• Proceedings of the KSME Conference
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• 2003.04a
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• pp.1052-1058
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• 2003

The possibility of micro/nano machining through electro-chemical process is discussed in this research. Electro-chemical dissolution region is localized within 1 ${\mu}m$ by applying ultra short pulses with tens of nanosecond duration. The effects of voltage, pulse duration, and pulse frequency on the localization distance are investigated. Localization distance can be manipulated by controlling the voltage and pulse duration, and various hole shapes are produced including stepped holes and taper free hole. High quality micro-hole with 8 ${\mu}m$ diameter with 20 ${\mu}m$ depth and micro-groove with 9 ${\mu}m$ width with 10 ${\mu}m$ depth are machined on 304 stainless steel.

• Journal of the Korean Society for Precision Engineering
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• v.21 no.11
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• pp.186-194
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• 2004

In this research, microfabrication technique using localized electrochemical deposition (LECD) with ultra short pulses is presented. Electric field is localized near the tool tip end region by applying a few hundreds of nano second pulses. Pt-Ir tip is used as a counter electrode and copper is deposited on the copper substrate in 0.5 M CuSO$_4$ and 0.5 M H$_2$SO$_4$ electrolyte. The effectiveness of this technique is verified by comparison with LECD using DC voltage. The deposition characteristics such as size, shape, surface, and structural density according to applied voltage and pulse duration are investigated. The proper condition is selected from the results of the experiments. Micro columns less than 10 $\mu$m in diameter are fabricated using this technique. The real 3D micro structures such as micro pattern and micro spring can be fabricated by this method. It is suggested that presented method can be used as an easy and inexpensive method for fabrication of microstructure with complex shape.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.1199-1202
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• 2003

In this research, microfabrication technique using localized electrochemical deposition is presented. Electric field is localized near the tip end region by applying ultra short pulses. Platinum tip is used as the counter electrode and copper is deposited on the copper substrate in 0.5 M CuSO$_4$ and 0.5 M H$_2$SO$_4$ electrolyte. The deposition characteristics such as size, shape, and structural density according to pulse duration and applied voltage are investigated. Micro-columns less than 10 $\mu\textrm{m}$ in diameter are fabricated using the presented technique. The process can be potentially used for three dimensional metal structure fabrications with micrometer feature size.

• Journal of Communications and Networks
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• v.9 no.4
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• pp.482-489
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• 2007

In this paper, two frequency domain signal processing techniques for pulse shape modulation(PSM) ultra wideband(UWB) systems are presented. Firstly, orthogonal detection of UWB PSM Hermite pulses in frequency domain is addressed. It is important because time domain detection by correlation-based receivers is severely degraded by many sources of distortion. Pulse-shape, the information conveying signal characteristic, is deformed by AWGN and shape-destructive addition of multiple paths from the propagation channel. Additionally, because of the short nature of UWB pulses, timing mismatches and synchronism degrade the performance of PSM UWB communication systems. In this paper, frequency domain orthogonality of the Hermite pulses is exploited to propose an alternative detection method, which makes possible efficient detection of PSM in dense multipath channel environments. Secondly, a ranging method employing the Cepstrum algorithm is proposed. This method is partly processed in the frequency domain and can be implemented without additional hardware complexity in the terminal.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2004.05b
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• pp.324-326
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• 2004

We have obtained ultra-short pulses with a wavelength of 616 nm from a Distributed Feedback Dye Laser pumped by excimer laser. Using the second harmonic generation, we obtained ultra-short pulse at 308nm in ultraviolet region and also performed amplification in 3 stages of XeCl amplifiers.

• Journal of the Korean Institute of Telematics and Electronics D
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• v.34D no.10
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• pp.85-92
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• 1997

For a InGaAsP buried - heterostructrue $1.3\mu\textrm{m}$ LD with fabry-perot cavity structure, the procedures of ultra-short optical pulse genration ar eanalyzed by simulating the rate equations. Investigting the effects of injected current pulse parameters such as bias $J_b$, pulse width $T_d$ and pulse amplitude $J_p$ on the generated optical pulses, we derive the optimum conditions to obtain a single optical pulse with strong peak value. We also observe that the repetition rate of current pulses needs to be restricted under a certain threshold to generate a train of single optical pulses, and that the period doubling phenomenon takes place by increasing the repitition rate.

• Journal of the Korean Society for Precision Engineering
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• v.20 no.8
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• pp.213-220
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• 2003

By the localization of electro-chemical dissolution region, we succeeded in a few micrometer size hole drilling on stainless steel with the radial machining gap of about 1 ${\mu}{\textrm}{m}$. Tens of nanosecond duration voltage pulses were applied between WC micro-shaft and stainless steel in the 0.1 M $H_2SO_4$ solution. Pt balance electrode was used to drill the high aspect ratio micro-hole without generation of Cr oxide layer on the machined surface. The effects of applied voltage, pulse duration, and pulse period on localization distance were investigated according to machining time. We suggested the taper reduction technique especially brought up on blind-hole machining. High quality micro-holes with 8 ${\mu}m$ diameter with 20 ${\mu}m$ depth and 12 ${\mu}m$ diameter with 100 ${\mu}m$ depth were drilled on 304 stainless steel foil. The various hole shapes were also produced including stepped holes and taper free holes.

• International Journal of Precision Engineering and Manufacturing
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• v.6 no.4
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• pp.49-54
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• 2005

In this paper, micro structuring technique using localized electrochemical deposition (LECD) with ultra short pulses was investigated. Electric field in electrochemical cell was localized near the tool tip end region by applying pulses of a few hundreds of nano second duration, Pt-Ir tip was used as a counter electrode and copper was deposited on the copper substrate in mixed electrolyte of 0.5 M $CuSO_4$ and 0.5 M $H_2SO_4$, The effectiveness of this technique was verified by comparison with ECD using DC voltage. The deposition characteristics such as size, shape, surface, and structural density according to applied voltage and pulse duration were investigated. The proper condition was selected based on the results of the various experiments. Micro columns less than $10{\mu}m$ in diameter were fabricated using this technique. The real 3D micro structures such as micro spring and micro pattern were made by the presented method.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.20 no.4
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• pp.395-400
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• 2011

Scanning Probe Lithography is a method to localized oxidation on single crystal silicon wafer surface. This study demonstrates nanometer scale non contact lithography process on (100) silicon (p-type) wafer surface using AFM(Atomic force microscope) apparatuses and pulse controlling methods. AFM-based experimental apparatuses are connected the DC pulse generator that supplies ultra short pulses between conductive tip and single crystal silicon wafer surface maintaining constant humidity during processes. Then ultra short pulse durations are controlled according to various experimental conditions. Non contact lithography of using ultra short pulse induces electrochemical reaction between micro-scale tip and silicon wafer surface. Various growths of oxides can be created by ultra short pulse non contact lithography modification according to various pulse durations and applied constant humidity environment.

• Journal of the Korean Society for Precision Engineering
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• v.24 no.6
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• pp.105-112
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• 2007

Tungsten wire micro electrochemical machining (W-wire micro ECM) with ultra-short pulses enables precise micro machining of metal. In wire micro ECM, platinum wire has been used because it is electrochemically stable. However, the micro metal wire with low strength is easily deformed by hydrogen bubbles which are generated during the machining. The wire deformation decreases the machining accuracy. To reduce the influence of hydrogen bubbles, in this paper, the use of tungsten wire was investigated. To improve machining accuracy, suitable pulse conditions which affect generation of bubbles were also investigated. The tungsten wire micro ECM can be applied to the fabrication of various shapes. Using this method, various micro-parts and shapes were fabricated.