• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2002년도 춘계학술대회 논문집
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• pp.348-352
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• 2002

a basis such as IT(Information Technology), NT(Nano Technology) and BT(Bio Technology). Recently, NT is applied to various fields that are composed of science, industry, media and semiconductor-micro technology. It has need of IT that is ultra-precision positioning technology with strokes of many hundreds mm and maintenance of nm precision in fields of ultra micro process, ultra precision measurement, photo communication part and photo magnetic memory. This thesis represents optimal design on ultra-precision positioning with single plane X-Y stage and development of artificial control system for adequacy of industrial demand. Also, dynamic simulation on global stage is performed by using ADAMS (Automated Dynamic Analysis of Mechanical System) for the purpose of grasping dynamic characteristic on user designed X-Y global stage. The error between displacements from micro stage and from FEM(Finite Element Method) is 3.53% by verifications of stability on micro stage and control performance. As maximum Von-mises stress on hinge of micro stage is 5.981kg/mm$^2$ that is 1.5% of yield stress, stability on hinge is secured. Preparing previous results, optimal design of micro stage can be possible, and reliance of results with FEM can be secured.

• 한국공작기계학회논문집
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• 제11권5호
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• pp.65-72
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• 2002

In this study, actuator, sensor, guide, power transmission element and control method are considered for ultra-precision positioning apparatus. Through previous process, single plane X-Y stage with ultra-precision positioning is manufactured. Global stage for the purpose of materialization with robust system, is combined by using AC servo motor and ball screw and rolling guide. And ultra-precision positioning system is developed by micro stage with elastic hinge type and piezo element. global servo and micro servo for the purpose of materialization positioning accuracy with nm(nanometer) are controlled simultaneously by using incremental encoder and laser interferometer as displacement measurement sensor. Through previous process, ultra-precision positioning system(100mm stroke and $\pm$ l0nm positioning accuracy) with single plane X-Y stage are materialized.

• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 2002년도 춘계학술대회 논문집
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• pp.422-428
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• 2002

In this study, actuator, sensor, guide, power transmission element and control method are considered for ultra-precision positioning apparatus. Through previous process, single plane X-Y stage with ultra-precision positioning is manufactured. Global stage for the purpose of materialization with robust system, is combined by using AC servo motor and ball screw and rolling guide. And ultra-precision positioning system is developed by micro stage with elastic hinge type and piezo element. global servo and micro servo for the purpose of materialization positioning accuracy with nm(nanometer) are controlled simultaneously by using incremental encoder and laser interferometer as displacement measurement sensor. Through previous process, ultra-precision positioning system (100mm stroke and ${\pm}$ 10nm positioning accuracy) with single plane X-Y stage are materialized.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 1995년도 추계학술대회 논문집
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• pp.437-441
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• 1995

In this paper, the ultra precision positioning system for servo motor and piezo actuator using dual servo loop control has been developed. For positioning system having long distance with ultra precision, the combination of global stage and micro stage is required. Servo moter and ball screw are used as a master stage and piezo acuator as a fine stage. By using this system, an positional precision witin .+-. 30nm has been achieved at dual servo loop control. When using micro stage, an positional precision within .+-. 10nm has been achieved. This result can be applied to develop semiconductor equipment such as wafer stepper.

• 한국생산제조학회지
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• 제9권1호
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• pp.38-44
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• 2000

The background of this study lies in he investigation of the formation mechanism of ductile mode(nkanometer-size) chips of brittle materials such as fine ceramics glass and silicon. As the first step to achieve this purpose this paper intends to observe the micro-deformation behavior of these materials in sub${\mu}{\textrm}{m}$ depth indentation tests using a diamond indentor. In this study it was developed Ultra-Micro Indentation. Device using the PZT actuator. Experimentally by using the Ultra-Micro Indentation device the micro fracture behavior of the silicon wafer was investigated. It was possible that ductile-brittle transition point in ultimate surface of brittle material can be detected by adding an acoustic emission sensor system to the Ultra-Micro Indentation appartus.

