• 대한방사선기술학회지:방사선기술과학
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• 제23권2호
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• pp.33-37
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• 2000

The authors fabricated ultrasonic transducer with PVDF[poly(vinylidene fluoride)] piezoelectric polymer film. When impulse waves were applied to the PVDF ultrasonic transducer, the dependence of the response properties on the backing material with copper was investigated through not only theoretical calculations using Mason's equivalent circuit but also experimental measurements. The experimental pulse response properties agree with those of the theoretical calculations and the pulses were shorter than those for a PZT transducer. If such short-pulse properties are used in an medical ultrasonic image diagnosis apparatus, the resolution of the apparatus will be improved. When the insertion loss was calculated theoretically to the PVDF ultrasonic transducer, the frequency characteristics of its showed wideband frequency.

• 산업기술연구
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• 제25권A호
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• pp.87-93
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• 2005

Three-dimensional ultrasonic probes being applied to the medical imaging can be grouped into three depending on the scanning methods, which are a mechanical type system, a free-hand system, and 2D phased arrays system. A mechanical type scanner uses a mechanically driven transducer to acquire series of 2D plane images. By integrating these images, a 3-D medical image can be constructed. A motor driving mechanism is a conventional choice for mechanically driving a transducer assembly which picks the raw ultrasonic images up. In this paper we attempt to design a 3D ultrasonic probe which has a operating mechanism of s tilting 3-D scanning. The motion of a transducer assembly of the ultrasonic probe is analytically modelled. We propose a selection procedure for the diameter of a wire rope driving the transducer assembly and the size of torsional spring which gives an initial tension to wire ropes.

• 비파괴검사학회지
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• 제14권2호
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• pp.112-121
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• 1994

초음파 C-scan 기법에 의해 스폿(spot)용접의 품질 평가를 위한 비파괴진단 평가에 관한 기초적인 실험적 검토를 하였다. 먼저, 스폿용접부 초음파탐상에 앞서 뉴우톤링의 모델링 실험을 통해 미소 간극을 갖는 접합계면에서의 초음파 반사 거동의 해석 결과를 근거로 스폿용접부의 너겟 형상과 크기, void 결함등의 정량적 평가와 corona bond의 정확한 식별에 최적한 초음파시험방법 및 조건의 설정을 시도하였다. 초음파시험 후 용접시험편을 절단하고, 그 절단면을 초음파현미경(SAM)과 광학현미경의 단면 관찰을 통해 스폿용접 품질 평가를 위한 초음파 비파괴평가법의 유용 가능성 유무, 적용 한계 등을 검토하였다. 그 결과 본 실험에 사용한 집속 초음파탐촉자(25MHz)에 의한 너겟 내부에 존재하는 void 크기의 검출한계는 $10{\mu}m$였으며 너겟 크기는 초음파시험의 경우가 최대 1mm정도 크게 측정되어 corona bond의 정확한 식별과 너겟 직경의 정량적 평가에 접근하기 위해서는 초음파 C-scan 데이터의 각종 화상 처리 기술의 적용에 의한 corona bond부의 명확한 식별 방법에 대한 연구 검토가 요망됨을 알 수 있었다.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2000년도 추계학술대회논문집B
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• pp.633-638
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• 2000

Ultrasonic applications for the enhancement of turbulence flow by using the PIV measurement were carried out according to the angle of the ultrasonic oscillator, materials of the reflector and each section when ultrasonic is reflected several times. Angles of the ultrasonic oscillator such as $30^{\circ},\;45^{\circ},\;60^{\circ},\;90^{\circ},\;120^{\circ},\;135^{\circ}$ and $150^{\circ}$ were selected, and turbulent intensities were compared at Reynolds No. 2,000 and 4,000. Materials of the reflector such as wood, acryl, iron and glass were selected, and time mean velocity vector and turbulent intensity were compared at Reynolds No. 4,000. The zone which was observed was selected from first section to fourth section when ultrasonic was reflected several times. Every data such as time mean velocity vector and time mean turbulent intensity which was obtained by PIV measurement was examined, compared and discussed at Reynolds No. 2,000 and 4,000 to know the degree of turbulence enhancement in each case.

• 대한의용생체공학회:학술대회논문집
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• 대한의용생체공학회 1997년도 춘계학술대회
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• pp.119-122
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• 1997

In this paper, we represented the variation of heart cavity area in the space domain by 3-d rendering. We arranged the 2-d sequence of ultrasonic image acquired in the time domain as volumetric data, and extracted heart cavity region from 3-d data. For the segmentation of 3-d volume data, we extracted the cavity region using the method of expanding the cavity region that is same statistical property. By shading which is using light and object normal vector, we visualized the volume data on image plane.

