• Journal of the Korea Academia-Industrial cooperation Society
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• v.15 no.11
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• pp.6464-6471
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• 2014

The UV curing method is a popular process for lens molding on a unit wafer. This process, however, has several drawbacks including wafer adhesion during the ejection process after curing, errors in lens shape and wafer warpage due to material shrinkage during the curing process, and lens centering errors on both sides of a wafer. Among these, the lens shape error and warpage are influenced directly by the UV curing process due to factors including the UV radiation uniformity, the degree of cure according to UV intensity, and the shrinkage characteristics of the material. Therefore, a theory is needed not only to understand the change in the material characteristics, such as the shrinkage rate due to the curing reaction, but also to establish a model. In addition, an analysis system is needed to realize the model. This study proposes a new analysis method for the wafer lens molding process by Comsol modeling. This method was verified by comparing the results with those of the actual process.

• Journal of the Korean Society for Precision Engineering
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• v.26 no.8
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• pp.24-28
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• 2009

• Journal of the Microelectronics and Packaging Society
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• v.25 no.4
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• pp.53-58
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• 2018

Since the scaling-down of IC devices has been reached to their physical limitations, several innovative packaging technologies such as 3D packaging, embedded packaging, and fan-out wafer level packaging (FOWLP) are actively studied. In this study the fabrication of organic-inorganic dielectric material was evaluated for the use of multi-structured redistribution layers (RDL) in FOWLP. Compared to current organic dielectrics such as PI or PBO an organic-inorganic hybrid dielectric called polysilsesquioxane (PSSQ) can improve mechanical, thermal, and electrical stabilities. polysilsesquioxane has also an excellent advantage of simultaneous curing and patterning through UV exposure. The polysilsesquioxane samples were fabricated by spin-coating on 6-inch Si wafer followed by pre-baking and UV exposure. With the 10 minutes of UV exposure polysilsesquioxane was fully cured and showed $2{\mu}m$ line-pattern formation. And the dielectric constant of cured polysilsesquioxane dielectrics was ranged from 2.0 to 2.4. It has been demonstrated that polysilsesquioxane dielectric can be patterned and cured by UV exposure alone without a high temperature curing process.

• Proceedings of the Materials Research Society of Korea Conference
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• 2012.05a
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• pp.81.1-81.1
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• 2012

나노임프린트 리소그라피(Nano-Imprint Lithography, NIL) 기술은 기판위의 resin을 나노구조물이 각인된 스탬프로 눌러서 나노구조물을 형성하는 기술로, 경제적이고 효과적으로 나노구조물을 제작할 수 있는 기술이다. 그중에서도 UV 기반의 나노임프린트(UV-NIL) 기술은 resin을 투명한 스탬프로 누른뒤 UV로 경화시켜 나노구조물을 형성하는 기술로써 고온, 고압($140{\sim}180^{\circ}C$, 10~30bar)이 필요한 가열식 나노임프린트 기술에 비해 상온, 상압($20^{\circ}C$, 1bar)에서도 구조물 형성이 가능하여 다층구조 형성에 적합하다. 연속적인 임프린팅 공정에 의해 resin이 quarz 스탬프에 잔류하여 패터닝에 결함을 유발하게 되므로 오염물을 제거하기 위한 세정공정이 필요하다. 하지만 UV에 의해 경화된 resin은 cross-linking을 형성하여 화학적인 내성이 증가하게 되므로 제거하기가 어렵다. 현재는 resin 제거를 위한 세정공정으로 SPM($H_2SO_4/H_2O_2$) 세정이 사용되고 있는데 세정시간이 길고 세정 후에 입자 또는 황 잔유물이 남으며 많은 유해용액 사용의 문제점이 있어 효과적으로 resin을 제거할 세정공정이 필요한 상황이다. 본 연구에서는 친환경적인 UV 세정 및 오존수 세정공정을 적용하여 경화된 resin을 제거하는 연구를 진행하였다. 실험샘플은 약 100nm 두께의 resin을 증착한 $1.5cm{\times}1.5cm$ $SiO_2$ 쿠폰 wafer를 사용하였으며, UV 및 오존수의 처리시간을 달리하여 resin 제거효율을 평가하였다. ATR-FTIR 장비를 사용하여 시간에 따른 resin의 두께를 측정한 결과, UV 세정으로 100nm 높이의 resin중에 80nm의 bulk resin이 단시간에 제거가 되었고 나머지 20nm의 resin thin film은 오존수 세정으로 쉽게 제거되는 것을 확인 하였다. 또한 표면에 남은 resin residue와 particle을 제거하기 위해서 SC-1 세정을 진행하였고 contact angle과 optical microscope 장비를 사용하여 resin이 모두 제거된 것을 확인하였다.

