• Title/Summary/Keyword: UV cross-linked

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Synthesis of a Triblock Copolymer Containing a Diacetylene Group and Its Use for Preparation of Carbon Nanodots

  • Kim, Beom-Jin;Oh, Dong-Kung;Chang, Ji-Young
    • Macromolecular Research
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    • v.16 no.2
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    • pp.103-107
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    • 2008
  • Carbon nanodots were prepared by the pyrolysis of a triblock copolymer. The triblock copolymer, poly(methyl methacrylate)-b-polystyrene-b-poly(methyl methacrylate) was synthesized by atom transfer radical polymerization using an initiator containing a diacetylene group. A polymer thin film on a mica substrate was prepared by spin-casting at 2,000 rpm from a 0.5 wt% toluene solution of the triblock copolymer. After drying, the cast film was vacuum-annealed for 48 h at $160^{\circ}C$. The annealed film formed a spherical morphology of polystyrene domains with a diameter of approximately 30 nm. The film was exposed to UV irradiation to induce a cross-linking reaction between diacetylene groups. In the subsequent pyrolysis at $800^{\circ}C$, the cross-linked polystyrene spheres were carbonized and the poly(methyl methacrylate) matrix was eliminated, resulting in carbon nanodots deposited on a substrate with a diameter of approximately 5 mn.

Formaldehyde-Free Durable Flame-Retardant Finish of Cotton Fabrics Using Vinyl Bisphosphonic Acid and Acrylamide (비닐이포스폰산과 아크릴아미드를 이용한 면직물의 포름알데히드-프리 내구성 방염가공)

  • Jang, Mi-Ji;Jang, Jinho
    • Textile Coloration and Finishing
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    • v.34 no.1
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    • pp.1-9
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    • 2022
  • The durable FR treatments such Pyrovatex and Proban have been used for cotton fibers, while the finishes involve toxic ammonia or formaldehyde release during finishing process or finished products. In this study, ecofriendly flame-retardant treatment of cotton fabrics was carried out using UV-curable formulations of Vinyl bisphosphonic acid (VBPA), Acrylaminide and Triacryloylhexahydro-1,3,5-triazine, as a monomer, a comonomer and a cross-linking agent respectively, which can introduce a cross-linked copolymer networks. With an optimal finish formulation, the flame retardancy of LOI 29.8 was maintained even after 10 laundering cycles. In TGA analysis, the DTGA peak decreased from 389℃ to 252℃ and the amount of char yield increased from 6.1% to 46.1% compared to the untreated cotton. In addition, MCC analysis showed that Peak HR and THR decreased by 59.4% and 69.2% respectively, compared to the untreated cotton. The pyrolysis and combustion behaviors of the FR-treated cotton implied a condensed-phase flame-retarding mechanism.

Embryo-Fetal Developmental Toxicity Study of Methoxycinnamidopropyl Polysilsesquioxane (Methoxycinnamidopropyl Polysilsesquioxane의 랫드를 이용한 배.태자 발생독성 연구)

  • Hong, Jeong-Sup;Lim, Jeong-Hyeon;Kim, Kang-Hyun;Park, Myeong-Kyu;Jo, Ki-Yeon;Park, Gil-Jong;Jung, Taek-Kyu;Kim, Ja-Young;Yoon, Kyung-Sup
    • Journal of the Society of Cosmetic Scientists of Korea
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    • v.37 no.3
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    • pp.247-256
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    • 2011
  • Existing organic UV protection materials seem to be problematic due to their penetration and irritation to skin. Inorganic UV protection materials are also at issue for safety of their nano-type transformation. Therefore, the recent studies of UV protection materials have been focused not only on the effectiveness but also on their safety. One of the UV protection materials in study which have higher safety is the organic-inorganic conjugation type UV protection material. Previously, we have reported the manufacturing process, physical property and UV protection efficiency of methoxychinnamidoprophy poloysilsesquixan as a new cross-linked polymer type UV protection material. In this study, we have evaluated the effect of the methoxychinnamidoprophy poloysilsesquixan on embryo-fetal development in SD rats. This study is expected to show some definite information related to the effect on pregnancy or embryo-fetal abnormality in case of the clinical exposure of the methoxychinnamidoprophy poloysilsesquixan.

