• Proceedings of the KIEE Conference
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• 2006.07c
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• pp.1725-1726
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• 2006

Multi-stacked HTS tapes are needed to conduct large current in the power application of superconducting machine. This paper deals with the transport current loss of multi-stacked YBCO coated conductor. YBCO coated conductor that was used in this experiment has two Cu layers above and below of YBCO layer for stabilization. Transport losses of four different stacks, single, 2 stack, 3 stack and 4 stack, were measured. Measured results were compared analytic equation suggested by Norris.

• Journal of the Semiconductor & Display Technology
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• v.17 no.4
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• pp.86-90
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• 2018

Standards related to express the non-flatness of a wafer are reviewed and discussed, for example, bow, warp, and sori. Novel wafer warpage measurement method is proposed for 3D stacked IC application. The new way measures heat transfer from a heater to a wafer, which is a function of the contact area between these two surfaces and in turn, this contact area depends on the wafer warpage. Measurement options such as heating from room temperature and cooling from high temperature were experimentally examined. The heating method was found to be sensitive to environmental conditions. The cooling technique showed more robust and repeatable results and the further investigation for the optimal cooling condition is underway.

• Current Optics and Photonics
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• v.7 no.2
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• pp.200-206
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• 2023

Near-infrared (NIR) sensing technology using CMOS image sensors is used in many applications, including automobiles, biological inspection, surveillance, and mobile devices. An intuitive way to improve NIR sensitivity is to thicken the light absorption layer (silicon). However, thickened silicon lacks NIR sensitivity and has other disadvantages, such as diminished optical performance (e.g. crosstalk) and difficulty in processing. In this paper, a pixel structure for NIR sensing using a stacked CMOS image sensor is introduced. There are two photodetection layers, a conventional layer and a bottom photodiode, in the stacked CMOS image sensor. The bottom photodiode is used as the NIR absorption layer. Therefore, the suggested pixel structure does not change the thickness of the conventional photodiode. To verify the suggested pixel structure, sensitivity was simulated using an optical simulator. As a result, the sensitivity was improved by a maximum of 130% and 160% at wavelengths of 850 nm and 940 nm, respectively, with a pixel size of 1.2 ㎛. Therefore, the proposed pixel structure is useful for NIR sensing without thickening the silicon.

• Journal of the Korean Society for Precision Engineering
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• v.21 no.1
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• pp.140-148
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• 2004

A novel rapid prototyping (RP) process, a full-automated transfer type variable lamination manufacturing process (Full-automated VLM-ST) has been developed. In the full-automated VLM-ST process, a vacuum chuck and a rectilinear motion system transfer the EPS foam material in the form of the plate with two pilot holes to the rotary supporting stage. The supplied material is then cut into an automated unit shape layer (AUSL) with a desired width, a desired length, a desired slope on the side surface, and a pair of reference shapes, which is called the guide shape (GS)’, including two pilot holes in accordance with CAD data through cutting in two steps using a four-axis synchronized hotwire cutter. Then, each AUSL is stacked by setting each AUSL with two pilot holes in the building plate with two pilot pins, and subsequently, adhesive is applied onto the top surface of the stacked AUSL by a bonding roller and pressure is simultaneously given to the bottom surface of the stacked AUSL. Finally, three-dimensional shapes are rapidly and automatically fabricated. This paper describes the method to generate guide shapes in AUSL data for the full-automated VLM-ST process. In order to examine the applicability of the method to generate guide shapes, three-dimensional shapes, such as a piston shape and a human head shape, are fabricated from the full-automated VLM-ST apparatus.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.18 no.11
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• pp.1767-1773
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• 1993

In this paper, the coupling characteristics as well as the self and the mutual Impedance of a two-element probe-fed stacked circular microstrip array antennas are presented. A full wave analysis for the structure is performed In the spectral domain using the vector Hankel transform(VHT). Also, we presented measured results for the impedance, the coupling characteristics of the antenna and the variation of the coupling with the distance between the two elements. Finally, the calculated and measured results are shown to agree well wlth each other through comparisons.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.17 no.10 s.113
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• pp.993-999
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• 2006

This paper presents the design simulation, implementation, and measurement of a miniaturized DCS, PCS / Satellite DMB dual-band stacked chip antenna with double coupled line for mobile communication terminals. A stacked meander is realized by using a via hole with height of 0.8 mm and a diameter of 0.35 mm to connect upper- and lower-layer meander sections for a reduction of the dimensions of the antenna. In addition the stacked meander chip antenna is extended by a double coupled-line to achieve two different radiation modes. A ratio of the first frequency and second frequency vary with the geometrical parameter of coupled lines. The fabricated antenna used FR-4 substrate with relative permittivity of 4.2. And its dimensions are $15.2{\times}7{\times}0.8mm^3$. The measured impedance bandwidth(VSRW<2) are 244 and 120 MHz at the operating frequency, respectively.

