• Title/Summary/Keyword: UV curing resin

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A Study on the Effect of Shrinkage on Lens Deformation in Optical Lens Manufacturing Process Using Thermosetting Resin Material (열경화성 수지 재료를 이용한 광학 렌즈 제조공정에서 렌즈 변형에 대한 수축률이 영향에 관한 연구)

  • Park, Si Hwan
    • Design & Manufacturing
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    • v.16 no.3
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    • pp.9-15
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    • 2022
  • In order to reduce the manufacturing costs of the glass lens, it is necessary to manufacture a lens using a UV curable resin or a thermosetting resin, which is a curable material, in order to replace a glass lens. In the case of forming a lens using a thermosetting material, it is necessary to form several lenses at once using the wafer-level lens manufacturing technologies due to the long curing time of the material. When a lens is manufactured using a curable material, an error in the shape of the lens due to the shrinkage of the material during the curing process is an important cause of defects. The major factors for these shape errors and deformations are the shrinkage and the change of mechanical properties in the process of changing from a liquid material during curing to a solid state after complete curing. Therefore, it is necessary to understand the curing process of the material and to examine the shrinkage rate and change of physical properties according to the degree cure. In addition, it is necessary to proceed with CAE for lens molding using these and to review problems in lens manufacturing in advance. In this study, the viscoelastic properties of the material were measured during the curing process using a rheometer. Using the results, Rheological investigation of cure kinetics was performed. At the same time, The shrinkage of the material was measured and simple mathematical models were created. And using the results, the molding process of a single lens was analyzed using Comsol, a commercial S/W. In addition, the experiment was conducted to compare and verify the CAE results. As a result, it was confirmed that the shrinkage rate of the material had a great influence on the shape precision of the final product.

Impact of UV curing process on mechanical properties and dimensional accuracies of digital light processing 3D printed objects

  • Lee, Younghun;Lee, Sungho;Zhao, Xing Guan;Lee, Dongoh;Kim, Taemin;Jung, Hoeryong;Kim, Namsu
    • Smart Structures and Systems
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    • v.22 no.2
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    • pp.161-166
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    • 2018
  • In the last decade, there has been an exponential increase of scientific interest in smart additive manufacturing (AM) technology. Among the different AM techniques, one of the most commonly applied processes is digital light processing (DLP). DLP uses a digital projector screen to flash an ultraviolet light which cures photopolymer resins. The resin is cured to form a solid to produce parts with precise high dimensional accuracy. During the curing process, there are several process parameters that need to be optimized. Among these, the exposure time affects the quality of the 3D printed specimen such as mechanical strength and dimensional accuracy. This study examines optimal exposure times and their impact on printed part. It was found that there is optimal exposure time for printed part to have appropriate mechanical strength and accurate dimensions. The gel fraction and TGA test results confirmed that the improvement of mechanical properties with the increasing UV exposure time was due to the increase of crosslinked network formation with UV exposure time in acrylic resins. In addition, gel fraction and thermogravimetric analysis were employed to microscopically investigate how this process parameter impacts mechanical performance.

Study on the Properties of UV-curable Polyurethane acrylate with reactive diluents content (자외선 경화형 폴리우레탄 아크릴레이트 수지의 반응성 희석제 함량에 따른 물성 연구)

  • Sim, Jae Hak;Seo, Eun Sun;Lee, Won Young;Kim, Gu Ni
    • Journal of Adhesion and Interface
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    • v.18 no.4
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    • pp.159-165
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    • 2017
  • In this study, we synthesized UV-curable urethane acrylates with different contents of BA, reactive diluent and characterized their physical properties such as thermal, mechanical properties, adhesive strength and flexibility resistance. From a result of DSC, Tg of polyol and acrylate resin were separated as the BA content increased more than 40%. Also, tensile strength, elongation and adhesive strength decreased with increasing the BA content. The UV-curable urethane acrylate with 40% BA has shown good flexibility resistance compared to other resin due to poor hardness and Tm of acrylate resin.

