• Transactions of the Korean Society of Machine Tool Engineers
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• v.11 no.5
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• pp.65-72
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• 2002

In this study, actuator, sensor, guide, power transmission element and control method are considered for ultra-precision positioning apparatus. Through previous process, single plane X-Y stage with ultra-precision positioning is manufactured. Global stage for the purpose of materialization with robust system, is combined by using AC servo motor and ball screw and rolling guide. And ultra-precision positioning system is developed by micro stage with elastic hinge type and piezo element. global servo and micro servo for the purpose of materialization positioning accuracy with nm(nanometer) are controlled simultaneously by using incremental encoder and laser interferometer as displacement measurement sensor. Through previous process, ultra-precision positioning system(100mm stroke and $\pm$ l0nm positioning accuracy) with single plane X-Y stage are materialized.

• Transactions of Materials Processing
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• v.27 no.4
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• pp.244-249
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• 2018

Rhodium is a representative platinum group material. Rhodium is used in several industrial fields including jewelry, chemical reaction catalyst, electric component etc. In recently, ultra-fine rhodium wire has been applied to the pins of probe card used to test a semiconductor. In this study, in order to produce a fine rhodium wire with the diameter of $50{\mu}m$, a fine rhodium wire drawing process was designed. After design of the fine wire drawing process by using a uniform reduction ratio theory, finite element analysis was performed. Finally, fine wire drawing experiment was performed to verify the effectiveness of the designed process.

• Proceedings of the KWS Conference
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• 2002.10a
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• pp.776-780
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• 2002

This paper describes the concept and the characteristics of hyper interfacial bonding developed as a new concept joining process for UFG (ultra-fine grained) steel. Hyper interfacial bonding process is characterized by instantaneous surface melting bonding which involves a series of steps, namely, surface heating by high frequency induction, the rapid removing of heating coil and joining by pressing specimens. UFG steels used in this study have the average grain size of 1.25 ${\mu}{\textrm}{m}$. The surface of specimen can be rapidly heated up and melted within 0.2s. Temperature gradient near heated surface is relatively steep, and peak temperature drastically fell down to about 1100K at the depth of 2~3mm away from the heated surface of specimen. Bainite is observed near bond interface, and also M-A (martensite-austenite) islands are observed in HAZ. Grain size increases with increasing heating power, however, the grain size in bonded zone can be restrained under 11 ${\mu}{\textrm}{m}$. Hardened zone is limited to near bond interface, and the maximum hardness is Hv350~Hv390.

• Journal of the Microelectronics and Packaging Society
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• v.10 no.2
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• pp.61-67
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• 2003

The interfacial reaction between ultra-small 58Bi-42Sn solder and Au/Ni/Ti under bump metallurgy (UBM) for ultra-fine flip chip application was investigated. The ultra-small 58Bi-42Sn solder bump, about $46{\mu}m$ in diameter, was fabricated by using the lift-off method and reflowed using the rapid thermal annealing (RTA) system. The intermetallic compounds were characterized using a secondary electron microscopy (SEM), an energy dispersive spectroscopy (EDS), and an x-ray diffractometer (XRD). The faceted and polygonal intermetallic compounds were found in the Bi-Sn solder bumps on $Au(0.1{\mu}m)/Ni/Ti$ UBM and they were indentified as $(Au_xBi_yNi_{1-x-y})Sn_2$ Phase. The intermetallic compounds grown from the $Au(0.1{\mu}m)/Ni/Ti$ UBMinterface were dispersed in the solder bump.

• Journal of the Korean Society for Precision Engineering
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• v.31 no.11
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• pp.969-974
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• 2014

Previously fabricated electronic devices were used for vacuum manufacturing processes such as conventional semiconductor manufacturing. However, they are difficult to apply to continuous processes such as roll-to-roll printing, which results in very high device manufacturing and processing costs. Therefore, many developers have been interested in applying continuous processes to contact printing or noncontact printing technologies and they proposed various continuous printing techniques instead of conventional batch coating. In this paper, we proposed improved gravure offset printing process as one of the contact printing technique. We used etching pattern geometry with soft core blanket roll for printing of ultra fine line below the 10um.Using this technique we obtained flexible metal grid mesh film as transparent conductive film.