• 한국정밀공학회지
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• 제16권3호통권96호
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• pp.154-163
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• 1999

In this paper, an ultra precision positioning system has been developed using dual servo loop control. For positioning system having long distance with ultra precision , the combination of global stage and micro stage was required. A servo motor based ball screw is used as a global stage and the piezo actuator as a micro stage. For the improvement of positional precision, the digital Chebyshev filter is implemented in the developed to dual servo system. Therefore, the positional repeatability has been achieved within ${\pm}$ 10 mm, and this technique can be applied to develop precision semiconductor equipments such as lithography steppers and probers.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2002년도 춘계학술대회 논문집
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• pp.342-347
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• 2002

After the industrial revolution in 20 century, the world are preparing for new revolution that is society with knowledge for a basis such as IT(Information Technology), NT(Nano Technology) and BT(Bio Technology). Recently, NT is applied to various fields that are composed of science, industry, media and semiconductor-micro technology. It has need of IT that is ultra-precision positioning technology with strokes of many hundreds mm and maintenance of nm precision in fields of ultra micro process, ultra precision measurement, photo communication part and photo magnetic memory. Performance test of servo control system that is used ultra-precision positioning system with single plane X-Y stage is performed by simulation with Matlab. Analyzed for previous control algorithm and adapted for modern control theory, dual servo algorithm is developed by minimum order observer, and stability and priority on controller are secured. Through the simulation and experiments on ultra precision positioning, stability and priority on ultra-precision positioning system with single plane X-Y stage and control algorithm are secured by using Matlab with Simulink and ControlDesk made in dSPACE

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2001년도 춘계학술대회 논문집
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• pp.465-468
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• 2001

An aerostatic stage has frictionless behavior, so it has a advantage of investigation into positioning characteristics. A one-dimensional aerostatic ceramic stage with ballscrew driven and laser scale feedback system is manufactured, aiming at investigating positioning characteristic of ultra-precision stage. We confirm, this ceramic aerostatic stage has a 10nm micro resolution, and can be reduced mean of position error by compensation of numeric control command. By means of analyzing relationship of position error and change of temperature, we build a on-line compensation algorithm of position error from the measured temperature data. So we can improve repeatability of ultra-precision stage up to 34%($0.095{\mu}$) of the normal condition.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2004년도 춘계학술대회
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• pp.1099-1104
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• 2004

As consumer in optics, electronics, aerospace and electronics industry grow, the demand for ultra precision aspherical surface lens increases higher. To enhance the precision and productivity of ultra precision aspherical surface micro lens, the following specification of ultra precision grinding system is required: the highest rotational speed of the grinder is 100,000rpm and its turning accuracy is $0.1{\mu}m$, positioning accuracy is $0.1{\mu}m$. The development process of the grinding system for the ultra precision aspherical surface micro lens for optoelectronics industry is introduced. In the work reported in this paper, an intelligent grinding system for ultra precision aspherical surface machining was designed by considering the factors affecting the surface roughness and profiles accuracy. An aerostatic form was adopted to build the spindle of the workpiece and the spindle of grinder and ultra precision LM guide way was adopted in this system.

• Design & Manufacturing
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• 제2권1호
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• pp.33-38
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• 2008

As consumer in optics, electronics, aerospace and electronics industry grow, the demand for ultra precision aspherical surface lens increases higher. Precision turning with single-diamond tools has a long history of development for fabrication of optical quality surfaces since the advent of aerostatic rotary spindles and precise linear motion guide ways. To enhance the precision and productivity of ultra precision aspherical surface micro lens, the following specification of ultra precision grinding system is required: the highest rotational speed of the grinder is 100,000rpm and its turning accuracy is $0.1{\mu}m$, positioning accuracy is $0.1{\mu}m$. The development process of the grinding system for the ultra precision aspherical surface micro lens for optoelectronics industry is introduced. In the work reported in this paper, an intelligent grinding system for ultra precision aspherical surface machining was designed by considering the factors affecting the surface roughness and profiles accuracy. An aerostatic form was adopted to build the spindle of the workpiece and the spindle of grinder and ultra precision LM guide way was adopted in this system. And this paper deals with mirror grinding of an aspheric surface micro lens by resin bonded diamond wheel and spherical lens of BK7. It results was that a form accuracy of $0.6{\mu}m$ P-V and a surface roughness of $0.006{\mu}m$ Rmax.