• Proceedings of the Korean Society of Precision Engineering Conference
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• 2013.05a
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• pp.579-580
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• 2013

• Journal of Korean Society of Environmental Engineers
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• v.33 no.3
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• pp.149-156
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• 2011

This experimental design and response surface methodology (RSM) have been applied to the investigation of the electro-UV-ultrasonic complex process for the disinfection of E. coli in the water. The disinfection reactions of electro-UV-ultrasonic process were mathematically described as a function of parameters power of electrolysis ($X_1$), UV ($X_2$), and ultrasonic process ($X_3$) being modeled by use of the Box-Behnken technique, which was used for fitting 2nd order response surface model. The application of RSM yielded the following regression equation, which is empirical relationship between the residual E. coli number (Ln CFU) in water and test variables in coded unit: residual E. coli number (Ln CFU) = 23.69 - 3.75 Electrolysis - 0.67 UV - 0.26 Ultrasonic - 0.16 Electrolysis UV + 0.05 Electrolysis Ultrasonic + 0.27 $Electrolysis^2$ + 0.14 $UV^2$ - 0.01 $Ultrasonic^2$). The model predictions agreed well with the experimentally observed result ($R^2$ = 0.983). Graphical 2D contour and 3D response surface plots were used to locate the optimum range. The estimated ridge of maximum response and optimal conditions for residual E. coli number (Ln CFU) using 'numerical optimization' of Design-Expert software were 1.47 Ln CFU/L and 6.94 W of electrolysis, 6.72 W of UV and 14.23 W of ultrasonic process. This study clearly showed that response surface methodology was one of the suitable methods to optimize the operating conditions and minimize the residual E. coli number of the complex disinfection.

• Journal of Environmental Science International
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• v.13 no.1
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• pp.41-45
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• 2004

In this study, The decomposition of gas-phase Benzene and Toluene, Xylene in air streams by direct UV Photolysis, UV/TiO$_2$ and UV/TiO$_2$/A.C process was studied. The experiments were carried out under various UV light intensities and initial concentrations of B.T.X to investigate and compare the removal efficiency of the pollutant. B.T.X was determined by GC-FID of gas samples taken from the a glass sampling bulb which was located at reactor inlet and outlet by gas-tight syringe. From this study, the results indicate that UV/TiO$_2$/A.C system (photooxidation-photocatalytic oxidation-adsorption process) is ideal for treatment of B.T.X from the small workplace. Although the results needs more verifications, the methodology seems to be reasonable and can be applied for various workplace (laundry, gas station et al.).

• Korean Chemical Engineering Research
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• v.43 no.3
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• pp.393-400
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• 2005

A novel evaluation method was investigated for measuring the ability of acid amplification of acid amplifier. The method was based on the measurement of conductivity change by the acid generation according to UV radiation. It was found that the decrease of conductivity was caused by photopolymerization of epoxy monomer during UV curing process of ink film and by the rate of UV curing. In this paper, the novel acid amplifiers were synthesized and measured thermal stability by means of DSC. It was found that mono-type acid amplifiers were more stable than di-type. It was possible to make the dynamical evaluation of the curing rate of UV curable ink in curing process by this method.

• Journal of Korean Society of Environmental Engineers
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• v.34 no.7
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• pp.459-466
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• 2012

In order to improved treatment performance of dielectric barrier discharge (DBD) plasma, plasm + UV process and gas-liquid mixing method has been investigated. This study investigated the degradation of N, N-Dimethyl-4-nitrosoaniline (RNO, indicator of the generation of OH radical). The basic DBD plasma reactor of this study consisted of a plasma reactor (consist of quartz dielectric tube, titanium discharge (inner) and ground (outer) electrode), air and power supply system. Improvement of plasma reactor was done by the combined basic plasma reactor with the UV process, adapt of gas-liquid mixer. The effect of UV power of plasma + UV process (0~10 W), gas-liquid mixing existence and type of mixer, air flow rate (1~6 L/min), range of diffuser pore size (16~$160{\mu}m$), water circulation rate (2.8~9.4 L/min) and UV power of improved plasma + UV process (0~10 W) were evaluated. The experimental results showed that RNO degradation of optimum plasma + UV process was 7.36% higher than that of the basic plasma reactor. It was observed that the RNO decomposition of gas-liquid mixing method was higher than that of the plasma + UV process. Performance for RNO degradation with gas-liquid mixing method lie in: gas-liquid mixing type > pump type > basic reactor. RNO degradation of improved reactor which is adapted gas-liquid mixer of diffuser type showed increase of 17.42% removal efficiency. The optimum air flow rate, range of diffuser pore size and water circulation rate for the RNO degradation at improved reactor system were 4 L/min, 40~$100{\mu}m$ and 6.9 L/min, respectively. Synergistic effect of gas-liquid mixing plasma + UV process was found to be insignificant.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.17 no.2
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• pp.47-53
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• 2018

