• Journal of Welding and Joining
• /
• v.24 no.6
• /
• pp.28-32
• /
• 2006

Laser Transmission Joining (LTJ), which is a joining process of polymers by using different transmission rates of materials, was studied numerically. Unlike previous studies, energy loss by reflection at the surface was included. Besides, energy absorbed in the transparent substrate is also considered to increase the accuracy of the analytical results. Furthermore, thermal deformations of the substrates were also calculated. Temperature distribution of the substrates on the joining process could be effectively predicted by using the thermal analysis model developed, which could also analyze the rising phenomenon of the absorbing substrate by bulge effect. Calculated results show that temperature of the absorbing substrate is higher than that of transparent substrate when the laser is being radiated, and this temperature difference causes more thermal deformation in absorbing substrate, which results in the surface rise of the absorbing substrate. Comparison of calculated results with corresponding experimental results could confirm the validity of the numerical analysis model proposed.

• Journal of Welding and Joining
• /
• v.25 no.2
• /
• pp.43-48
• /
• 2007

Laser Transmission Joining (LTJ) of plastics is a process in which light of suitable wavelength is transmitted through a transparent substrate that is in contact with an absorbing one. In this paper, LTJ is investigated by preliminary experiments from the viewpoint of mechanical engineering. To understand transmitting characteristics of each polymer substrate, transmission rate, reflection rate and absorption coefficient of polymer are measured by using a laser power-meter. Characteristics of joining in the spot welding and seam welding are investigated by measuring the fracture load. Fracture load increases in accordance to the laser power and irradiation time. However, when the laser power is over 60W and irradiation time over 4seconds, fracture load decreases. This phenomenon is probably due to heat-softening of materials. Besides, cavities are generated at a joint by evaporation of water molecules, which can be suppressed by introduction of a gap between two substrates.

• Journal of Welding and Joining
• /
• v.29 no.6
• /
• pp.45-48
• /
• 2011

In this research, laser welding of automotive transmission components was investigated to replace electron beam welding which is normally conducted under vacuum condition. Fiber laser welding was applied to the automotive transmission components - hub clutch and annulus gear. In the component welding, the laser welding parameters were optimized to eliminate spatters and the end crater. By applying laser welding to the transmission parts, the process time could be reduced up to 70% compared with the current electron beam welding process.

• Journal of Welding and Joining
• /
• v.32 no.6
• /
• pp.1-7
• /
• 2014

For the resistance spot welds of CR1180 and GA1180 TRIP steels, the weld quality evaluation method using the digitalized X-ray transmission imaging apparatus was investigated in comparison with the crosssectional examination method. In the case of the resistance spot welding of CR1180, three circular regions, such as WZ(white zone), GZ(grey zone) and DZ(dark zone), appeared on X-ray image and they corresponded to the diameters of indentation mark, nugget and corona bond, respectively. The variation of X-ray transmission thickness due to the thickness variation of the weld seemed to be mainly responsible for the formation of those contrasts. The X-ray image contrast formed from the variation of transmission thickness at the outer border line of DZ could also enable the inspections of the notch shape, nonuniformity of the welding pressure and spatter from its sharpness, concentricity and the normal straight line, respectively. The X-ray image of the resistance spot weld of galvannealed GA1180 TRIP steel was very similar to that of CR1180 TRIP steel except the crown shaped outer border line of DZ which was considered to be due to the melting behavior of zinc having the boiling temperature even lower than the melting temperature of steel.

