• 제목/요약/키워드: Total etching

검색결과 139건 처리시간 0.017초

법랑질에 대한 total etching과 self-etching 접착제의 산부식 효과와 미세인장결합강도 (THE ETCHING EFFECTS AND MICROTENSILE BOND STRENGTH OF TOTAL ETCHING AND SELF-ETCHING ADHESIVE SYSTEM ON UNGROUND ENAMEL)

  • 오선경;허복;김현철
    • Restorative Dentistry and Endodontics
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    • 제29권3호
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    • pp.273-280
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    • 2004
  • The purpose of this study was to evaluate the etching effects and bond strength of total etching and self-etching adhesive system on unground enamel using scanning electron microscopy and microtensile bond strength test. The buccal coronal unground enamel from human extracted molars were prepared using low-speed diamond saw. Scotchbond Multi-Purpose (group SM). Clearfil SE Bond (group SE), or Adper Prompt L-Pop (group LP) were applied to the prepared teeth. and the blocks of resin composite (Filtek Z250) were built up incrementally. Resin tag formation was evaluated by scanning electron microscopy. after removal of enamel surface by acid dissolution and dehydration. For microtensile bond strength test. resin-bonded teeth were sectioned to give a bonded surface area of $1\textrm{mm}^2$. Microtensile bond strength test was perfomed. The results of this study were as follows. 1. A definite etching pattern was observed in Scotchbond Multi-Purpose group. 2. Self-etching groups were characterized as shallow and irregular etching patterns. 3. The results (mean) of microtensile bond strength were SM: 26.55 MPa, SE: 18.15 MPa, LP: 15.57 MPa. SM had significantly higher microtensile bond strength than 8E and PL (p < 0.05). but there was no significant differance between SE and PL.

태양전지 적용을 위한 Silicon 기판의 표면처리 효과에 관한 연구

  • 연창봉;이유정;임정욱;윤선진
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2012년도 제42회 동계 정기 학술대회 초록집
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    • pp.592-592
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    • 2012
  • 태양전지에서 고효율 달성을 위해 태양광을 더 많이 활용하기 위해서는 태양전지 표면에서의 광 반사를 줄여야 하는데 가장 효과적인 방법은 실리콘 기판의 wet etching 공정을 통한 텍스쳐링이다. 태양전지에서 가장 많이 사용되는 파장대역은 가시광선 영역인데 555 nm 파장에서 실리콘 표면의 total reflectance는 30.1%로 매우 높고 diffuse reflectance는 0.1%로서 무시할만큼 적다. 하지만 wet etching을 한 후 total reflectance는 18%까지 감소하였고, diffuse reflectance는 16%까지 증가하였다. 결정면에 따른 식각선택성을 이용하는 이방성 etching으로 V groove 모양의 표면형상을 얻을 수 있었고, 후속 등방성 etching을 하여 U groove 표면형상을 얻을 수 있었다. 또한 wet etching의 문제점중의 하나는 반응중에 생성되는 수소기체가 실리콘 표면에 부착되어 etching이 불균일하게 진행되는 것인데 초음파를 사용하여 이 문제를 해결하였다. 그리고 Etchant의 성분용액중 하나인 IPA의 농도조절을 통해 표면에 형성되는 피라미드의 크기를 조절할 수 있었다. 본 연구에서는 실리콘 표면형상의 각각 서로 다른 크기와 모양에 따라 태양전지를 만들었을 때 빛의 활용 측면에서 어떤 변화가 있고 얼마만큼의 효율변화가 있는지에 대해서도 알아보았다.

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Etching effects and microtensile bond strength of total etching and self-etching adhesive system on unground enamel

  • Oh, Sun-Kyong;Hur, Bock
    • 대한치과보존학회:학술대회논문집
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    • 대한치과보존학회 2003년도 제120회 추계학술대회 제 5차 한ㆍ일 치과보존학회 공동학술대회
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    • pp.618-618
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    • 2003
  • The purpose of this study was to evaluate the etching effects and bond strength of total etching and self-etching adhesive system on unground enamel using scanning electron microscopy and microtensile bond strength test. The buccal coronal unground enamel from human extracted molars were prepared using low-speed deamond saw. Scotchbond Multi-Purpose(group CM), Clearfil SE Bond(group SE), or Adper Prompt L-pop(group LP) were applied to the prepared teeth, and resin compasite(Z-250) was built up incrementally. Resin tag formation were evaluated by scanning electron microscopy, after removal of enamel surface by acid dissolution and dehydration.(중략)

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산부식형 상아질 접착제의 접착 내구성에 관한 연구 (THE BONDING DURABILITY OF TOTAL ETCHING ADHESIVES ON DENTIN)

