• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.25 no.2
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• pp.135-139
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• 2012

In this study, we synthesized the chalcogenide glass($Ge_{19}Sb_{23}Se_{58}$) for infrared optics by meltquenching method and verified the effect of cooling condition on the glass properties. The structural and optical properties of the glass were analyzed by XRD, FT-IR and SEM image. The glass synthesized under the cooling temperature of $980^{\circ}C$ shows transmittance of 58% at $8\sim12{\mu}m$, which was decreased as the cooling temperature was decreased. In addition, thermal and hardness also were measured. From the analysis results, we ascertained the feasibility as a molding materials for infrared optics.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.25 no.1
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• pp.1-6
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• 2016

Micromanufacturing is a useful system for reducing energy consumption. For micromanufacturing, tool clamping and workpiece clamping are important components to realize the machining process. Therefore, a shape memory alloy (SMA) ring type tool holder is developed. In addition, this holder needs cooling and heating processes to execute the tool clamping process. This study suggests a cooling/heating device based on peltier elements. The device will be applied to the heating/cooling process of an automatic tool changer (ATC) for the SMA tool holder. This study introduces the configuration and operating principle of the proposed ATC system. The description and prototype evaluation of this system were given. Plastic bolt and aluminum block were selected to enhance the cooling performance, and the installed tool was changed in 17 s during the experiments.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.20 no.4
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• pp.382-385
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• 2011

There is an immense need to obtain nanometric surface finish on optical glass owing to the advantage of improved performance of the components. But owing to brittleness and hardness, optical glass is one of the materials that is difficult to ultra-precision turning. According to the hypothesis of ductile mode machining, regardless of their hardness and brittleness, will undergo a transition from brittle to ductile machining region below a critical undeformed chip thickness. Below this threshold, it is suggested that the energy required for plastic formation. Thus, plastic deformation is the predominant mechanism of material removal in machining these materials in this mode. An experimental study is conducted diamond cutting for machining BK7 glass. The investigation presents the feasibility of achieving nanometric surface and the understanding the mechanism of cutting glass, proving the cutting edge radius effect.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.7 no.2
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• pp.60-65
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• 2008

The high-technology industries including a semi-conductor and an information communication need an ultra-precision technology from the technological points of view. Nano technology based on an ultra-precision technology is being studied to overcome the delicate technology that may occur in the semi-conductor fields. Then, the transferring equipment with high resolution and long displacement becomes an important technology. The goal of this study is to analyze the displacement magnification mechanism driven by piezoelectric actuator which has high resolution and fast response characteristics using flexure hinge with the merits of soft displacement, negligible back-lash and stick-slip, and no-lubrication. The analyses to reduce the magnification losses occurred during the magnification process are performed using ANSYS software based on FEM. The five design variables such as arm thickness, thickness of hinge, radius of hinge, length of input side at the 1st lever and magnification ratio of 1st lever are optimized to induce the maximum magnification ratio using Taguchi method.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2005.05a
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• pp.203-208
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• 2005

In recent years, as the demands of VBNS and VDSL increase, the development of kernel parts of optical communication such as PLC(Planar Light Circuit), Coupler, and WDM elements increases. The alignment and the attachment technology are very important in the fabrication of optical elements. In this paper, the optical alignment characteristics of multi-axis ultra precision stage were studied. The alignment algorithms were studied for applying to the ultra precision multi-axis stage. The alignment algorithm is comprised of field search and peak search algorithms. The contour of optical power signals can be obtained by field search and the precise coordinate can be found out by peak search. Two kinds of alignments, such as 1 ch. input vs. 1 ch. output optical stack, and 1 ch. input vs. 8 ch. output PLC stacks were performed for investigating the alignment characteristics.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.14 no.6
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• pp.101-109
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• 2005

Ultra-precision positioning systems basically require high natural frequency and sufficient workspace. To cope with this requirement, flexure hinge mechanisms have been proposed. However, previous designs are hard to satisfy the functional requirements of the system due to difficulty in modeling and optimizing process applying an independent axiomatic design. Therefore, this paper proposes a new design and design-order based on semi-coupled axiomatic design. A planar 3 DOF parallel type micro mechanism is chosen as an exemplary device. Based on preliminary kinematic analysis and dynamic modeling of the system, an optimal design has been carried out. To check the effectiveness of the optimal parameters obtained from theoretical approach, simulation is performed by FEM. The simulation result shows that a natural frequency of 200.53Hz and a workspace of $2000{\mu}m{\times}2000{\mu}m$ can be ensured, which is in very close agreement with the specified goal of design.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.17 no.2
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• pp.1-6
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• 2008

In recent years, developments in the semiconductor and electronic industries have brought a rapid increase in the use of large size silicon wafer. For further improvement of the ultra precision surface and flatness of Si wafer necessary to high density ULSI, it is known that polishing is very important. However, most of these investigation was experiment less than 300mm diameter. Polishing is one of the important methods in manufacturing of Si wafers and in thinning of completed device wafers. This study reports the machining variables that has major influence on the characteristic of wafer polishing. It was adapted to polishing pressure, machining speed, and the slurry mix ratio, the optimum condition is selected by ultra precision wafer polishing using load cell and infrared temperature sensor. The optimum machining condition is selected a result data that use a pressure and table speed data. By using optimum condition, it achieves a ultra precision mirror like surface.

• Polymer Science and Technology
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• v.26 no.1
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• pp.40-46
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• 2015

• Current Optics and Photonics
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• v.2 no.2
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• pp.165-171
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• 2018

Fourier ptychographic microscopy (FPM) is a recently proposed computational imaging method that achieves both high resolution (HR) and wide field of view. In the FPM framework, a series of low-resolution (LR) images at different illumination angles is used for high-resolution image reconstruction. On the basis of previous research, image noise can significantly degrade the FPM reconstruction result. Since the captured LR images contain a lot of dark-field images with low signal-to-noise ratio, it is very important to apply a noise-reduction process to the FPM raw dataset. However, the thresholding method commonly used for the FPM data preprocessing cannot separate signals from background noise effectively. In this work, we propose an improved thresholding method that provides a reliable background-noise threshold for noise reduction. Experimental results show that the proposed method is more efficient and robust than the conventional thresholding method.

• Current Optics and Photonics
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• v.5 no.5
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• pp.576-582
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• 2021

Dichroic beam-splitter (DBS) with polarization-maintaining took an important role in the free space quantum telecommunication tests on the Micius satellite of China. In this presentation, we designed and prepared a 50 layer polarization-maintaining DBS coating by a dual ion beam sputtering deposition (Dual-IBS) method. In order to solve a stress problem, an 18 layer special anti-reflection (AR) coating with similar physical thickness ratio was deposited on the backside. By stress compensation, the surface flatness RMS value of the DBS sample decreased from 0.341 λ (@632.8 nm) to 0.103 λ while beam splitting and polarization maintaining properties were almost kept unchanged. Further, we discussed the mechanism of film stress and stress compensation by equation deduction and found that total stress had a strong relationship with the total physical thickness and the ratio of layer materials.