Fabrication of SiCN microstructures for super-high temperature MEMS using photopolymerization and its characteristics (광중합에 의한 초고온 MEMS용 SiCN 미세구조물 제작과 그 특성)

  • Chung, Gwiy-Sang
    • Journal of Sensor Science and Technology
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    • v.15 no.2
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    • pp.148-152
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    • 2006
  • This paper describes the fabrication of SiCN microstructures for super-high temperature MEMS using photopolymerization of pre-ceramic polymer. In this work, polysilazane liquide as a precursor was deposited on Si wafers by spin coating, microstructured and solidificated by UV lithography, and removed from the substrate. The resulting solid polymer microstructures were cross-linked under HIP process and pyrolyzed to form a ceramic of withstanding over $1400^{\circ}C$. Finally, the fabricated SiCN microstructures were annealed at $1400^{\circ}C$ in a nitrogen atmosphere. Mechanical characteristics of the SiCN microstructure with different fabrication process conditions were evaluated. The elastic modules, hardness and tensile strength of the SiC microstructure implemented under optimum process condtions are 94.5 GPa, 10.5 GPa and 11.7 N/min, respectively. Consequently, the SiCN microstructure proposed in this work is very suitable for super-high temperature MEMS application due to very simple fabrication process and the potential possiblity of sophisticated mulitlayer or 3D microstructures as well as its good mechanical properties.

Fabrication SiCN micro structures for extreme high temperature systems (초고온 시스템용 SiCN 마이크로 구조물 제작)

  • Thach, Phan Dui;Chung, Gwiy-Sang
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2009.06a
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    • pp.216-216
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    • 2009
  • This paper describes a novel processing technique for the fabrication of polymer-derived SiCN (silicone carbonitride) microstructures for extreme microelectromechanical system (MEMS) applications. A polydimethylsiloxane (PDMS) mold was formed on an SU-8 pattern using a standard UV photolithographic process. Next, the liquid precursor, polysilazane, was injected into the PDMS mold to fabricate free-standing SiCN microstructures. Finally, the solid polymer SiCN microstructure was cross-linked using hot isostatic pressure at $400^{\circ}C$ and 205 bar. The optimal pyrolysis and annealing conditions to form a ceramic microstructure capable of withstanding temperatures over $1400^{\circ}C$ were determined. Using the optimal process conditions, the fabricated SiCN ceramic microstructure possessed excellent characteristics includingshear strength (15.2 N), insulation resistance ($2.163{\times}10^{14}\;{\Omega}$, and BDV (1.2 kV, minimum). Since the fabricated ceramic SiCN microstructure has improved electrical and physical characteristics compared to bulk Si wafers, it may be applied to harsh environments and high-power MEMS applications such as heat exchangers and combustion chambers.

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Influence of Neutral Particle Beam Energy on the Structural Properties of Amorphous Carbon Films Prepared by Neutral Particle Beam Assisted Sputtering

  • Lee, Dong-Hyeok;Jang, Jin-Nyeong;Gwon, Gwang-Ho;Yu, Seok-Jae;Lee, Bong-Ju;Hong, Mun-Pyo
    • Proceedings of the Korean Vacuum Society Conference
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    • 2011.02a
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    • pp.194-194
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    • 2011
  • The effects of argon neutral beam (NB) energy on the amorphous carbon (a-C) films were investigated, while the a-C films were deposited by neutral particle beam assisted sputtering (NBAS) system. The energy of neutral particle beam can be controlled by reflector bias voltage directly as a unique operating parameter in this system. The deposition characteristics of the films investigated of Raman spectra, UV-visible spectroscopy, electrical conductivity, stress measurement system, and ellipsometer indicate the properties of amorphous carbon films can be manipulated by only NB energy (or reflector bias voltage) without changing any other process parameters. We report the effect of reflector bias voltage in the range from 0 to -1KV. By the increase of the reflector bias voltage, the amount of cross-linked sp2 clusters as well as the sp3 bonding in the a-C film coated by the NBAS system can be increased effectively and the composition of carbon thin films can be changed from nano-crystalline graphite phase to amorphous carbon phase.

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Fabrication of SiCN microstructures for super-high temperature MEMS using PDMS mold and its characteristics (PDMS 몰드를 이용한 초고온 MEMS용 SiCN 미세구조물 제작과 그 특성)

  • Chung, Gwiy-Sang;Woo, Hyung-Soon
    • Journal of Sensor Science and Technology
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    • v.15 no.1
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    • pp.53-57
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    • 2006
  • This paper describes a novel processing technique for fabrication of polymer-derived SiCN (silicone carbonitride) microstructures for super-temperature MEMS applications. PDMS (polydimethylsiloxane) mold is fabricated on SU-8 photoresist using standard UV photolithographic process. Liquid precursor is injected into the PDMS mold. Finally, solid polymer structure is cross-linked using HIP (hot isostatic pressure) at $400^{\circ}C$, 205 bar. Optimum pyrolysis and annealing conditions are determined to form a ceramic microstructure capable of withstanding over $1400^{\circ}C$. The fabricated SiCN ceramic microstructure has excellent characteristics, such as shear strength (15.2 N), insulation resistance ($2.163{\times}10^{14}{\Omega}$) and BDV (min. 1.2 kV) under optimum process condition. These fabricated SiCN ceramic microstructures have greater electric and physical characteristics than bulk Si wafer. The fabricated SiCN microstructures would be applied for supertemperature MEMS applications such as heat exchanger and combustion chamber.