Development of Office Type SFF System (UV Curing 공정을 이용한 오피스용 SFF System 개발)

  • Kwon, Jeong-Jae;Cho, Hyun-Taek;Baek, Yung-Jong;Kim, Dong-Soo
    • Proceedings of the KSME Conference
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    • 2007.05a
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    • pp.1400-1403
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    • 2007
  • The 3DP(three dimensional printing) technology is one of the SFF(solid freeform fabrication) technologies which has recently come into a spotlight due to its suitability to various field. A manufacturing process of product is using many pattern formation technology. The 3DP technology uses multi nozzle that can fabricate three dimensional object of high speed and accuracy. In this paper, we introduce a development of the office type solid freeform fabrication system. This system is used UV resin and multi-piezo head.

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Synthesis and Adhesion Properties of UV Curable Acrylic PSAs for Semiconductor Manufacturing Process (반도체 제조 공정용 UV 경화형 아크릴 점착제의 합성과 점착 특성)

  • Lee, Seon Ho;Lee, Sang Keon;Hwang, Taek Sung
    • Applied Chemistry for Engineering
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    • v.24 no.2
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    • pp.148-154
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    • 2013
  • UV curable acryl resin, pressure-sensitive adhesives (PSAs), are used in many different parts in the world. In particular, PSAs has been used in the wafer manufacturing process of semiconductor industry. As wafers become much thinner, UV curable PSAs require more proper adhesion performance. In this study, acrylic PSAs containing hydroxyl groups were synthesized using monomers of 2-ethylhexyl acrylate, 2-ethylhexyl methacrylate, styrene monomer and 2-hydroxyethyl acrylate. Isocyanate modified UV curable PSAs were then prepared by the adduct reaction that facilitates the UV curing property via controlling the amount of methacryloyloxyehtyl isocyanate. The proper adhesion performance and UV curing behavior of UV curable PSAs with various hydroxyl values were studied, and experimental conditions were then optimized to raise the efficiency of wafer manufacturing process. It was found that in case of using the equivalent ratio of 1 : 1 isocyanate hardener used in the UV curable PSAs, the peel strength before the UV curing process decreased as the amount of hydroxyl groups increased in the PSAs. The peeling adhesive strength was also decreased with increasing UV dose due to high curing characteristics.

Process Conditions for the Fabrication of Hydrophobic Surfaces with Different Photo-curable Resins (광경화성 레진의 성분 변화에 대한 소수성 표면 제작을 위한 공정 조건)

  • Hong, Sung-Ho;Woo, Heung-Sik
    • Tribology and Lubricants
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    • v.36 no.5
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    • pp.267-273
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    • 2020
  • This study experimentally investigates hydrophobic surfaces fabricated via additive manufacturing. Additive manufacturing, commonly known as 3D printing, is the process of joining materials to fabricate parts from 3D model data, usually in a layer-upon-layer manner. Digital light processing is used to fabricate hydrophobic surfaces in this study. This method uses photo-curable resins and ultraviolet (UV) sources. Moreover, this technique generally has faster shaping speeds and is advantageous for the fabrication of small components because it enables the fabrication of one layer at a time. Two photo-curable resins with different compositions are used to fabricate micro-patterns of hydrophobic surfaces. The resins are composed of a photo-initiator, monomer, and oligomer. Experiments are conducted to determine suitable process conditions for the fabrication of hydrophobic surfaces depending on the type of resin. The most important factors affecting the process conditions are the UV exposure time and slice thickness. The fabrication capability according to the process conditions is evaluated using the side and top views of the micro-patterns observed using a microscope. The micro-patterns are collapsed and intertwined when the exposure time is short because sufficient light (heat) is not applied to cure the photo-curable resin with a given slice thickness. On the other hand, the micro-patterns are attached to each other when the exposure time is prolonged because the over-curing time can cure the periphery of a given shape. When the slice is thicker, the additional curing area is enlarged in each slice owing to the straightness of UV light, and the slice surface becomes rough.

