• 한국재료학회지
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• 제30권2호
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• pp.99-104
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• 2020

Recent discoveries of ferroelectric properties in ultrathin doped hafnium oxide (HfO₂) have led to the expectation that HfO₂ could overcome the shortcomings of perovskite materials and be applied to electron devices such as Fe-Random access memory (RAM), ferroelectric tunnel junction (FTJ) and negative capacitance field effect transistor (NC-FET) device. As research on hafnium oxide ferroelectrics accelerates, several models to analyze the polarization switching characteristics of hafnium oxide ferroelectrics have been proposed from the domain or energy point of view. However, there is still a lack of in-depth consideration of models that can fully express the polarization switching properties of ferroelectrics. In this paper, a Zr-doped HfO₂ thin film based metal-ferroelectric-metal (MFM) capacitor was implemented and the polarization switching dynamics, along with the ferroelectric characteristics, of the device were analyzed. In addition, a study was conducted to propose an applicable model of HfO₂-based MFM capacitors by applying various ferroelectric switching characteristics models.

• 전자공학회논문지T
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• 제35T권1호
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• pp.7-13
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• 1998

Submicron급의 고집적 소자에서는 종래의 긴 채널 소자에서 생기지 않던 짧은 채널효과에 기인하는 2차원적인 영향으로 고온전자(hot carrier) 등이 발생하여 소자의 신뢰성을 저하시키는 요인이 되고 있어 이들의 발생을 최소화할 수 있는 다양한 형상의 소오스/드레인 구조가 연구되고 있다. 본 논문에서는 제작공정의 간략화, 소자규모의 미세화, 응답속도의 고속화에 적합한 소오스/드레인에 Schottky장벽 접합을 채택한 MOS형 트랜지스터를 제안하고, p형 실리콘을 이용한 소자의 제작을 통하여 동작특성을 조사하였다. 이 소자의 출력특성은 포화특성이 나타나지 않는 트랜지스터의 작용이 나타났으며, 전계효과 방식의 동작에 비하여 높은 상호콘덕턴스를 갖고 있는 것으로 나타났다. 여기서 고농도의 채널층을 형성하여 구동 전압을 낮게하고 높은 저항의 기판을 사용하므로서 드레인과 기판사이의 누설전류를 감소시키는 등의 개선점이 있어야 할 것으로 나타났다.

• 한국전기전자재료학회논문지
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• 제13권10호
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• pp.822-827
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• 2000

The Si-SiO$_2$interface trap and nitride bulk trap distribution of SONOSFET(polysilicon-oxide-nitride-oxide-semiconductor field effect transistor) NVSM (nonvolatile semiconductor memory) cell is investigated by single junction charge pumping method. The device was fabricated by 0.35㎛ standard logic fabrication process including the ONO stack dielectrics. The thickness of ONO dielectricis are 24$\AA$ for tunnel oxide, 74 $\AA$ for nitride and 25 $\AA$ for blocking oxide, respectively. By the use of single junction charge pumping method, the lateral profiles of both interface and memory traps can be calculated directly from experimental charge pumping results without complex numerical simulation. The interface traps were almost uniformly distributed over the whole channel region and its maximum value was 7.97$\times$10$\^$10/㎠. The memory traps were uniformly distributed in the nitride layer and its maximum value was 1.04$\times$10$\^$19/㎤. The degradation characteristics of SONOSFET with write/erase cycling also were investigated.