• Title/Summary/Keyword: UV-curable resist

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Elememtwise Patterned stamp와 부가압력을 이용한 UV 나노임프린트 리소그래피 공정

  • 손현기;정준호;심영석;이응숙
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2004.05a
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    • pp.126-126
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    • 2004
  • 1996년 Chou 등이 개발한 가열방식의 나노임프린트 리소그래피(nanoimprint lithography, NIL)은 선폭 100nm 이하의 나노구조물을 경제적으로 제작할 수 있는 대표적인 나노패턴닝(nano-patterning) 공정으로 많은 기대가 모아지고 있으나, 열변형에 의해 다층정렬이 어렵다는 점과, 점도가 큰 레지스트(resist)를 임프린트하기 위해서는 고압(∼30 bar)이 필요하다 점 등의 문제점이 있다. 이를 해결할 수 있는 방법으로 UV 나노임프린트 리소그래피(ultraviolet nanoimprint lithography, UV-NIL)를 들 수 있다.(중략)

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Effect of surface toughness on the interfacial adhesion energy between glass wafer and UV curable polymer for different surface roughness (표면거칠기에 따른 글래스 웨이퍼와 UV 경화 폴리머사이의 계면접착 에너지 평가)

  • Jang, Eun-Jung;Hyun, Seoung-Min;Choi, Dae-Geun;Lee, Hak-Joo;Park, Young-Bae
    • Proceedings of the KSME Conference
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    • 2008.11a
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    • pp.40-44
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    • 2008
  • The interfacial adhesion energy between resist and a substrate is very important due to resist pull-off problems during separation of mold from a substrate in nanoimprint process. And effect of substrate surface roughness on interfacial adhesion energy is very important. In this paper, we have treated glass wafer surface using $CF_4$ gas for increase surface roughness and it has tested interfacial adhesion properties of UV resin/glass substrate interfaces by 4 point bending test. The interfacial adhesion energies by bare, 30, 60 and 90 sec surface treatments are 0.62, 1.4, 1.36 and 2 $J/m^2$, respectively. The test results showed quantitative comparisons of interfacial fracture energy (G) effect of glass wafer surface roughness.

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A Study on the Formation of Air Bubble by the Droplet Volume and Dispensing Method in UV NIL (UV NIL공정에서 액적의 양과 도포방법에 따른 기포형성 연구)

  • Lee, Ki Yeon;Kim, Kug Weon
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.14 no.9
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    • pp.4178-4184
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    • 2013
  • Nanoimprint lithography (NIL) is an emerging technology enabling cost-effective and high-throughput nanofabrication. Recently, the major trends of NIL are high throughput and large area patterning. UV curable type NIL (UV NIL) can be performed at room temperature and low pressure. And one advantage of UV NIL is that it does not need vacuum, which greatly simplifies tool construction, so that vacuum oprated high-precision stages and a large vacuum chamber are no longer needed. However, one key issue in non-vacuum environment is air bubble formation problem. Namely, can the air bubbles be completely removed from the resist. In this paper, the air bubbles formation by the method of droplet application in UV NIL with non-vacuum environment are experimentally studied. The effects of the volume of droplet and the number of dispensing points on air bubble formation are investigated.

UV-nanoimprint Patterning Without Residual Layers Using UV-blocking Metal Layer (UV 차단 금속막을 이용한 잔류층이 없는 UV 나노 임프린트 패턴 형성)

  • Moon Kanghun;Shin Subum;Park In-Sung;Lee Heon;Cha Han Sun;Ahn Jinho
    • Journal of the Microelectronics and Packaging Society
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    • v.12 no.4 s.37
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    • pp.275-280
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    • 2005
  • We propose a new approach to greatly simplify the fabrication of conventional nanoimprint lithography (NIL) by combined nanoimprint and photolithography (CNP). We introduce a hybrid mask mold (HMM) made from UV transparent material with a UV-blocking Cr metal layer placed on top of the mold protrusions. We used a negative tone photo resist (PR) with higher selectivity to substrate the CNP process instead of the UV curable monomer and thermal plastic polymer that has been commonly used in NIL. Self-assembled monolayer (SAM) on HMM plays a reliable role for pattern transfer when the HMM is separated from the transfer layer. Hydrophilic $SiO_2$ thin film was deposited on all parts of the HMM, which improved the formation of SAM. This $SiO_2$ film made a sub-10nm formation without any pattern damage. In the CNP technique with HMM, the 'residual layer' of the PR was chemically removed by the conventional developing process. Thus, it was possible to simplify the process by eliminating the dry etching process, which was essential in the conventional NIL method.

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