  • 정미라;최기운;박상혁;박상진
    • Restorative Dentistry and Endodontics
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    • 제32권4호
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    • pp.365-376
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    • 2007
  • 본 연구의 목적은 3종의 전체산부식 상아질 접착 시스템에서 적절한 산부식 시간과 접착제의 침투 능력에 대해 규명하고자 하였다. 우식이 없는 54개의 제3대구치의 상아질 표면을 5, 15, 25초 동안 산부식하고 산부식형 접착제 3종 (Scotchbond multipurpose, Single Bond, One Step) 을 도포한 후 복합레진을 충전하였다. 각 시편은 0회 (대조군) 또는 2000회 열순환 ($5^{\circ}C\;-\;55^{\circ}C$) (실험군) 후 미세인장강도를 측정하고 파단면을 관찰하여 다음과 같은 결론을 얻었다. 1. 실험군은 대조군에 비하여 결합강도가 감소하였으며, 특히 25초 산부식한 SM 및 SB군에서는 통계학적 유의차를 나타내었다. 2. 열순환 처리한 SM군과 SB군의 경우, 25초 간 산부식한 군이 5초 간 산부식한 군과 15초 간 산부식한 군에 비해 유의성 있게 낮은 결합강도를 나타냈다 (p < 0.05). 3. OS군의 경우, 산부식 시간 및 열순환 여부에 따른 유의성 있는 차이가 나타나지 않았다 (p > 0.05). 상아질 접착의 내구성은 접착제의 용매와 산부식 시간에 의해 영향을 받으며 특히, ethanol-based adhesive를 사용할 때 과도한 산부식은 유의해야 한다.

Dry Etching of Ru Electrodes using O2/Cl2 Inductively Coupled Plasmas

  • Kim, Hyoun Woo
    • Corrosion Science and Technology
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    • 제2권5호
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    • pp.238-242
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    • 2003
  • The characteristics of Ru etching using $O_2/Cl_2$ plasmas were investigated by employing inductively coupled plasma (ICP) etcher. The changes of Ru etch rate, Ru to $SiO_2$ etch selectivity and Ru electrode etching slope with the gas flow ratio, bias power, total gas flow rate, and source power were scrutinized. A high etching slope (${\sim}86^{\circ}$) and a smooth surface after etching was attained using $O_2/Cl_2$ inductively coupled plasma.

극저온 자화 유도 결합 플라즈마를 이용한 Platinum 식각에 관한 연구 (A study on platinum dry etching using a cryogenic magnetized inductively coupled plasma)

  • 김진성;김정훈;김윤택;황기웅;주정훈;김진웅
    • 한국진공학회지
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    • 제8권4A호
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    • pp.476-481
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    • 1999
  • Characteristics of platinum dry etching were investigated in a cryogenic magnetized inductively coupled plasma (MICP). The problem with platinum etching is the redeposition of sputtered platinum on the sidewall. Because of the redeposits on the sidewall, the etching of patterned platinum structure produces feature sizes that exceed the original dimension of the PR size and the etch profile has needle-like shape [1]. The main object of this study was to investigate a new process technology for fence-free Pt etching As bias voltage increased, the height of fence was reduced. In cryogenic etching, the height of fence was reduced to 20% at-$190^{\circ}C$ compared with that of room temperature, however the etch profile was not still fence-free. In Ar/$SF_6$ Plasma, fence-free Pt etching was possible. As the ratio of $SF_6$ gas flow is more than 14% of total gas flow, the etch profile had no fence. Chemical reaction seemed to take place in the etch process.

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미세 레이저 가공의 표면코팅 후 전해 에칭 (Laser Micro Machining and Electrochemical Etching After Surface Coating)

  • 김태풍;박민수
    • 한국정밀공학회지
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    • 제30권6호
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    • pp.638-643
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    • 2013
  • Laser beam machining (LBM) is fast, contactless and able to machine various materials. So it is used to cut metal, drill holes, weld or pattern the imprinted surface. However, after LBM, there still leave burrs and recast layers around the machined area. In order to remove these unwanted parts, LBM process often uses electrochemical etching (ECE). But, the total thickness of workpiece is reduced because the etching process removes not only burrs and recast layers, but also the entire surface. In this paper, surface coating was performed using enamel after LBM on metal. The recast layer can be selectively removed without decreasing total thickness. Comparing with LBM process only, the surface quality of enamel coating process was better than that. And edge shape was also maintained after ECE.

