• 제목/요약/키워드: Transmission joining

검색결과 68건 처리시간 0.026초

Nd:YAG 레이저를 이용한 폴리머의 투과접합에서 열 유동 및 열 변형 해석 (Numerical Analysis of Heat Flow and Thermal Deformation in Transmission Joining of Polymers Using Nd:YAG Laser)

  • 차상우;김진범;나석주
    • Journal of Welding and Joining
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    • 제24권6호
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    • pp.28-32
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    • 2006
  • Laser Transmission Joining (LTJ), which is a joining process of polymers by using different transmission rates of materials, was studied numerically. Unlike previous studies, energy loss by reflection at the surface was included. Besides, energy absorbed in the transparent substrate is also considered to increase the accuracy of the analytical results. Furthermore, thermal deformations of the substrates were also calculated. Temperature distribution of the substrates on the joining process could be effectively predicted by using the thermal analysis model developed, which could also analyze the rising phenomenon of the absorbing substrate by bulge effect. Calculated results show that temperature of the absorbing substrate is higher than that of transparent substrate when the laser is being radiated, and this temperature difference causes more thermal deformation in absorbing substrate, which results in the surface rise of the absorbing substrate. Comparison of calculated results with corresponding experimental results could confirm the validity of the numerical analysis model proposed.

폴리머의 레이저 투과접합 시 접합부의 기계적 성질에 관한 연구 (A Study on the Mechanical Properties of Joints in Laser Transmission Joining of Polymers)

  • 차상우;김진범;윤석환;나석주
    • Journal of Welding and Joining
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    • 제25권2호
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    • pp.43-48
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    • 2007
  • Laser Transmission Joining (LTJ) of plastics is a process in which light of suitable wavelength is transmitted through a transparent substrate that is in contact with an absorbing one. In this paper, LTJ is investigated by preliminary experiments from the viewpoint of mechanical engineering. To understand transmitting characteristics of each polymer substrate, transmission rate, reflection rate and absorption coefficient of polymer are measured by using a laser power-meter. Characteristics of joining in the spot welding and seam welding are investigated by measuring the fracture load. Fracture load increases in accordance to the laser power and irradiation time. However, when the laser power is over 60W and irradiation time over 4seconds, fracture load decreases. This phenomenon is probably due to heat-softening of materials. Besides, cavities are generated at a joint by evaporation of water molecules, which can be suppressed by introduction of a gap between two substrates.

자동차 자동변속기 부품의 레이저 용접 적용 (Laser Welding of Automotive Transmission Components)

  • 안영남;김철희
    • Journal of Welding and Joining
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    • 제29권6호
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    • pp.45-48
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    • 2011
  • In this research, laser welding of automotive transmission components was investigated to replace electron beam welding which is normally conducted under vacuum condition. Fiber laser welding was applied to the automotive transmission components - hub clutch and annulus gear. In the component welding, the laser welding parameters were optimized to eliminate spatters and the end crater. By applying laser welding to the transmission parts, the process time could be reduced up to 70% compared with the current electron beam welding process.

X-선 투과검사를 이용한 저항 점용접부 품질평가기법 (Weld Quality Evaluation Method for the Resistance Spot Welds using X-ray Transmission Inspection)

  • 이종대;이소정;방정환;윤길상;김목순;김준기
    • Journal of Welding and Joining
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    • 제32권6호
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    • pp.1-7
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    • 2014
  • For the resistance spot welds of CR1180 and GA1180 TRIP steels, the weld quality evaluation method using the digitalized X-ray transmission imaging apparatus was investigated in comparison with the crosssectional examination method. In the case of the resistance spot welding of CR1180, three circular regions, such as WZ(white zone), GZ(grey zone) and DZ(dark zone), appeared on X-ray image and they corresponded to the diameters of indentation mark, nugget and corona bond, respectively. The variation of X-ray transmission thickness due to the thickness variation of the weld seemed to be mainly responsible for the formation of those contrasts. The X-ray image contrast formed from the variation of transmission thickness at the outer border line of DZ could also enable the inspections of the notch shape, nonuniformity of the welding pressure and spatter from its sharpness, concentricity and the normal straight line, respectively. The X-ray image of the resistance spot weld of galvannealed GA1180 TRIP steel was very similar to that of CR1180 TRIP steel except the crown shaped outer border line of DZ which was considered to be due to the melting behavior of zinc having the boiling temperature even lower than the melting temperature of steel.

플렉서블 기판의 레이저 투과 용접 및 기계적 특성 평가 (Laser Transmission Welding of Flexible Substrates and Evaluation of the Mechanical Properties)

  • 고명준;손민정;김민수;나지후;주병권;박영배;이태익
    • 마이크로전자및패키징학회지
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    • 제29권2호
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    • pp.113-119
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    • 2022
  • 플렉서블, 웨어러블 디바이스 등을 포함한 차세대 전자 기기의 기계적 신뢰성 향상을 위하여 다양한 유연 접합부에서 높은 수준의 기계적 신뢰성이 요구되고 있다. 기존 고분자 기판 접합을 위한 에폭시 등의 유기 접착소재는 접합부 두께 증가가 필연적이며, 반복 변형, 고온 경화에 의한 열기계적 파손 문제를 수반한다. 따라서 유연 접합을 위해서 접합부 두께를 최소화하고 열 손상을 방지하기 위한 저온 접합 공정 개발이 요구된다. 본 연구에서는 플렉서블 기판의 유연, 강건, 저 열 손상 접합이 가능한 플렉서블 레이저 투과 용접(flexible laser transmission welding, f-LTW)를 개발하였다. 유연 기판 위 탄소나노튜브(carbon nanotube, CNT)를 박막 코팅하여 접합부 두께를 줄였으며, CNT 분산 빔 레이저 가열을 통한 고분자 기판 표면의 국부적 용융 접합 공정이 개발되었다. 짧은 접합 공정 시간과 기판의 열 손상을 최소화하는 레이저 공정 조건을 구축하였으며 고분자 기판과 CNT 접합 형성 메커니즘을 분석하였다. 또한 접합부의 강건성 및 유연성 평가를 위해 인장강도 시험, 박리 시험과 반복 굽힘 시험을 진행하였다.