• Journal of the Korean Applied Science and Technology
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• v.29 no.1
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• pp.159-173
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• 2012

UV-Curing technology can be classified into two categories for radical curing and cation curing. It also has mainly focused on surface finishing technology to improve functionality of various substrates such as plastics and metals. On the other hand, EB technology has dealt with cross-linking reactions as well as polymerization process to create novel functional materials. Both technologies have advantages in energy utilizing efficiency and environmental friendly when compared to conventional thermoset coatings. Consequently, UV cured coatings also permits a reduction in the $CO_2$ and VOCs emitted in the drying and curing process. This review mainly shows radical curing technology which is commonly used in UV curing coatings and also describes the technology trends of cation curing which has been attracted attention recently.

• Journal of the Korean Society for Precision Engineering
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• v.31 no.10
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• pp.873-879
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• 2014

UV curable adhesives with different acrylic functionalities were synthesized for temporary bonding and debonding process in 3D multi-chip packaging process. The aim is to study various factors which have an influence on UV curing. The properties and curing behaviors were investigated by gel fraction, peel strength, probe tack, and shear adhesion failure temperature. The results show that the properties and curing behaviors are dependent on not only acrylic functionalities of binders but also UV doses and coating thickness.

• Applied Chemistry for Engineering
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• v.24 no.2
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• pp.148-154
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• 2013

UV curable acryl resin, pressure-sensitive adhesives (PSAs), are used in many different parts in the world. In particular, PSAs has been used in the wafer manufacturing process of semiconductor industry. As wafers become much thinner, UV curable PSAs require more proper adhesion performance. In this study, acrylic PSAs containing hydroxyl groups were synthesized using monomers of 2-ethylhexyl acrylate, 2-ethylhexyl methacrylate, styrene monomer and 2-hydroxyethyl acrylate. Isocyanate modified UV curable PSAs were then prepared by the adduct reaction that facilitates the UV curing property via controlling the amount of methacryloyloxyehtyl isocyanate. The proper adhesion performance and UV curing behavior of UV curable PSAs with various hydroxyl values were studied, and experimental conditions were then optimized to raise the efficiency of wafer manufacturing process. It was found that in case of using the equivalent ratio of 1 : 1 isocyanate hardener used in the UV curable PSAs, the peel strength before the UV curing process decreased as the amount of hydroxyl groups increased in the PSAs. The peeling adhesive strength was also decreased with increasing UV dose due to high curing characteristics.

• Clean Technology
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• v.16 no.4
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• pp.245-253
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• 2010

Optimum conditions for UV-radiated photopolymerization of unsaturated polyester that could be used as protecting layer of large diameter pipe were investigated in this paper. UV photopolymerization method was selected to solve the problems, arising when thermal polymerization by organic peroxide was used, such as the instability of peroxide initiator, the evolution of volatile organic compound, and thermal deformation of product. Two of the photo-initiators (Irgacure 819 and Darocure 1173) well known for its penetrating ability deep into the polymer layer were selected, and the optimum conditions for photopolymerization (1.5 phr initiator content, 1:1.2 initiator ratio, Ga lamp for UV source) were found from the thermal and mechanical test results of the resultant UP polymers. In addition, composite materials containing UP polymer and glass fiber were tested for hardness, impact strength, and flexural strength to find that the impact strength of composite significantly improved.

• Journal of Convergence for Information Technology
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• v.7 no.1
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• pp.43-48
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• 2017

The design trend is changed with the times. The design trend of recent 21 century is eco-friendly design. The optical illusion design is a new trend of digital convergence era. In this study, optical illusion patterns were designed for furniture with eco-friendly UV-curable resin. The micro-patterns of optical illusion design were fabricated with the micro-mold which was mastered using a semiconductor micro-fabrication process by photolithography technique. The micro-patterns of optical illusion design were manufactured on PET film with a roll-to-roll process using a UV-curable resin. The manufactured PET film of optical illusion micro-pattern exhibits hologram effect, optical illusion effect, and texture of metal with the backside digital printing of metal tone. The furniture of new design concept so-called emotional furniture was manufactured with the various optical illusion design patterns. The optical illusion design patterns by UV mold prospect a new trend of interior design materials.

• Journal of Adhesion and Interface
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• v.19 no.2
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• pp.74-82
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• 2018

Many methods for cross-linking acrylic PSAs have been discussed previously. For high cross-linking density, epoxy functionalized monomer and methyl aziridines as cross-linking agents were used in this study. Additionally, photopolymerization using different UV doses was investigated to synthesize a binder because of its rapid productivity. FT-IR analysis, curing behaviours and adhesion performance were examined for the relationship between UV doses and temperature as curing conditions. According to the results, the gel fraction was over 50% even at $120^{\circ}C$ after UV curing at a dose of $800mJ/cm^2$. On the other hand, while gel fractions of all samples reached approximately 80% only at $180^{\circ}C$ in thermal curing for 1 hour, gel fractions of the samples after thermal curing for 3 hours increased rapidly above $120^{\circ}C$ regardless of UV doses and reached approximately 100% at $180^{\circ}C$. This means that the second cross-linking reaction, esterification, is mainly dependent on the curing temperature.