• KEPCO Journal on Electric Power and Energy
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• v.2 no.4
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• pp.589-593
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• 2016

Microbial fuel cell (MFC) can produce electricity from oxidation-reduction of organic and inorganic matters by electrochemically active bacteria as catalyst. Stacked MFCs have been investigated for overcoming low electricity generation of single MFC. In this study, two-typed stacked-MFCs (submerged-flat and stand-falt) were operated according to electrode connection for optimal stacked technology of MFC. In case of submerged-flat MFC with all separator electrode assembly (SEA) sharing anode chamber, MFC with mixed-connection showed more voltage loss than MFC with single-connection method. And MFC stacked in parallel showed better voltage production than MFC stacked in series. In case of stand-flat MFC, voltage loss was bigger when SEAs sharing anodic chamber only were connected in series. Voltage loss was decreased when SEAs parallel connected SEAs sharing anodic chamber were connected in series.

• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.433.1-433.1
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• 2014

The research of graphene, a monolayer of carbon atoms with honeycomb lattice structure, has explosively increased after appeared in 2004. As a result, its high transmittance, mobility, thermal conductivity, and outstanding mechanical and chemical stability have been proved. Especially, many researches were executed about the field of transparent electrode highlighting material of substituting the indium tin oxide (ITO). In addition, qualitative and quantitative improvements have been achieved due to many synthesis methods were discovered. Among them, mostly used method is chemical vapour deposition of graphene grown on copper or nickel. The transmittance, mobility, sheet resistance, and other many properties are completely changed according to these two types of synthesis method of graphene. In this research, considering the difference of characteristics as the synthesis method of graphene, what types of graphene should be used and how to use it were studied. The stacked graphene harvested on copper and multi-layer graphene harvested on nickel were compared and analyzed, as a result, the transmittance of 90% and the sheet resistance of $70{\Omega}{\square}$ was showed even though stacked graphene layers were 4 layers. The reason that could bring these results is lowered sheet resistance due to stacked monolayer graphenes. Moreover, light output power of the three stacked graphene spreading layer shows the highest value, but light-emitting diode with multi-layer graphene died out from 12mA due to also its high sheet resistance. Therefore, we need to clarify about what types of graphene and how to use the graphene in use.

• Journal of the Institute of Electronics Engineers of Korea TC
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• v.44 no.1
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• pp.155-161
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• 2007

This paper presents the design simulation, implementation, and measurement of a miniaturized PCS / Satellite DMB dual-band stacked mompole antenna with a parasitic patch for mobile communication terminals. A stacked helix is realized by using a via hole with height of 0.4 mm and a diameter of 0.35 mm to connect upper- and lower-layer helix sections for a reduction of the dimensions of the antenna. In addition the stacked helix chip antenna is interleaved with a parasitic patch to achieve two different radiation modes. The ratio of the first frequency and the second frequency vary with the geometrical parameter of the parasitic patch. The fabricated antenna uses FR-4 substrate with a relative permittivity of 4.2. Its dimensions are $15.5{\times}7.6{\times}0.4 mm^3$. The measured impedance bandwidths (VSWR<2) are 240 and 250 MHz at the operating frequencies, respectively.

• Journal of Information Display
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• v.11 no.4
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• pp.140-143
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• 2010

A simple and versatile method of fabricating color patterns in two-dimension (2D) and three-dimension (3D) was developed using the selective-wettability approach. Red, green, and blue color elements are sequentially formed on a single substrate in a pattern-by-pattern and/or pattern-on-pattern fashion, through a simple coating process. Either 2D or 3D structures in an array format are produced by controlling the thickness of the hydrophobic layer (HL) coating a substrate within the framework of wetting transition. Moreover, it was demonstrated that the stacked geometry of two successive patterns can be easily tailored for various types of color arrays, with the pattern fidelity of a few tens of nanometers in terms of only a parameter of the HL thickness.