Synthesis of Co(II), Ni(II) and Cu(II) Complexes from Schiff base Ligand and Reactivity Studies with Thermosetting Epoxy Resin

  • Lakshmi, B.;Shivananda, K.N.;Prakash, Gouda Avaji;Rama, Krishna Reddy K.;Mahendra, K.N.
    • Bulletin of the Korean Chemical Society
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    • v.32 no.5
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    • pp.1613-1619
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    • 2011
  • A hybrid thermosetting maleimido epoxy compound 4-(N-maleimidophenyl) glycidylether (N-MPGE) containing Co(II), Ni(II) and Cu(II) ions was prepared by curing N-MPGE and tetradentate Schiff base Co(II), Ni(II) and Cu(II) complexes. The curing polymerization reaction of N-MPGE with metal complexes as curing agents was studied. The cured samples were studied for thermal stability, chemical (acid/alkali/solvent) and water absorption resistance and homogeneity of the cured systems. The tetradentate Schiff base, 3-[(Z)-2-piperazin-1-yl-ethylimino]-1,3-dihydro indol-2-one was synthesized by the condensation of Isatin (Indole-2, 3-dione) with 1-(2-aminoethyl)piperazine (AEP). Its complexes with Co(II), Ni(II) and Cu(II) have been synthesized and characterized by microanalysis, conductivity, Uv-Visible, FT-IR, TGA and magnetic susceptibility measurements. The spectral data revealed that the ligand acts as a neutral tetradentate Schiff base and coordinating through the azomethine nitrogen, two piperazine nitrogen atoms and carbonyl oxygen.

Nanoimprinting Pattern Formation Using Photo-Curable Acrylate Composites (광경화성 아크릴레이트 복합체를 이용한 나노 임프린트 패턴 형성)

  • Kim, Sung-Hyun;Park, Sun-Hee;Moon, Sung-Nam;Lee, Woo-Il;Song, Ki-Gook
    • Polymer(Korea)
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    • v.36 no.4
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    • pp.536-541
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    • 2012
  • The effects of silica content were studied on UV curing characteristics and defect formations in imprinted patterns of hundreads nanometer size for the photo-curable imprinting composites with silica particles. An increase in elasticity and a decrease in shrinkage were observed with an increase in silica content in the imprinting resin which was UV cured at room temperature. However, the patterned nano-pillars were stuck together with neighboring nano-pillars if the amount of silica is more than 7 wt%. This can be ascribed to the increased viscosity of imperfectly cured resin due to the obstruction of the photo-reaction by silica particles. Addition of silica to the imprinting resin is useful in enhancing the strength of the cured resin although it is difficult to get good imprinted patterns for the resin with more than 7 wt% of silica due to the reduction of photo-reaction conversion.

3DP Printing Method using Multi-Piezo Head (Multi-Piezo 헤드를 이용한 3차원 프린팅 기법)

  • Kim, Jung-Su;Kim, Dong-Soo;Lee, Min-Cheol
    • Proceedings of the KSME Conference
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    • 2007.05a
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    • pp.1394-1399
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    • 2007
  • Recently, Study of 3D freeform fabrication method was working in the various applications. For example, in the powder base, it's laminated using a binding method or laser sintering method. However, these methods are not suitable in the office environments because it dust with powder that is bad for health. In this paper, we introduce a method of 3D freeform fabrication using a curing of photo-polymer resin and construct a system has multi printing head. A photo-polymer curing method has simply fabrication process and high strength of manufacturing part. However, this method has a problem on the multi print-head system. Because multi-printing system has a other printing method compare with a single printing system. Therefore, we experiment a single head 3D printing and proposed a 3D printing method using a multi-piezo head.

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