Fabrication of SiCN Microstructures for Super-High Temperature MEMS and Its Characteristics (초고온 MEMS용 SiCN 미세구조물 제작과 그 특성)

  • Lee, Gyu-Chul;Chung, Gwiy-Sang
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2006.06a
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    • pp.392-393
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    • 2006
  • This paper describes the fabrication of SiCN microstructures for super-high temperature MEMS using photopolymerization of pre-ceramic polymer. In this work. polysilazane liquide as a precursor was deposited on Si wafers by spin coating. microstructured and solidificated by UV lithography. and removed from the substrate. The resulting solid polymer microstructures were cross-linked under HIP process and pyrolyzed to form a ceramic of withstanding over $1400^{\circ}C$. Finally, the fabricated SiCN microstructures were annealed at $1400^{\circ}C$ in a nitrogen atmosphere. Mechanical characteristics of the SiCN microstructure with different fabrication process conditions were evaluated. The elastic modules. hardness and tensile strength of the SiC microstructure implemented under optimum process conditions are 94.5 GPa, 10.5 GPa and 11.7 N/min, respectively. Consequently, the SiCN microstructure proposed in this work is very suitable for super-high temperature MEMS application due to very simple fabrication process and the potential possiblity of sophisticated multlayer or 3D microstructures as well as its good mechanical properties.

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Preparation of IPN-type Polyelectrolyte Films Attached to the Electrode Surface and Their Humidity-Sensitive Properties (전극 표면에 부착된 IPN 형태의 전해질 고분자의 제조 및 그들의 감습특성)

  • Han, Dae-Sang;Gong, Myoung-Seon
    • Polymer(Korea)
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    • v.34 no.6
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    • pp.565-573
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    • 2010
  • Copoly(2-(dimethylamino)ethyl methacrylate)(DAEMA)/butyl acrylate (BA) and copoly(methyl methacrylate)(MMA)/BA/2-(cinnamoyloxy)ethyl methacryate (CEMA), which were cross-linked with dibromoalkane and UV irradiation, respectively, were prepared for the precursors of interpenetrating polymer network (IPN) humidity-sensitive films. 3-(Triethoxysilyl)propyl cinnamate (TESPC) was used as a surface-pretreating agent for the attachment of IPN-polyelectrolyte to the electrode surface by UV irradiation. Humidity sensitive polymeric thin films with an IPN structure were prepared by crosslinking reactions of copoly(DAEMA/BA) with 1,4-dibromobutane (DBB) and copoly(MMA/BA/CEMA) by UV-irradiation. The anchoring of an IPN-polyelectrolyte into the substrate was carried out via the photochemical $[2{\pi}+2{\pi}]$ cycloaddition. The resulting humidity sensors showed a high sensitivity in the range of 20~95%RH and a small hysteresis (<1.5%RH). The response time for adsorption and desorption process at 33~94%RH was 48 and 65 s, respectively, indicating a fast response. The effects of the concentration of copolymers, molar ratio of crosslinking agents and time of the precursor solution for dip-coating on their humidity sensitive properties including water durability were investigated.

Preparation of Polyacrylate-Based Non-Reinforced Anion Exchange Membranes via Photo-Crosslinking for Reverse Electrodialysis (역전기투석용 광가교형 폴리아크릴레이트계 음이온교환막 제조)

  • Tae Hoon Kim;Seok Hwan Yang;Jang Yong Lee
    • Membrane Journal
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    • v.34 no.1
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    • pp.70-78
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    • 2024
  • A photo-crosslinked anion exchange membrane (AEM) based on quaternary-aminated polyacrylates was developed for reverse electrodialysis (RED). Although reverse electrodialysis is a clean and renewable energy generation system, the low power output and high membrane cost are serious obstacles to its commercialization. Cross-linked AEMs without any polymer supporters were fabricated through photo-crosslinking between polymer-typed acrylates with anion conducting groups, in particular, polymer-typed acrylates were synthesized based on engineering plastic with outstanding mechanical and chemical property. The fabricated membranes showed outstanding physical, chemical, and electrochemical properties. The area resistance of the fabricated membranes (CQAPPOA-20, CQAPPOA-35, and CQAPPOA-50) were ~50% lower than that of AMV (2.6 Ω cm2). Moreover, the transport number of CQAPPOA-35 wase comparable to that of AMV, despite the thin thickness (40 ㎛) of the fabricated membranes. The RED stack with the CQAPPOA-35 membrane provided an excellent maximum power density of 2.327 W m-2 at a flow rate of 100 mL min-1, which is 15% higher than that (2.026 W m-2) of the RED stack with the AMV membrane. Considering easy fabrication process by UV photo-crosslinking and outstanding RED stack properties, the CQAPPOA-35 membrane is a promising candidate for REDs.