• Journal of the Microelectronics and Packaging Society
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• v.22 no.1
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• pp.35-41
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• 2015

In this study, in order to improve the reliability of ACF interconnections, solder ACF joints were investigated interms of solder joint morphology and solder wetting areas, and evaluated the electrical properties of Flex-on-Board (FOB) interconncections. Solder ACF joints with the ultrasonic bonding method showed excellent solder wetting by broken solder oxide layers on solder surfaces compared with solder joints with remaining solder oxide layer bonded by the conventional thermo-compression (TC) bonding method. When higher target temperature was used, Sn58Bi solder joints showed concave shape due to lower degree of cure of resin at solder MP by higher heating rate. ACFs with epoxy resins and SAC305 solders showed lower degree of resin cure at solder MP due to the slow curing rate resulting in concave shaped solder joints. In terms of solder wetting area, solder ACFs with $25-32{\mu}m$ diameters and 30-40 wt% showed highest wetted solder areas. Solder ACF joints with the concave shape and the highest wetting area showed lower contact resistances and higher reliability in PCT results than conventional ACF joints. These results indicate that solder morphologies and wetting areas of solder ACF joints can be controlled by adjustment of bonding conditions and material properties of solder and polymer resin to improve reliability of ACF joints.

• Proceedings of the KSME Conference
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• 2001.06a
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• pp.609-615
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• 2001

This study proposes analysis and evaluation method of time series ultrasonic signal using attractor analysis for fusion joint part of polyethylene piping. Quantitatively characteristics of fusion joint part is analysed features extracted from time series. Trajectory changes in the attractor indicated a substantial difference in fractal characteristics. These differences in characteristics of fusion joint part enables the evaluation of unique characteristics of fusion joint part. In quantitative fractal feature extraction, feature values of 4.291 in the case of debonding and 3.694 in the case of bonding were proposed on the basis of fractal dimensions. In quantitative quadrant feature extraction, 1,306 point in the case of bonding(one quadrant) and 1,209 point(one quadrant) in the case of debonding were proposed on the basis of fractal dimensions. Proposed attractor feature extraction can be used for integrity evaluation of polyethylene piping material which is in case of bonding or debonding.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2008.11a
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• pp.419-420
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• 2008

• Journal of the Korean Society for Nondestructive Testing
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• v.27 no.3
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• pp.268-279
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• 2007

The reliability of cold-bonding repair technique of carbon-fiber reinforced plastics (CFRP) laminates, often used as a temporary repair for the airplane maintenance, has been evaluated during cyclic loading and localized heating by nondestructive methods. Major concern was given to the evolution of damage after repair in the form of delaminations due to localized heating and cyclic loading combined. An area of interest both on the specimen repaired by cold-bonding and the specimen without repair where delaminations were induced by localized heating and cyclic loading was monitored by acoustic emission (AE) testing and further examined by pitch-catch low-frequency bond testing, and pulse-echo high-frequency ultrasonic testing. The results showed that the reliability of cold-bonding repair would be significantly reduced by the localized heating and cyclic loading combined rather than by the cyclic loading only. AE monitoring appeared to be an effective and reliable tool to monitor the integrity of temporarily repaired CFRP laminates in terms of the structural health monitoring (SHM) philosophy.

• Advanced Composite Materials
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• v.18 no.3
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• pp.221-232
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• 2009

The allylamine plasma treatment is used to modify the surface properties of vapor grown carbon fibers (VGCF). It is to improve the interfacial bonding between the VGCF and epoxy matrix. The allylamine plasma process was performed by batch process in a vacuum chamber, using gas injection followed by plasma discharge for the durations of 20, 40 and 60 min. The interdependence of mechanical properties on the VGCF contents, treatment time and interfacial bonding between VGCF/ep was investigated. The interfacial bonding between VGCF and epoxy matrix was observed by scanning electron microscopy (SEM) micrographs of nanocomposites fracture surfaces. The changes in the mechanical properties of VGCF/ep, such as the tensile modulus and strength were discussed. The mechanical properties of allylamine plasma treated (AAPT) VGCF/ep were compared with those of raw VGCF/ep. The tensile strength and modulus of allyamine plasma treated VGCF40 (40 min treatment)/ep demonstrated a higher value than those of other samples. The mechanical properties were increased with the allyamine plasma treatment due to the improved adhesion at VGCF/ep interface. The modification of the carbon nanofibers surface was observed by transmission electron microscopy (TEM). SEM micrographs showed an excellent dispersion of VGCF in epoxy matrix by ultrasonic method.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2001.10a
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• pp.139-143
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• 2001

In manufacturing process of semiconductor package, thermal stress owing to high temperature in moulding and bubbles generated in chip bonding process become main causes to producing void. Therefore, on this study we evaluated quantitatively void size by ultrasonic spectroscopy method which analyze the frequency of this received pulse using pulses with broad band frequency, and after destructive test we verified effectiveness of sizing void by ultrasonic spectroscopy as we find error degree between the real size of void and the sizing void by ultrasonic spectroscopy.

• Proceedings of the KWS Conference
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• 2000.04a
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• pp.283-286
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• 2000

• Proceedings of the KWS Conference
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• 2005.06a
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• pp.34-36
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• 2005

Copper wire bonding is an alternative interconnection technology that serves as a viable and cost saving alternative to gold wire bonding. In this paper, ultrasonic wedge bonding with $25{\mu}m$ copper wire on Au/Ni/Cu metallization of a PCB substrate was performed at ambient temperature. The central composite design of experiment (DOE) approach was applied to optimize the copper wire wedge bonding process parameters. After that, pull test of the wedge bond was performed to study the bond strength and to find the optimum bonding parameters. SEM was used to observe the cross section of the wedge bond. The pull test results show good performance of the wedge bond. Additionally, DOE results gave the optimized parameter for both the first bond and the second bond. Cross section analysis shows a continuous interconnection between the copper wire and Au/Ni/Cu metallization. The diffusion of Cu into the Au layer was also observed.

• Journal of Welding and Joining
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• v.22 no.5
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• pp.32-37
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• 2004

Application of bonding by adhesives can be found in many industries, particularly in advanced technological domains such as aeronautical and space, automobile and electronics industries. Periodic inspection with conventional ultrasonic NDE techniques is capable of indicating the presence and possible location of crack. Continuous ultrasonic attenuation monitoring has potential to supply information. This article discusses the use of pulse-echo ultrasonic testing for the inspection of adhesive bonds between metal sheets. The method is based on the measurement of the reflection coefficient at the metal/adhesive interface. By means of a control experiment it is shown that Quantitative Nondestructive Evaluation in Adhesive Joints are evaluated together with Ultrasonic Testing and Fracture Testing.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.6 no.3
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• pp.73-81
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• 1997

This study was to find the best adhesive condition comparing mechanical property in case of hot-melt adhesion using glue-gun, ultrasonic welding with adhesion and only ultrasonic welding in order to adhere thermoplastic resin of polyethylene (PE) in which reliable adhesion was resulted in case of ultrasonic welding with same materials of PE. The best welding condition were acquired at welding time 1 second, welding pressure 250kPa for PE-PE where welding time and welding pressure were increased in accordance with the increase of material strength. At the best ultrasonic welding conditions, bonding strength of PE-PE welding was about 21MPa of which material have tensile strength of 24MPa. Through the analysis of microscophic test for ultrasonic welding structure, it was distinguished between well welded structure with higher intermolecule flow and bad welded structure with lower flow, of which result is mostly correspond with the result of tensile strength test.