• Journal of the Korean Society of Propulsion Engineers
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• v.8 no.1
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• pp.1-7
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• 2004

The precipitation of ultra fine ammonium perchlorate(UFAP) crystals from the N-methyl pyrrolidone(NMP) solutions of ammonium perchlorate(AP) was studied. The characteristics of the precipitated crystals were investigated by means of scanning electron micrograph(SEM), X-ray diffraction(XRD), and thermogravimetric analysis(TGA). When chloroform, methylene chloride and toluene were the precipitants, the product crystals had a mean particle size less than 2$\mu\textrm{m}$. The crystallographical property and thermal decomposition behavior of the prepared UFAP were almost the same as those of the commercial AP.

• Journal of the Korean Ceramic Society
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• v.29 no.12
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• pp.997-1003
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• 1992

Ultra-fine hydroxyapatite powders were synthesized by the hydrothermal reaction of Ca(OH)2 suspension or Ca(NO3)2$.$4H2O solution with (NH4)2HPO4 solution, and the powders were characterized for each synthetic condition. Crystalline hydroxyapatite powders have average grain size of less than 50 nm. By increasing the reaction pressure, the crystallinity was improved, and the crystals were preferentially growing along c-axis. When Ca(NO3)2$.$4H2O of high solubility was used, hydroxyapatite of single phase was produced. However when Ca(OH)2 of low solubility was used more than 0.334 mol/ι, unreacted Ca(OH)2 remained. Diffraction spot patterns of transmission electron microscope show that powders synthesized by the hydrothermal reaction were composed of single crystals of hexagonal phase.

• Transactions of Materials Processing
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• v.11 no.3
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• pp.255-261
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• 2002

The grain size of 7010 Al alloy was refined to submicrometer level by using equal channel angular pressing (ECAP) and additional warm rolling. The mechanisms of grain refinement in ECAP process were fragmentation of coarse grain to ultra fine subgrains after a few passes and continuous recrystallization of the subgrains with the increase o( passes. Because of ultrafine grain size, essentially low temperature and high strain rate superplasticity was observed after ECAP process and warm rolling to form a sheet metal. The maximum elongation of 700% was obtained for an ECA pressed specimen after IS passes without warm rolling at $450^{\circ}C$ with strain rate of 5x$10^{-3}$/sec.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2006.05a
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• pp.215-218
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• 2006

A study was made to investigate microstructural evolution and mechanical properties of ultra-fine grained (UFG) pure-Ti produced by equal channel angular (ECA) pressings. The deformed structures were analyzed by finite element method and transmission electron microscopy with the increment of straining. After 4 isothermal ECA pressings, initial coarse grains ($30{\mu}m$) were significantly refined to ${\sim}0.3{\mu}m$ with homogeneous distribution of microstructure which was resulted from $180^{\circ}$ rotation of the sample between pressings. UFG pure-Ti exhibited the considerable improvement in yield strength while losing strain hardening capacity as compared to coarse grained microstructure at ambient temperature, which was mainly attributed to ultra-fine grain microstructure with non-equilibrium grain boundaries.

• Proceedings of the Korean Society For Composite Materials Conference
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• 1999.11a
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• pp.177-182
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• 1999

사용한 보수.보강재, Rod, Fabric, Strand 형상을 콘크리트 구조물등에 보강재로 사용되어왔다. 이 재료는 해양환경하에서 내식성과 내구성을 갖는 철근및 철골대체용 복합소재와 초고층 경량 연속섬유보강 시멘트 복합재료는 탄소섬유, 아라미드섬유, 유리섬유등의 쉬트(sheet)형상을 신건재, 비자성, 비전도성, 전파차폐용 재료등에 사용할수있다. 그러나 FRP Rod를 내식성이 요구되는 철근 및 철골대체재로 사용할 경우에는 폴리머 매트릭스의 열화, 섬유와 폴리머간 계면 접착강도의 한계, 화재시 내화성, 보강재의 인발성등의 단점들을 갖고있다[1]. (중략)