인산(隣酸) 에스텔계 접착성(接着性) 레진의 치수반응(齒髓反應)에 관(關)한 병리조직학적(病理組織學的) 연구(硏究) (A HISTOPATHOLOGICAL STUDY ON THE PULP REACTION OF ADHESIVE RESINS AS PHOSPHORIC ESTER SYSTEM)

  • 김철호
    • Restorative Dentistry and Endodontics
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    • 제10권1호
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    • pp.7-16
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    • 1984
  • The purpose of this study was to investigate the pulpal responses to adhesive resins as phosphoric ester system: "Clearfil F II" (Composite filling material), "Panavia EX" (Composite cementing Material) and "Silar" (Microfilled Compsoite resin) comparing with Zinc-Oxide-Eugenol cement. Total 70 cavities of the permanent healthy teeth from 5 dogs were prepared and placed with experimental resins and Zinc-Oxide-Eugenol cement as control. The dogs were sarificed at 5 intervals of 3 days, one, two, four, six weeks. The specimens were routinely prepared and stained by Hematoxylin-Eosin. Followings were the results obtained through microscopic examination. 1. In cases of Clearfil F II and Panavia EX without etching and lining, pulp response in the early stage showed more severe vascular congestion and hemorrhage than that of Zinc-Oxide-Engenol cement. 2. The pulp response of totally etched cases was similar to that of unetched cases in the groups of Clearfil F II and Panavia EX. 3. The cases of Clearfil F II and Panavia EX with enamel etching showed no significant histologic change compared to that of total cavity etching. 4. The Silar case with total etching showed retarded tendency of histologic recovery compared to Clearfil F II and Panavia EX group. 5. Generally, pulp responses of experimental groups were not severe and the six week case showed the evidence of a histologic recovery.

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Nano-fabrication of Superconducting Electrodes for New Type of LEDs

  • Huh, Jae-Hoon;Endoh, Michiaki;Sato, Hiroyasu;Ito, Saki;Idutsu, Yasuhiro;Suemune, Ikuo
    • 한국광학회:학술대회논문집
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    • 한국광학회 2009년도 동계학술발표회 논문집
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    • pp.133-134
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    • 2009
  • Cold temperature development (CTD) of electron beam (EB) patterned resists and subsequent dry etching were investigated for fabrication of nano-patterned Niobium (Nb). Bulky Nb fims on GaAs substrates were deposited with EB evaporation. Line patterns on Nb cathode were fabricated by EB patterning and reactive ion etching (RIE). Size deviations of nano-sized line patterns from CAD designed patterns are dependent on the EB total exposure, but it can be improved by CTD of EB-exposed resist. Line patterns of 10 to 300 nm widths of EB-exposed resist patterns were drawn under various exposure conditions of $0.2{\mu}s$/dot (total 240,000 dot) with a constant current (50 pA). Compared with room temperature development (RTD), the CTD improves pattern resolution due to the suppression of backscattering effect. RIE with $CF_4$ was performed for formation of several nano-sized line patterns on Nb. Each EB-resist patterned samples with RTDs and CTDs were etched with two different $CF_4$ gas pressures of 5 Pa. Nb etching rate increases while GaAs (or ZEP) etching rate decreases as the chamber pressure increases. This different dependent of the etching rate on the $CF_4$ pressure between Nb and GaAs (or ZEP) has a significant meaning because selective etching of nano-sized Nb line patterns is possible without etching of the underlying active layer.

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부가적 산부식 시간에 따른 자가 산부식 접착제의 법랑질 전단결합강도 (SHEAR BOND STRENGTH OF SELF-ETCHING ADHESIVES TO TOOTH ENAMEL WITH ADDITIONAL ETCHING)

  • 이형숙;김성기;이동수;김신;정태성
    • 대한소아치과학회지
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    • 제36권4호
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    • pp.514-521
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    • 2009
  • 이 연구의 목적은 유치와 영구치의 법랑질에 자가 산부식 접착제 적용 전 부가적인 산부식 시간을 달리 하였을 때, 전단결합강도에 미치는 영향을 알아보기 위함이다. 각각 65개의 발거된 건전한 유치와 영구치 협, 설면 법랑질 시편을 제작하고 두 종류의 자가 산부식 접착제를 적용하였다. 실험군은 $Clearfil^{TM}$ SE bond, $Adper^{TM}$ $Prompt^{TM}$ $L-pop^{TM}$으로 처리한 두 개 군으로 나누고, 이를 다시 산부식 시간에 따라 여섯 군(0, 5, 10, 15, 20, 30초)으로 분류하였다. 대조군으로는 total-etching system인 $Adper^{TM}$ $Scotchbond^{TM}$ Multi-purpose plus를 사용하였다. 접착제 처리면을 복합레진으로 충전하고 24시간 경과 후 전단결합강도를 측정하고 Mann-Whitney test와 Kruskal-Wallis test를 사용하여 통계분석 하였다. 결과는 자가 산부식 접착제를 적용한 군은 유치, 영구치 모두에서 total etching system에 비해 낮은 전단 결합강도를 보였다. 자가 산부식 접착제 사용 군내에서 산부식을 추가로 시행하였을 때 유치와 영구치 모두에서 결합강도가 증가하였으며, 10초 이상 산부식을 시행한 경우 결합력의 차이는 없는 것으로 나타났다. 유치와 영구치간 결합력의 차이는 인정되지 않았다. 결론적으로, 자가 산부식 접착제의 법랑질에 대한 전단결합강도는 유치, 영구치 모두에서 10초 이상의 부가적 산부식이 결합력의 증가에 유리하게 작용하는 것으로 나타났다.

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