Nowadays, additive manufacturing (AM) technology is a promising process to fabricate complex shaped devices applied in medical and dental services. Among the AM processes, a DLP (digital light processing) type 3D printing process has some advantages, such as high precision, relatively low cost, etc. In this work, we propose a simple method to fabricate precise dental models using a DLP 3D printer. After 3D printing, a part is commonly post-cured using secondary UV-curing equipment for complete polymerization. However, some shrinkage occurs during the post-curing process, so we adaptively control the UV-exposure time on each layer for over- or under-curing to change the local shape-size of a part in the DLP process. From the results, the shrinkage amounts in the post-curing process vary due to the UV-dose in 3D printing. We believe that the proposed method can be utilized to fabricate dental models precisely, even with a change of the 3D CAD model.

• 제어로봇시스템학회:학술대회논문집
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• 2005.06a
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• pp.2160-2163
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• 2005

Solid freeform fabrication (SFF) technology plays a major role in industry and represents a reasonable percentage of industrial rapid prototyping/tooling/manufacturing (RP/RT/RM) development applications. However, SFF technology still has long way to progress to achieve satisfactory process speed, surface finish and overall quality improvement of its application. Today, three dimensional printing (3DP) technique that is one of SFF technology is receiving many interests, and is applied by various fields. It can fabricate three dimensional objects of solid freeform with high speed and low cost using ink jet printing technology. However, need long curing time after manufacture completion. And it must do post-processing process necessarily to heighten strength of objects because strength of fabricated objects is very weak. Therefore, in this study, we proposed an improved 3DP process that can solve problems of conventional 3DP process. The general 3DP process is method to spout binder simply through printer head on powder, but proposed process is method to cure jetted UV resin by UV lamp after jet UV resin using printhead on powder. The hardening of resin is achieved strongly at early time by UV lamp in proposed method. So, the proposed process can fabricate three dimensional objects with high speed without any post-processing.

• Journal of Korean Society of Water and Wastewater
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• v.26 no.2
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• pp.219-228
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• 2012

Problems due to the taste and odor in drinking water are common in treatment facilities around the world. Taste and odor are perceived by the public as the primary indicators of the safely and acceptability of drinking water, and are mainly caused by the presence of two semi-volatile compounds-2-methylisoborneol(2-MIB) and geosmin. Conventional treatment processes in water treatment plants, such as coagulation, sedimentation and chlorination have been found to be ineffective for the removal of 2-MIB and geosmin. Pulse UV system is a new UV irradiation system that is a non-mercury lamp-based alternative to currently used continuous wave systems for water disinfection. This study shows pulse UV system to be effective in treatment of these two compounds. Geosmin removal efficiency of UV process alone achieved approximately 70% at 10sec contact time. 2-MIB removal efficiency of UV only process achieved approximately 60% at 10sec contact time. The addition of $H_{2}O_{2}$ 7mg/L increased geosmin and 2-MIB removal efficiency upto approximately 94% and 91%, respectively.

• Proceedings of the KSME Conference
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• 2003.04a
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• pp.1069-1072
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• 2003

Ultraviolet-nanoimprint lithography (UV-NIL) is a promising nanoimprint method for cost-effectively defining nanometer scale structures at room temperature and low pressure. Nanostamp fabrication technology is a key technology for UV-NIL because fabricating a high resolution nanostamp is the first step for defining high resolution nanostructures in a substrate. We used quartz as an UV transparent stamp material for the UVNIL. A $5{\times}5{\times}0.09$ inch stamp was fabricated using the quartz etch process in which Cr film was used as a hard mask for transferring nanostructures into the quartz. In this paper, we describe the quartz etching process and discuss the results including SEM images.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.199-202
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• 2003

Ultraviolet-nanoimprint lithography (UV-NIL) is a promising method for cost-effectively defining nanoscale structures at room temperature and low pressure. Since the resolution of nanostructures depends strongly upon that of nanostamps, the nanostamp fabrication technology is a key technology to UV-NIL. In this paper, a 5$\times$5$\times$0.09 in. quartz stamp whose critical dimension is 377 nm was fabricated using the etch process in which a Cr film was employed as a hard mask for transferring nanostructures onto the quartz plate. To effectively apply tile fabricated 5-in. stamp to UV-NIL on a 4-in. Si wafer, we have proposed a new UV-NIL process using a multi-dispensing method as a way to supply resist on a wafer Experiments have shown that the multi-dispensing method can enable UV-NIL rising a large-area stamp.