• 한국진공학회:학술대회논문집
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• 한국진공학회 2014년도 제46회 동계 정기학술대회 초록집
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• pp.95-95
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• 2014

An OLED(Organic Light-Emitting Diode) device based on the emissive electroluminescent layer a film of organic materials. OLED is used for many electronic devices such as TV, mobile phones, handheld games consoles. ULVAC's mass production systems are indispensable to the manufacturing of OLED device. ULVAC is a manufacturer and worldwide supplier of equipment and vacuum systems for the OLED, LCD, Semiconductor, Electronics, Optical device and related high technology industries. The SMD Series are single-substrate sputtering systems for deposition of films such as metal films and TCO (Transparent Conductive Oxide) films. ULVAC has delivered a large number of these systems not only Organic Evaporating systems but also LTPS CVD systems. The most important technology of thin-film encapsulation (TFE) is preventing moisture($H_2O$) and oxygen permeation into flexible OLED devices. As a polymer substrate does not offer the same barrier performance as glass substrate, the TFE should be developed on both the bottom and top side of the device layers for sufficient lifetimes. This report provides a review of promising thin-film barrier technologies as well as the WVTR(Water Vapor Transmission Rate) properties. Multilayer thin-film deposition technology of organic and inorganic layer is very effective method for increasing barrier performance of OLED device. Gases and water in the organic evaporating system is having a strong influence as impurities to OLED device. CRYO pump is one of the very useful vacuum components to reduce above impurities. There for CRYO pump is faster than conventional TMP exhaust velocity of gases and water. So, we suggest new method to make a good vacuum condition which is CRYO Trap addition on OLED evaporator. Alignment accuracy is one of the key technologies to perform high resolution OLED device. In order to reduce vibration characteristic of CRYO pump, ULVAC has developed low vibration CRYO pumps to achieve high resolution alignment performance between Metal mask and substrate. This report also includes ULVAC's approach for these issues.

• 정보처리학회논문지C
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• 제13C권7호
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• pp.873-880
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• 2006

최근 이동통신 기술의 발달과 다양한 네트워크의 중복, 사용자의 요구에 따라 기존의 cdma2000 네트워크와 WLAN의 연동과 같은 연구가 활발히 진행되고 있다. 또한, 이동환경에서 높은 전송률을 가진 WiBro 네트워크가 차세대 무선 접속망으로 부각되고 있으며, 이러한 WiBro-cdma2000 네트워크와의 연동은 기존의 WLAN-cdma2000 연동에 비해 높은 시너지 효과를 나타낼 것으로 예상된다. 이를 위해 본 논문에서는 WiBro-cdma2000 연동이 이루어질 경우 단말의 이동성 제공을 위해 패킷손실을 최소화한 L2 핸드오프 방안을 제시한다. 본 논문에서 제안한 L2 핸드오프 방안은 기존의 이동성 제공 방안이 L3 기반의 등록절차를 통한 방안이었음에 착안하여, L3 시그널링이 이루어지기 전, L2 연결설정과정에서 L2 메시지에 핸드오프 정보를 사용하여 패킷손실을 최소화하는 방안을 제시한다. 제안한 방안의 성능을 검증하기 위해 컴퓨터 시뮬레이션을 수행하였으며, 이를 통해 제안한 방안의 우수성을 검증하였다.

• 한국표면공학회지
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• 제49권1호
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• pp.54-61
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• 2016

Screen printing of commercially available Ag paste is the most widely used method for the front side metallization of Si solar cells. However, the metallization using Ag paste is expensive and needs high temperature annealing for reliable contact. Among many metallization schemes, Ni/Cu/Sn plating is one of the most promising methods due to low contact resistance and mass production, resulting in high efficiency and low production cost. Ni layer serves as a barrier which would prevent copper atoms from diffusion into the silicon substrate. However, Ni based schemes by electroless deposition usually have low thermal stability, and require high annealing process due to phosphorus content in the Ni based films. These problems can be resolved by adding W element in Ni-based film. In this study, Ni-W-P alloys were formed by electroless plating and properties of it such as sheet resistance, resistivity, specific contact resistivity, crystallinity, and morphology were investigated before and after annealing process by means of transmission line method (TLM), 4-point probe, X-ray diffraction (XRD), and Scanning Electron Microscopy (SEM).