• 한국정밀공학회지
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• 제27권7호
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• pp.117-122
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• 2010

Recently, aspheric glass lens molding core is fabricated with tungsten carbide(WC). If molding core is fabricated with silicon carbide(SiC), SiC coating process, which must be carried out before the Diamond-Like Carbon(DLC) coating can be eliminated and thus, manufacturing time and cost can be reduced. Diamond Like Carbon(DLC) is being researched in various fields because of its high hardness, high elasticity, high durability, and chemical stability and is used extensively in several industrial fields. Especially, the DLC coating of the molding core surface used in the fabrication of a glass lens is an important technical field, which affects the improvement of the demolding performance between the lens and molding core during the molding process and the molding core lifetime. Because SiC is a material of high hardness and high brittleness, it can crack or chip during grinding. It is, however, widely used in many fields because of its superior mechanical properties. In this paper, the grinding condition for silicon carbide(SiC) was developed under the grinding condition of tungsten carbide. A silicon carbide molding core was fabricated under this grinding condition. The measurement results of the SiC molding core were as follows: PV of 0.155 ${\mu}m$(apheric surface) and 0.094 ${\mu}m$(plane surface), Ra of 5.3 nm(aspheric surface) and 5.5 nm(plane surface).

• 한국정밀공학회지
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• 제21권9호
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• pp.167-173
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• 2004

The heterodyne He-Ne laser interferometer is the most widely used sensing unit to measure the position error. It measures the positioning error from the displacement of a moving reflector in terms of the wave length. But, the wave length is affected by the variation of atmospheric temperature. Temperature variation of 1$^\circ C$ results in the measuring error of 1ppm. In this paper, for measuring more accurately the position error of the ultra precision stage, the refractive index compensation method is introduced. The wave length of the laser interferometer is compensated using the simultaneously measured room temperature variations in the method. In order to investigate the limit of compensation, the stationary test against two fixed reflectors mounted on the zerodur$\circledR$ plate is performed firstly. From the experiment, it is confirmed that the measuring error of the laser interferometer can be improved from 0.34${\mu}m$ to 0.11${\mu}m$ by the application of the method. Secondly, for the verification of the compensating effect, it is applied to estimate the positioning accuracy of an ultra precision aerostatic stage. Two times of the refractive index compensation are performed to acquire the positioning error of the stage from the initially measured data, that is, to the initially measured positioning error and to the measured positioning error profile after the NC compensation. Although the positioning error of an aerostatic stage cannot be clarified perfectly, it is known that by the compensation method, the measuring error by the laser interferometer can be improved to within 0.1${\mu}m$.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2005년도 춘계학술대회 논문집
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• pp.1737-1740
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• 2005

As the various manufacturing technology of optical glass is developed, the aspherical lenses are applied to many fields. However, It is still very difficult to manufacture glass lens because of the high cost and the short life of core. In recent years, the demands of the aspherical glass lenses increase since it is difficult to obtain the desirable performance in the plastic lens. In the glass mold lens, it has merits of high productivity and reproductivity since lens is manufactured by the only forming with high precision mold. The fabricating conditions for glass mold lens are glass surface that does not cause fusion, viscosity of 108-1013 poise for the $0.2{\mu}m$ accuracy, and viscoelasticity for the roughness less than 100 angstrom. In this thesis, ultra-precision grinding characteristics of tungsten carbide for forming the aspherical glass lens core were studied and the result of it is applied to manufacture the tungsten carbide-base core of the glass lens used to the laser scanning unit and the camera phone.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2005년도 춘계학술대회 논문집
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• pp.1910-1913
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• 2005

As the various manufacturing technology of optical glass is developed, the aspherical lenses are applied to many fields. However, It is still very difficult to manufacture glass lens because of the high cost and the short life of core. In recent years, the demands of the aspherical glass lenses increase since it is difficult to obtain the desirable performance in the plastic lens. In the glass mold lens, it has merits of high productivity and reproductivity since lens is manufactured by the only forming with high precision mold. The fabricating conditions for glass mold lens are glass surface that does not cause fusion, viscosity of 108-1013 poise for the $0.2{\mu}m$ accuracy, and viscoelasticity for the roughness less than 100 angstrom. In this paper, ultra-precision grinding characteristics of tungsten carbide for forming the aspherical glass lens core were studied and the result of it is applied to manufacture the tungsten carbide-base cores of the glass lens used to the laser scanning unit and the camera phone.