• Journal of the Microelectronics and Packaging Society
• /
• v.29 no.2
• /
• pp.113-119
• /
• 2022

In order to improve the mechanical reliability of next-generation electronic devices including flexible, wearable devices, a high level of mechanical reliability is required at various flexible joints. Organic adhesive materials such as epoxy for bonding existing polymer substrates inevitably have an increase in the thickness of the joint and involve problems of thermodynamic damage due to repeated deformation and high temperature hardening. Therefore, it is required to develop a low-temperature bonding process to minimize the thickness of the joint and prevent thermal damage for flexible bonding. This study developed flexible laser transmission welding (f-LTW) that allows bonding of flexible substrates with flexibility, robustness, and low thermal damage. Carbon nanotube (CNT) is thin-film coated on a flexible substrate to reduce the thickness of the joint, and a local melt bonding process on the surface of a polymer substrate by heating a CNT dispersion beam laser has been developed. The laser process conditions were constructed to minimize the thermal damage of the substrate and the mechanism of forming a CNT junction with the polymer substrate. In addition, lap shear adhesion test, peel test, and repeated bending experiment were conducted to evaluate the strength and flexibility of the flexible bonding joint.

• Journal of Welding and Joining
• /
• v.28 no.3
• /
• pp.9-14
• /
• 2010

• Journal of Welding and Joining
• /
• v.23 no.5
• /
• pp.55-60
• /
• 2005

A precise bonding technique, transmission laser bonding using energy transfer, for polymer micro devices is presented. The irradiated IR laser beam passes through the transparent part and absorbed on the opaque part. The absorbed energy is converted into heat and bonding takes place. In order to optimize the bonding quality, the temperature profile on the interface must be obtained. Using optical measurements of the both plates, the absorbed energy can be calculated. At the wavelength of 1100nm $87.5\%$ of incident laser energy was used for bonding process from the calculation. A heat transfer model was applied for obtaining the transient temperature profile. It was found that with the power of 29.5 mW, the interface begins to melt and bond each other in 3 sec and it is in a good agreement with experiment results. The transmission IR laser bonding has a potential in the local precise bonding in MEMS or Lab-on-a-chip applications.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2005.10a
• /
• pp.423-426
• /
• 2005

A new chip on glass(COG) technique by making use of a high power diode laser for LCD driver IC packaging of LCD has been developed. A laser joining technology of the connection of IC chip to glass panel has several advantages over conventional method such as hot plate joining: shorter process time, high reliability of joining, and better fur fine pitch joining. The reach time to cure temperature of ACF in laser joining is within 1 second. In this study, results show that the total process time of joining is reduced by halves than that of conventional method. The adhesion strength is mainly 100-250 N/cm. It is confirmed that the COG technology using high power diode laser joining can be applied to advanced LCDs with a fine pitch.

• Proceedings of the KWS Conference
• /
• 2002.10a
• /
• pp.65-69
• /
• 2002

An Al film deposited on the Kovar alloy substrate was anodically-bonded to the borosilicate glass, and the bond interfaces was closely investigated by transmission electron microscopy. Al oxide was found to form a layer ~l0 nm thick at the bond interface, and fibrous structure of the same oxide was found to grow epitaxially in the glass from the oxide layer. The fibrous structure grew with the bonding time. The mechanism of the formation of this fibrous structure is proposed on the basis of the migration of Al ions under the electric field. Penetration of Al into glass beyond the interfacial Al oxide was not detected. The comparison of the amount of excess oxygen ions generated in the alkali depletion layer with that incorporated in the Al oxide suggests that the growth of the alkali-ion depletion layer is controlled by the consumption of excess oxygen to form the interfacial Al oxide.

• Journal of the Microelectronics and Packaging Society
• /
• v.30 no.3
• /
• pp.102-110
• /
• 2023

This paper introduces scarf welding process of thin substrates using flexible laser transmission welding (f-LTW) technology. We examined the behavior of tensile strength relative to the scarf angle for flexible applications. Thin plastic substrates with the thickness of less than 100 ㎛ were bonded and a jig to form a slope at the edge of the substrate was developed. By developing the scarf welding process, we successfully created a flexible bonding technology that maintains joint's thickness after the process. The tensile strength of the joint was assessed through uniaxial test, and we found that the tensile strength increases as the slope of bonding interface decreases. By conducting stress analysis at the bonding interface with respect to the slope angle, design factor of bonding structure was investigated. These findings suggest that the tensile strength depends on the geometry of the joint, even under the same process conditions, and highlights the significance of considering the geometry of the joint in welding processes.