• Title/Summary/Keyword: Ultra-Precision Technology

Search Result 348, Processing Time 0.029 seconds

A Study on the Machinability of Electroless Nickel by the Ultra-Precision Diamond Turning (초정밀 다이아몬드 터닝에 의한 무전해 니켈의 피삭성 연구)

  • 김우순;김동현;난바의치
    • Journal of the Korean Society for Precision Engineering
    • /
    • v.21 no.8
    • /
    • pp.27-33
    • /
    • 2004
  • The ultra-precision cutting is a key technique for the manufacture of optical components such as aluminium mirrors, electroless nickel mirror, plastic mirror in a variety of advanced science and technology applications. The paper presents experimental results of ultra-precision diamond fuming of electroless nickel materials. In general, the cutting condition such as feed rate and depth of rut, have effect on the surface roughness in ultra-precision diamond turning. To obtain an optimal cutting condition, we studied the effect of the cutting speed. the tool length, the tool nose radius, the feed rate and depth of cut on the surface roughness. So, the relationship of the surface roughness and cutting condition has been clarified. From the experimental results, the machined surface roughnesses were obtained less than 1nm rms.

Real-time Motion Error Time and the Thermal Error Compensation of Ultra Precision Lathe (초정밀 가공기의 실시간 운동오차 및 열변형오차 보상)

  • Kwac Lee-Ku;Kim Hong-Gun;Kim Jae-Yeol
    • Transactions of the Korean Society of Machine Tool Engineers
    • /
    • v.15 no.4
    • /
    • pp.44-48
    • /
    • 2006
  • Recently, demand the ultra precision product which is increasing rapidly is used extensively frontier industry field such as semi-conductor, computer, aerospace, precision machine. Ultra precision processing is the portion that is very needed to NT in the field of mechanical engineering. The latest date, together with radical advancement of electronic and photonics industry, necessity of ultra precision processing is on the increase for the manufacture of various kernel parts those are connected with these industrial fields. Specially, require motion accuracy of high resolution of nm order in stroke of hundreds millimeters according as diameter of processing object great and processing accuracy rises. In this case ,the response speed absolute delay because inertial mass of moving part is very large. Therefore, real time motion error compensation becomes very hardly. In this paper, we used ultra precision cutting unit(UPCU) to cope such problem. a UPCU is designed and tested to obtain sub-micrometer from accuracy in diamond turning of flat surfaces. The thermal growth spindle error is compensated for real time using a UPCU driven by piezoelectric actuator along with a laser encoder displacement sensor.

Stability Analysis According to Material Alteration on Micro Stage for Micro Cutting Machine (재질 변화에 따른 초정밀가공기용 마이크로 스테이지의 안정성 해석)

  • 김재열;곽이구;김항우
    • Transactions of the Korean Society of Machine Tool Engineers
    • /
    • v.12 no.3
    • /
    • pp.52-57
    • /
    • 2003
  • In this paper, stability of ultra precision cutting unit is analyzed and this unit is the kernel unit in ultra precision processing machine. According to alteration of shape and material about hinge, stability investigation is performed Through this stability investigation, trial and error is reduced in design and manufacture, at the same time, we are accumulated foundation data for unit control.

Evaluation on the Optimum Grinding of Aspheric Surface Micro Lens for Camera Phone (휴대폰 카메라용 비구면 마이크로 렌즈 최적 연삭가공 평가)

  • Baek Seung-Yub;Lee Eun-Sang
    • Transactions of the Korean Society of Machine Tool Engineers
    • /
    • v.15 no.2
    • /
    • pp.1-9
    • /
    • 2006
  • As consumers in optics, electronics, aerospace and electronics industry grow, the demand for ultra-precision aspheric surface lens increases higher. To enhance the precision and productivity of ultra precision aspheric surface micro lens, the development of ultra-precision grinding system and process for the aspheric surface micro lens are described. In the work reported in this paper, an ultra-precision grinding system for manufacturing the aspheric surface micro lens was developed by considering the factors affecting the ground surface roughness and profile accuracy. This paper deals with mirror grinding of an aspheric surface micro lens by resin bonded diamond wheel and spherical lens of BK7. The optimization of grinding conditions on ground surface roughness and profiles accuracy is investigated using the design of experiments.