• 한국정밀공학회지
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• 제21권10호
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• pp.26-33
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• 2004

Ultra precision grinding technology has been developed from the refinement of the abrasive, the development of high stiffness equipment and grinding skill. The conventional wafering process which consists of lapping, etching, 1 st, 2nd and 3rd polishing has been changed to the new process which consists of precision surface grinding, final polishing and post cleaning. Especially, the ultra precision grinding of wafer improves the flatness of wafer and the efficiency of production. Furthermore, it has been not only used in bare wafer grinding, but also applied to wafer back grinding and SOI wafer grinding. This paper focuses on the flatness of the ground wafer. Generally, the ground wafer has concave pronto because of the difference of wheel path density, grinding temperature and elastic deformation of the equipment. Wafer tilting is applied to avoid non-uniform material removal. Through the geometric analysis of wafer grinding process, the profile of the ground wafer is predicted by the development of profile simulator.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2003년도 춘계학술대회 논문집
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• pp.98-101
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• 2003

As the ultra precision grinding can be applied to wafering process by the refinement of the abrasive. the development of high stiffness equipment and grinding skill, the conventional wafering process which consists of lapping, etching, 1st, 2nd and 3rd polishing could be exchanged to the new process which consists of precision surface grinding, final polishing and post cleaning. Especially, the ultra precision grinding of wafer improves the flatness of wafer and the efficiency of production. Futhermore, it has been not only used in bare wafer grinding, but also applied to wafer back grinding and SOI wafer grinding. This paper focused on the flatness of the ground wafer. Generally, the ground wafer has concave profile because of the difference of wheel path density, grinding temperature and elastic deformation of the equiptment. Tilting mathod is applied to avoid such non-uniform material removes. So, in this paper, the geometric analysis on grinding process is carried out, and then, we can predict the profile of th ground wafer by using profile simulation.

• 한국정밀공학회지
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• 제32권5호
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• pp.415-422
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• 2015

Ballscrews are important motion transfer and positioning units of industrial machinery and precision machines. Positioning accuracy of the feed drive system depends upon axial stiffness of ballscrew systems. As the nut stiffness depends upon preload and operating conditions, analytical modeling of the stiffness is performed through the contact and body deformation analysis. For accurate contact analysis, the contact angle variation between balls and grooves is incorporated in the developed model. To verify the developed mathematical stiffness model, experiments are conducted on the test-rig. Through the uncertainty analysis according to GUM (Guide to the expression of Uncertainty in Measurement), it is confirmed that the formulated stiffness model has over 85% estimation accuracy. After constructing the ballscrew DB, a quick turnaround system for the nut stiffness estimation has been developed in this research.

• 한국정밀공학회지
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• 제30권12호
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• pp.1327-1333
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• 2013

Air bearings are widely used in precision stages because of low friction and high motion accuracy, however, they suffer from low stiffness in comparison with rolling bearings or hydrostatic bearings. So, several preloading methods using weight, magnet and vacuum force, and opposing pads have been used to increase the stiffness of the air bearings. In this paper, pressure distributions of the vacuum preloaded porous air bearings are calculated using the proposed method. And then, the load capacity and stiffness are analyzed. For the vacuum preloaded air bearings, the stiffness is increased owing to reduced bearing clearance by vacuum force. The simulation results indicate that variation of vacuum pressure with clearance in the vacuum pocket gives rise to low stiffness, so the vacuum pocket should be designed for pressure to be constantly maintained regardless of the bearing clearance by means of large effective pumping speed.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2006년도 춘계학술대회 논문집
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• pp.485-486
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• 2006

This paper represents a ultra precision rotational device where the smooth impact drive mechanism(SIDM) is utilized as a driving mechanism. Linear motions of piezoelectric elements are converted to the rotational motion of disk by frictional forces generated between the rotational disk and the friction bars which are attached to the piezoelectric elements. This device was designed to drive a rotational disk using slip-slip motion mechanism based on stick-slip motion mechanism. Experimental results show that the angular velocity was increased in proportion to the magnitude of supplied voltage to piezoelectric element. In our device, the smooth rotational motion was obtained when the driving frequency has been reached to 500Hz under the driving voltage of 100V. The amount of step movement has been revealed to be $3.44{\times}10^{-4}$ radian.

• 한국정밀공학회지
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• 제32권1호
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• pp.9-16
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• 2015

The machining-chatter stands for a sudden relative vibration appeared between a material and a tool while processing with a machine. This chatter is key factor that seriously affects the quality of processed materials as well as being a factor which causes serious damages to the tool and the machine. This study is related to the monitoring and smart control of chatter problem that can compensate machining-chatter faster and produce processed goods with more precision by autonomous compensation. The above-mentioned machining-chatter compensator includes the chatter vibration sensor and the chatter compensator that estimates the compensation value according to the sensor detecting the chatter vibration of machine-tool and the chatter vibration detected from the sensor while having a feature of being organized by interlocking with the machine-tool controller.