• 제목/요약/키워드: Ultrasonic Nondestructive testing

검색결과 552건 처리시간 0.016초

초음파 Spectrum 해석에 의한 Creep 손상재의 비파괴평가 (Nondestructive Evaluation of Creep Damage Materials by using Ultrasonic Spectrum Analysis)

  • 김창일;이원;임영호
    • 비파괴검사학회지
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    • 제11권2호
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    • pp.42-47
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    • 1991
  • Nondestructive evaluation study was made on creep damage materials by ultrasonic spectrum analysis. The evaluation methods was developed in order to predict the change of ultrasonic attenuation with increasing creep damage. A new algorithm for the improvement of measuring accuracy of ultrasonic attenuation using a spectrum analysis has been developed. Normally, the ultrasonic attenuation is evaluated from 1st and 2nd peak values of the pulse-echo ultrasonic wave. The algorithm developed is incorporated in a measuring system which consists of a personal computer with ultrasonic apparatus and a digital storage oscilloscope. By the spectrum analysis method, it become popssible to describe approximately the attenuation change with increassing creep damage in Cr-Mo-V forging.

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Two-Dimensional Numerical Modeling and Simulation of Ultrasonic Testing

  • Yim, Hyun-June;Baek, Eun-Sol
    • 비파괴검사학회지
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    • 제22권6호
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    • pp.649-658
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    • 2002
  • As an attempt to further improve the reliability and effectiveness of ultrasonic testing (UT), a two-dimensional numerical simulator of UT was developed. The simulator models the wave medium (or test object) using the mass-spring lattice model (MSLM) that consists of mass-points and springs. Some previous simulation results, obtained by using MSLM, are briefly reviewed in this paper, for propagation, reflection, and scattering of ultrasonic waves. Next, the models of transmitting and receiving piezoelectric transducers are introduced with some numerical results, which is a main focus of this paper. The UT simulator, established by combining the transducer models with the MSLM, was used to simulate many UT setups. In this paper, two simple setups are considered as examples, and their simulated A-scan signals are discussed. The potential of the MSLM, transducer models, and the UT simulator developed in this study to be used in the actual UT is confirmed.

Ultrasonic Examination of Thick Austenitic Stainless Steel Welds and Factors Influence the Sensitivity

  • Palaniappan, M.;Subbaratnam, R.
    • 비파괴검사학회지
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    • 제23권4호
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    • pp.372-379
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    • 2003
  • The problems encountered by ultrasonic testing of austenitic stainless steel weld joints are discussed in the paper. Due to low thermal conductivity and the occurrence of single phase between the melting point and the room temperature, coarse and oriented grains are formed in such weld metals more in thick sections. This leads to higher scattering at the grain boundaries and low signal to noise ratio, and extensive beam skewing. Experimental results to understand these problem are explained.

초음파탐상(超音波探傷)에서의 감도차(感度差) 측정(測定) 연구(硏究) (Study on the Sensivivity Difference Measurement by Ultrasonic Testing)

  • 정용무;안희성;이연필
    • 비파괴검사학회지
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    • 제2권1호
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    • pp.5-9
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    • 1982
  • Experiments were performed according to ultrasonic attenuation measurement and comparison method of DAC curve to analyze the difference between PSI and 2nd ISI ultrasonic testing results. Smaller error was found by comparison method of DAC curve, and that method was more useful practically.

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초음파를 이용한 Al/Al 하니캄 구조물의 Disbonding 검출에 관한 연구 (A Study on the Disbonding Detection of Al/Al Honeycomb Sandwich Structures by Ultrasonic Methods)

  • 조경식;이주석;장홍근;이승희
    • 비파괴검사학회지
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    • 제10권1호
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    • pp.29-37
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    • 1990
  • In this study the disbonding tests of adhesively bonded Al/Al honeycomb structures were performed by ultrasonic methods. Ultrasonic C-scan squiter method and ultrasonic surface wave attenuation measuring method were applied for the detection of skin/core disbonding. The bonding quality of Al/Al honeycomb structures could be well evaluated by properly controlled ultrasonic parameters.

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SAFT Based Imaging and Centroid Technique for Classification of UT Signals from the Steam Generator of a Nuclear Power Plant

  • Kim, Dae-Won
    • 비파괴검사학회지
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    • 제28권3호
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    • pp.263-272
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    • 2008
  • Many technical methods are used for nondestructive testing field for solid materials. Among those, ultrasonic inspection methods are widely used and one of the popular methods involves the extraction of an appropriate set of features followed by the use of a neural network for the classification of the signals in the feature space. This paper describes an approach which uses LMS method to determine the coordinates of the ultrasonic probe followed by the use of SAFT with centroid technique to estimate the location of the ultrasonic reflector. The method is employed for classifying UT-NDE signals from the steam generator tubes in a nuclear power plant. The classification results are presented for the ultrasonic signals from cracks and deposits within steam generator tubes.

초음파(超音波) 탐상법(探傷法)에 의(依)한 용접부(熔接部)의 결함(缺陷)높이 측정(測定)에 관한 연구(硏究) (Consideration on the Experimental Measurement of Flaw Height of Welds by Ultrasonic Testing)

  • 안일영;임동규;한응교
    • 비파괴검사학회지
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    • 제2권1호
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    • pp.10-16
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    • 1982
  • This study was carried out to measure the flaw height of welds in consideration of the effective probe angle in ultrasonic oblique detection. Specimens with inserted artificial flaws were made and flaw heights were estimated from detecting these specimens. Two different methods were applied to estimate flaw heights. From the result of the experiment, flaw height could be measured within the accuracy of 15% percent error and the difference between the probe distance method and beam path method is about 5% relatively small. It is considered that the results obtained this experimental study could be helpful informal ions for measuring flaw height.

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디지탈 초음파 화상처리에 의한 반도체 패키지의 미소결함 검출에 관한 연구 (A Study on the Microdefect Detection of Semiconductor Package by Digital Ultrasonic Image Processing)

  • 김재열;한응교
    • 비파괴검사학회지
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    • 제10권2호
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    • pp.43-49
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    • 1990
  • Ultrasonic testing is one of the most useful NDT method for detection of microdefect in the opaque materials. Recently, many applications of the ultrasonic techniques have been extended widely in the new field like electron is and advanced materials. From the result of the experiment, we have hardly found out a crack in the internal parts of the resin and a delamination between chip and resin because of poor performance of the system.

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