폴리머 마이크로 장치에 대한 레이저 투과 마이크로 접합 (Analysis of Transmission Infrared Laser Bonding for Polymer Micro Devices)

  • 김주한;신기훈
    • Journal of Welding and Joining
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    • 제23권5호
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    • pp.55-60
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    • 2005
  • A precise bonding technique, transmission laser bonding using energy transfer, for polymer micro devices is presented. The irradiated IR laser beam passes through the transparent part and absorbed on the opaque part. The absorbed energy is converted into heat and bonding takes place. In order to optimize the bonding quality, the temperature profile on the interface must be obtained. Using optical measurements of the both plates, the absorbed energy can be calculated. At the wavelength of 1100nm $87.5\%$ of incident laser energy was used for bonding process from the calculation. A heat transfer model was applied for obtaining the transient temperature profile. It was found that with the power of 29.5 mW, the interface begins to melt and bond each other in 3 sec and it is in a good agreement with experiment results. The transmission IR laser bonding has a potential in the local precise bonding in MEMS or Lab-on-a-chip applications.

다이오드 레이저를 이용한 Chip On Glass 접합에 관한 연구 (Study of Chip On Glass Bonding Method using Diode Laser)

  • 서명희;류광현;남기중
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2005년도 추계학술대회 논문집
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    • pp.423-426
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    • 2005
  • A new chip on glass(COG) technique by making use of a high power diode laser for LCD driver IC packaging of LCD has been developed. A laser joining technology of the connection of IC chip to glass panel has several advantages over conventional method such as hot plate joining: shorter process time, high reliability of joining, and better fur fine pitch joining. The reach time to cure temperature of ACF in laser joining is within 1 second. In this study, results show that the total process time of joining is reduced by halves than that of conventional method. The adhesion strength is mainly 100-250 N/cm. It is confirmed that the COG technology using high power diode laser joining can be applied to advanced LCDs with a fine pitch.

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ANODICALLY-BONDED INTERFACE OF GLASS TO ALUMINIUM

  • Takahashi, Makoto;Nishikawa, Satoru;Chen, Zheng;Ikeuchi, Kenji
    • 대한용접접합학회:학술대회논문집
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    • 대한용접접합학회 2002년도 Proceedings of the International Welding/Joining Conference-Korea
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    • pp.65-69
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    • 2002
  • An Al film deposited on the Kovar alloy substrate was anodically-bonded to the borosilicate glass, and the bond interfaces was closely investigated by transmission electron microscopy. Al oxide was found to form a layer ~l0 nm thick at the bond interface, and fibrous structure of the same oxide was found to grow epitaxially in the glass from the oxide layer. The fibrous structure grew with the bonding time. The mechanism of the formation of this fibrous structure is proposed on the basis of the migration of Al ions under the electric field. Penetration of Al into glass beyond the interfacial Al oxide was not detected. The comparison of the amount of excess oxygen ions generated in the alkali depletion layer with that incorporated in the Al oxide suggests that the growth of the alkali-ion depletion layer is controlled by the consumption of excess oxygen to form the interfacial Al oxide.

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박형 기판의 사면 접합 공정 및 인장 특성 평가 (Scarf Welding of Thin Substrates and Evaluation of the Tensile Properties)

  • 강범석;나지후;고명준;손민정;고용호;이태익
    • 마이크로전자및패키징학회지
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    • 제30권3호
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    • pp.102-110
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    • 2023
  • 본 연구에서는 플렉서블 레이저 투과 용접 (flexible laser transmission welding, f-LTW)을 이용한 박형 기판의 사면 접합 (scarf welding) 공정을 개발하였다. 플렉서블 응용을 위해 경사면의 기울기에 따른 인장 강도의 거동을 조사하였다. 박형 기판으로써 100 ㎛ 이하 두께의 플라스틱 기판이 사용되었으며, 사면 접합을 위해서 기판의 말단에 경사면을 형성하는 지그 장치를 개발하였다. 플렉서블 고분자 기판에 대한 경사면 맞대기 접합을 개발함으로써 공정 후 접합부 두께가 증가하지 않는 유연 접합 기술 개발에 성공하였다. 단축 인장시험을 통해 접합부의 인장 강도를 평가하였으며, 그 결과 경사면의 기울기가 완만할수록 인장 강도가 증가함을 확인하였다. 경사각에 따른 접합 계면에서의 응력 분석을 수행하여 접합 구조 설계 인자를 규명하였다. 본 결과는 동일한 공정 조건에서 접합부의 형상에 따라서 인장 강도가 크게 달라질 수 있음을 시사하므로 접합 공정에서 접합부 형상을 고려하는 것에 대한 중요성을 확인할 수 있다.