• Journal of Mechanical Science and Technology
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• 제15권1호
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• pp.52-60
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• 2001

In this paper, as a new measurement method to estimate the change of material condition, the simplified ultrasonic CT system, which uses the information of three directions, that is, $90^{\circ}$, $+45^{\circ}C$and $-45^{\circ}C$ about inspection plane is proposed. Use of simplified CT system has two merits: Firstly, the measurement time is very short compared with general CT. Secondly, it can detect sensitively small defect in vertical or slant direction about inspection plane because the obtained image is CT image calculated from three directions. From these merits, this method can be considered as an effective method to evaluate material conditions. The basic performance of the proposed method was confirmed through several specimens with several simple defects. In order to confirm the applicability of actual NDT, several kinds of welded specimens are investigated. The result showed that the CT image obtained had good agreement with actual defect of specimens.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2002년도 추계학술대회 논문집
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• pp.345-350
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• 2002

In this study, researchers classifying the artificial flaws in semiconductor packages are performed by pattern recognition technology. For this purposes, image pattern recognition package including the user made software was developed and total procedure including ultrasonic image acquisition, equalization filtration, binary process, edge detection and classifier design is treated by Backpropagation Neural Network. Specially, it is compared with various weights of Backpropagation Neural Network and it is compared with threshold level of edge detection in preprocessing method fur entrance into Multi-Layer Perceptron(Backpropagation Neural network). Also, the pattern recognition techniques is applied to the classification problem of defects in semiconductor packages as normal, crack, delamination. According to this results, it is possible to acquire the recognition rate of 100% for Backpropagation Neural Network.

• 전자공학회논문지B
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• 제28B권10호
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• pp.822-830
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• 1991

In this paper, we propose a new process for ultrasonic B-mode image considering the sound field effects of a concave circuit focused transducer, and aim to remove the speckle pattern which cause the blurring on boundary in ultrasonic B-mode image. We discuss in detail the conception of speckle pattern generation, and the frequency compounding method which is applied to the process for getting a speckle reduced B-mode image. Through the computer simulation, we define the meaning of speckle region, and show the results of reduced speckle pattern. It is discovered in the results that the frequency compounding method is very effective for boundary detection and that the application of the method is limited by various conditions.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2005년도 추계학술대회 논문집
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• pp.721-726
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• 2005

In this study, researchers classifying the artificial flaws in semiconductor. packages are performed by pattern recognition technology. For this purposes, image pattern recognition package including the user made software was developed and total procedure including ultrasonic image acquisition, equalization filtration, binary process, edge detection and classifier design is treated by Backpropagation Neural Network. Specially, it is compared with various weights of Backpropagation Neural Network and it is compared with threshold level of edge detection in preprocessing method for entrance into Multi-Layer Perceptron(Backpropagation Neural network). Also, the pattern recognition techniques is applied to the classification problem of defects in semiconductor packages as normal, crack, delamination. According to this results, it is possible to acquire the recognition rate of 100% for Backpropagation Neural Network.

• 한국추진공학회:학술대회논문집
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• 한국추진공학회 2006년도 제26회 춘계학술대회논문집
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• pp.264-267
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• 2006

초음파를 이용한 다층 후판 복합재 패널의 비파괴 검사에서 상층부의 신호간섭효과는 결함판정을 보다 어렵게 만드는 중대한 요인으로 작용한다. 이러한 문제를 해결하기 위해, 본 연구에서 초음파 C-Scan 이미지에 영향을 미치는 복합재 상층 패널의 신호간섭을 제거할 수 있는 이미지 향상기법을 제안하였다. 이는 수집된 초음파 수신신호를 보정신호를 이용해 정규화하고 그 결과 신호를 C-Scan 이미지로 재구성하는 기법으로 본 논문에서는 이미지 향상기법의 제안과 그 실험적 성능검증에 대하여 논하였다. 복합재 상층 패널의 계면효과를 제거하기 위해 인공결함을 내재시킨 세 개의 결함시험편을 제작하고, 이들 시험편에서 C-Scan 이미지를 실험적으로 획득하였다. 그리고, 개발된 이미지 보정기법을 적용하였는데, 제안된 기법이 이미지 개선알고리즘으로 실용적 적용성이 충분함을 입증하는 결과를 얻었다.