• Journal of the Optical Society of Korea
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• v.17 no.1
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• pp.33-37
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• 2013

In this study a new design concept of the Fabry-Perot filter, constructed with an anisotropic space layer and a couple of isotropic mirrors, was proposed based on the Maxwell equations and the characteristic matrix method. The single- and double-cavity Fabry-Perot filters were designed, and their optical properties were investigated with a developed software package. In addition, the dependence of the transmittance and phase shift for two orthogonal polarization states on the column angle of the anisotropic space layer and the incidence angle were discussed. We demonstrated that the polarization state of electromagnetic waves and phase shifts can be modulated by exploiting an anisotropic space layer in a polarization F-P filter. Birefringence of the anisotropic space layer provided a sophisticated phase modulation with varied incidence angles over a broad range, resulting in a wide-angle phase shift. This new concept would be useful for designing optical components with isotropic and anisotropic materials.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.21 no.7
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• pp.71-76
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• 2022

This study describes an evaluation of the vibration-level reduction effect of natural rubber inserted between two aluminum blocks, in which the modal parameters are predicted using two different damping systems. A numerical model with two degrees of freedom was established for both the cases. One was an eigenvalue problem analysis using a state space method and general viscous damping, whereas the other was a method using hysteretic damping. The modal parameters obtained from these two approaches were compared with those obtained from the finite element method using a commercial package. As a result, the natural frequencies observed in the complex frequency response curve were consistently less than the average of four percents. The damping ratios also showed good agreement within a reasonable range. However, the hysteretic damping system showed a relatively larger difference for all modal parameters. This suggests that the analysis procedure makes it easier to predict the vibration transmission characteristics of the shape and configuration of any cushioning layer.

• The Journal of the Acoustical Society of Korea
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• v.34 no.6
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• pp.470-478
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• 2015

A heuristic method treating a layered ocean bottom in a ray modeling is to use the plane wave reflection coefficient for multiple-layered structure, named an one-layer assumption in this paper. We examine the validity of one-layer assumption in the case of two-layered ocean bottom, and obtain a simple inequality condition depending on the sound speed ratio, the ratio of layer thickness to source-receiver range, and the grazing angle of first reflected ray. From this inequality condition, it is shown that an one-layer assumption can be applicable to ray propagation problems at mid frequencies. Finally, numerical experiments are performed in the ocean environment similar to the East Sea in Korea. Incoherent transmission loss is calculated by the geometrical beam model with the plane wave reflection coefficient for multiple-layered ocean bottom and compared with the result of SNUPE 2.0, which is a parabolic equation package developed in Seoul National University.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.1
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• pp.1-10
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• 2018

Recently, there has been rapid development in the field of flexible electronic devices, such as organic light emitting diodes (OLEDs), organic solar cells and flexible sensors. Encapsulation process is added to protect the flexible electronic devices from exposure to oxygen and moisture in the air. Using numerical simulation, we investigated the effects of the encapsulation layer on mechanical stability of the silicon chip, especially the fracture performance of center crack in multi-layer package for various loading condition. The multi-layer package is categorized in two type - a wide chip model in which the chip has a large width and encapsulation layer covers only the chip, and a narrow chip model in which the chip covers both the substrate and the chip with smaller width than the substrate. In the wide chip model where the external load acts directly on the chip, the encapsulation layer with high stiffness enhanced the crack resistance of the film chip as the thickness of the encapsulation layer increased regardless of loading conditions. In contrast, the encapsulation layer with high stiffness reduced the crack resistance of the film chip in the narrow chip model for the case of external tensile strain loading. This is because the external load is transferred to the chip through the encapsulation layer and the small load acts on the chip for the weak encapsulation layer in the narrow chip model. When the bending moment acts on the narrow model, thin encapsulation layer and thick encapsulation layer show the opposite results since the neutral axis is moving toward the chip with a crack and load acting on chip decreases consequently as the thickness of encapsulation layer increases. The present study is expected to provide practical design guidance to enhance the durability and fracture performance of the silicon chip in the multilayer package with encapsulation layer.

• Journal of Magnetics
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• v.20 no.3
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• pp.201-206
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• 2015

Using the Vienna ab initio simulation package (VASP) incorporating both semiempirical and nonlocal van der Waals interaction, the structural, adsorption, and magnetic properties of Ni/BN/Co systems were investigated. We proposed that the relative spin direction of Ni and Co magnets can be easily tuned, because the total energy difference between ferromagnetic (FM) and antiferromagnetic (AFM) states is small. Despite this feature, very interestingly, both Ni and Co layers manifest half-metallic state, whereas the spacer BN layer becomes weak metal for one monolayer (ML) thickness and an insulating barrier for two ML thicknesses. The half-metallic behavior of the magnetic layers seems very robust, because it is independent of the magnetic coupling between Ni and Co. This finding indicates that the Ni/BN/Co system can be used as a potential candidate for tunneling magnetoresistance system.

• Computers and Concrete
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• v.27 no.3
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• pp.199-210
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• 2021

The aim of this paper was to examine the continuous and discontinuous contact problems between the functionally graded (FG) layer pressed with a uniformly distributed load and homogeneous half plane using an analytical method and FEM. The FG layer is made of non-homogeneous material with an isotropic stress-strain law with exponentially varying properties. It is assumed that the contact at the FG layer-half plane interface is frictionless, and only the normal tractions can be transmitted along the contacted regions. The body force of the FG layer is considered in the study. The FG layer was positioned on the homogeneous half plane without any bonds. Thus, if the external load was smaller than a certain critical value, the contact between the FG layer and half plane would be continuous. However, when the external load exceeded the critical value, there was a separation between the FG layer and half plane on the finite region, as discontinuous contact. Therefore, there have been some steps taken in this study. Firstly, an analytical solution for continuous and discontinuous contact cases of the problem has been realized using the theory of elasticity and Fourier integral transform techniques. Then, the problem modeled and two-dimensional analysis was carried out by using ANSYS package program based on FEM. Numerical results for initial separation distance and contact stress distributions between the FG layer and homogeneous half plane for continuous contact case; the start and end points of separation and contact stress distributions between the FG layer and homogeneous half plane for discontinuous contact case were provided for various dimensionless quantities including material inhomogeneity, distributed load width, the shear module ratio and load factor for both methods. The results obtained using FEM were compared with the results found using analytical formulation. It was found that the results obtained from analytical formulation were in perfect agreement with the FEM study.