Selection of optimal machining condition for productivity enhancement of aspheric surface lens (비구면 렌즈의 생산성 향상을 위한 최적가공조건선정)

  • Baek S.Y.;Lee H.D.;Kim S.C.;Lee E.S.
    • Proceedings of the Korean Society of Precision Engineering Conference
    • /
    • 2006.05a
    • /
    • pp.561-562
    • /
    • 2006
  • To enhance the precision and productivity of ultra precision aspheric surface micro lens, the development of ultra-precision grinding system and process for the aspheric surface micro lens are described. In the work reported in this paper, an ultra-precision grinding system for manufacturing the aspheric surface micro lens was developed by considering the factors affecting the grinding surface roughness and profile accuracy. This paper deals with mirror grinding of an aspheric surface micro lens by resin bonded diamond wheel and spherical lens of BK7. The optimization of grinding conditions on ground surface roughness and profiles accuracy is investigated using the design of experiments.

  • PDF

Ultra-precision Free-form Surface Grinding of WC Core (초경 금형의 자유 곡면 초정밀 연삭)

  • Park, Soon-Sub;Hwang, Yeon;Kim, Geon-Hee;Won, Jong-Ho
    • Journal of the Korean Society for Precision Engineering
    • /
    • v.26 no.5
    • /
    • pp.64-71
    • /
    • 2009
  • Cylindrical lens core for optical transceiver was designed and machined. With the lens design data, WC asymmetric core surface data were generated for non-revolutional ultra-precision grinding. Grinding process for optimum machining conditions of target surface was studied in terms of surface roughness and form profile. We used experimental results to optimize turbine speed, feed-rate and depth of cut with durable grinding wheel wear. Ground WC cores were measured contact type profilers and verified.

Research on ultra-precision fine-pattern machining through single crystal diamond tool fabrication technology (단결정 다이아몬드공구 제작 기술을 통한 초정밀 미세패턴 가공 연구)

  • Jung, Sung-Taek;Song, Ki-Hyeong;Choi, Young-Jae;Baek, Seung-Yub
    • Design & Manufacturing
    • /
    • v.14 no.3
    • /
    • pp.63-70
    • /
    • 2020
  • As the consumer market in the VR(virtual reality) and the head-up display industry grows, the demand for 5-axis machines and grooving machines using on a ultra-precision machining increasing. In this paper, ultra-precision diamond tools satisfying the cutting edge width of 500 nm were developed through the process research of a focused ion beam. The material used in the experiment was a single-crystal diamond tool (SCD), and the equipment for machining the SCD used a focused ion beam. In order to reduce the influence of the Gaussian beam emitted from the focused ion beam, the lift-off process technology used in the semiconductor process was used. 2.9 ㎛ of Pt was coated on the surface of the diamond tool. The sub-micron tool with a cutting edge of 492.19 nm was manufactured through focused ion beam machining technology. Toshiba ULG-100C(H3) equipment was used to process fine-pattern using the manufactured ultra-precision diamond tool. The ultra-precision machining experiment was conducted according to the machining direction, and fine burrs were generated in the pattern in the forward direction. However, no burr occurred during reverse machining. The width of the processed pattern was 480 nm and the price of the pitch was confirmed to be 1 ㎛ As a result of machining.

A Study of Micro Machining Using Ultra Precision Machine (초정밀 가공기 제작을 통한 미세가공에 관한 연구)

  • 김석원;김상기;정우섭;이채문;이득우
    • Proceedings of the Korean Society of Precision Engineering Conference
    • /
    • 2004.10a
    • /
    • pp.97-100
    • /
    • 2004
  • In recent years, a demand for micro-structure machining is increasing by the development of information and optics industries. Micro machining technology is in general well known in the field of lithograghy. However, the requirement of producing micro machine and/or micro mechanism with metal materials will be increased since a variety of workpiece configurations can be easily made. In this paper, ultra precision machine is developed to obtain micro groove and mirror surface using single crystal diamond tool. According to the cutting experiment, no burr was found at the edge of V-grooves, and the surface roughness of copper is about 1~3nm Ra. It is verified that ultra precision machine is effective to high precision machining.

  • PDF

ISB Bonding Technology for TSV (Through-Silicon Via) 3D Package (TSV 기반 3차원 반도체 패키지 ISB 본딩기술)

  • Lee, Jae Hak;Song, Jun Yeob;Lee, Young Kang;Ha, Tae Ho;Lee, Chang-Woo;Kim, Seung Man
    • Journal of the Korean Society for Precision Engineering
    • /
    • v.31 no.10
    • /
    • pp.857-863
    • /
    • 2014
  • In this work, we introduce various bonding technologies for 3D package and suggest Insert-Bump bonding (ISB) process newly to stack multi-layer chips successively. Microstructure of Insert-Bump bonding (ISB) specimens is investigated with respect to bonding parameters. Through experiments, we study on find optimal bonding conditions such as bonding temperature and bonding pressure and also evaluate in the case of fluxing and no-fluxing condition. Although no-fluxing bonding process is applied to ISB bonding process, good bonding interface at $270^{\circ}C$ is formed due to the effect of oxide layer breakage.