% phosphoric acid etching, the ground deciduous enamel surface showed the same etching pattern that has been a preferential removal of prism peripheries despite different etching time. 4. On the ground group that etched over 60 secs. to 180 secs., the length of tags was $5{\mu}m$ to $8{\mu}m$, with a mean of $7{\mu}m$.