• Earthquakes and Structures
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• v.14 no.5
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• pp.399-409
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• 2018

The dynamic response and seismic damage of single-layer reticulated shells in the near field of a rupturing fault can be different from those in the far field due to the different characteristics in the ground motions. To investigate the effect, the dynamic response and seismic damage of this spatial structures subjected to two different ground motions were numerically studied by nonlinear dynamic response analysis. Firstly, twelve seismic waves with an apparent velocity pulse, including horizontal and vertical seismic waves, were selected to represent the near-fault ground motion characteristics. In contrast, twelve seismic records recorded at the same site from other or same events where the epicenter was far away from the site were employed as the far-fault ground motions. Secondly, the parametric modeling process of Kiewitt single-layer reticulated domes using the finite-element package ANSYS was described carefully. Thirdly, a nonlinear time-history response analysis was carried out for typical domes subjected to different earthquakes, followed by analyzing the dynamic response and seismic damage of this spatial structures under two different ground motions based on the maximum nodal displacements and Park-Ang index as well as dissipated energy. The results showed that this spatial structures in the near field of a rupturing fault exhibit a larger dynamic response and seismic damage than those obtained from far-fault ground motions. In addition, the results also showed that the frequency overlap between structures and ground motions has a significant influence on the dynamic response of the single-layer reticulated shells, the duration of the ground motions has little effects.

• Journal of Electrical Engineering and Technology
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• v.13 no.5
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• pp.2004-2010
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• 2018

We propose a small active antenna to receive Global Navigation Satellite System (GNSS) signals, i.e., Global Positioning System (GPS) L1 (1,575MHz) and Russian Global Navigation Satellite System (GLONASS) L1 (1,600 MHz) signals. A two-stage low-noise amplifier (LNA) with more than 27 dB gain is implemented in the bottom layer of a three-layer antenna package. In addition, a hybrid coupler is used to combine signals from pair of proximately coupled orthogonal feeds with $90^{\circ}$ phase difference to achieve the circular polarization (CP) characteristic. Three layers of high permittivity (${\varepsilon}_r=10$) substrates are stacked and effectively integrated to have a small dimension of $64mm{\times}64mm{\times}7.42mm$ (including both circuit and antenna). The reflection coefficient of the fabricated antenna at the target frequency is below -10 dB, the measured antenna gain is above 26 dBic and the measured noise figure is less than 1.4 dB.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.4
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• pp.53-58
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• 2013

An innovative packaging solution, Flip Chip with Copper (Cu) Column bond on lead (BOL) Enhanced Process (fcCuBE$^{(R)}$) delivers a cost effective, high performance packaging solution over typical bond on capture pad (BOC) technology. These advantages include improved routing efficiency on the substrate top layer thus allowing conversion functionality; furthermore, package cost is lowered by means of reduced substrate layer count and removal of solder on pad (SOP). On the other hand, as electronic packaging technology develops to meet the miniaturization trend from consumer demand, reliability testing will become an important issue in advanced technology area. In particular, electromigration (EM) of flip chip bumps is an increasing reliability concern in the manufacturing of integrated circuit (IC) components and electronic systems. This paper presents the results on EM characteristics on BOL and BOC structures under electrical current stressing in order to investigate the comparison between two different typed structures. EM data was collected for over 7000 hours under accelerated conditions (temperatures: $125^{\circ}C$, $135^{\circ}C$, and $150^{\circ}C$ and stress current: 300 mA, 400 mA, and 500 mA). All samples have been tested without any failures, however, we attempted to find morphologies induced by EM effects through cross-sectional analysis and investigated the interfacial reaction characteristics between BOL and BOC structures under current stressing. EM damage was observed at the solder joint of BOC structure but the BOL structure did not show any damage from the effects of EM. The EM data indicates that the fcCuBE$^{(R)}$ BOL Cu column bump provides a significantly better EM reliability.

• Tribology and Lubricants
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• v.11 no.5
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• pp.136-143
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• 1995

The effect of additive chemistry on the serface fatigue of gears was investigated using the FZG gear tester and fluids based on an API GL-5 grade oil. Surface fatigue lives were determined as a function of load and additive chemistry. At 1.52 GPa, the removal of the primary extreme pressure additive (EP) from the fully formulated gear oil decreased the fatigue life of gears slightly (4%), however, the removal of the primary antiwear additive (AW) decreased the fatigue life of gears significantly (83%). At 1.86 GPa, the removal of the EP additive from the fully formulated gear oil decresed the gear fatigue life 27%, however, the removal of the primary AW additive decreased the fatigue life of gears significantly (75%). Micropitting was the dominant surface morphology in the dedendum of gears tested With two oils at load stage: one using the complete additive package, and a second where the EP additive has been removed. However, spalling is the primary failure mode of gears tested without an AW additive independent of whether an EP agent was present. Surface analysis of pinion gears showed the formation of a mixed phosphate/phosphite-oxide layer on the surface of gears tested with fluids containing an AW. Formation of this layer seems to be key to long fatigue life.