• Proceedings of the Korean Magnestics Society Conference
• /
• 2002.04a
• /
• pp.120-121
• /
• 2002

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2003.05a
• /
• pp.55-58
• /
• 2003

FeMn based spin valves often consist of a NiFe/FeMn/NiFe trilayer structure. We have investigated the evolution of exchange bias at the bottom and top interfaces in the NiFe(5nm)/FeMn(x)/NiFe(5nm) trilayer structure as a function of FeMn thickness in the range 3 nm to 30 nm. The XRD results indicate (111) textured growth for NiFe and FeMn layers. The magnetization studies using VSM show two hysteresis loops corresponding to the bottom NiFe seed layer and top NiFe layers with greater bias for the bottom NiFe layer, for FeMn thickness equal to and above 5 nm. The larger exchange bias for the bottom seed layer is confirmed by the surface sensitive MOKE hysteresis loop measurements which show gradual weakening of the MOKE hysteresis loop for the bottom NiFe layer with increasing FeMn thickness. The observed large exchange bias in a spin valve structure is usually attributed to the pinning NiFe layer on top of the FeMn layer, even when a NiFe seed layer of a few nm thickness is present, whereas, in reality it may be arising from the bottom seed layer, as shown by the present study.

• Proceedings of the KSME Conference
• /
• 2001.06e
• /
• pp.506-511
• /
• 2001

This paper presents how redevelopment of the boundary layer in a backward-facing step flow is affected by boundary conditions imposed on velocity at the inlet, top and exit of the flow. A two-dimensional, laminar, incompressible flow over a backward-facing step with an open top boundary has been computed by using numerical methods of second-order time and spatial accuracy and a fractional-step method that guarantees a divergence-free velocity field at all time. The inlet velocity profile above the step is of Blasius type. Along the top boundary, shear-tree and Dirichlet conditions on the streamwise velocity were considered and at the exit fully-developed and convective boundary conditions were examined. (The vertical velocity at all boundaries were assumed to be zero explicitly or implicitly.) From the computed flow fields, the reattachment on the bottom side of shear layer separated from the tip of the step and succeeding redevelopment of the boundary layer were investigated.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2009.06a
• /
• pp.299-300
• /
• 2009

We have studied an organic layer and semitransparent Al cathode thickness dependent optical properties for top-emission organic light-emitting diodes. Device structure is ITO(170nm)/TPD(xnm)/$Alq_3$(ynm)/LiF(0.5nm)/Al(100nm) and Al(100nm)/TPD(xnm)/$Alq_3$(ynm)/LiF(0.5nm)/Al(25nm). While a thickness of total, organic layer was varied from 85nm to 165nm, a ratio of those two layers was kept to be about 2:3. Then it was compared with that of bottom devices. And a thickness of semitransparent Al cathode was varied from 20nm to 30nm for the device with an organic layer thickness of 140nm. We were able to control the emission spectra from the top-emission organic light-emitting diodes.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.19 no.6
• /
• pp.538-546
• /
• 2006

We report on characteristics of specially designed inductively-coupled-plasma chemical vapor deposition (ICP-CVD) system for top-emitting organic light emitting diodes (TOLEDs). Using high-density plasma on the order of $10^{11}$ electrons/$cm^3$ generated by linear-type antennas connected in parallel and specially designed substrate cooling system, a 100 nm-thick transparent $SiN_{x}$ passivation layer was deposited on thin Mg-Ag cathode layer at substrate temperature below $50\;^{\circ}C$ without a noticeable plasma damage. In addition, substrate-mask chucking system equipped with a mechanical mask aligner enabled us to pattern the $SiN_x$ passivation layer without conventional lithography processes. Even at low substrate temperature, a $SiN_x$ passivation layer prepared by ICP-CVD shows a good moisture resistance and transparency of $5{\times}10^{-3}g/m^2/day$ and 92 %, respectively. This indicates that the ICP-CVD system is a promising methode to substitute conventional plasma enhanced CVD (PECVD) in thin film passivation process.

• Journal of Korea Technical Association of The Pulp and Paper Industry
• /
• v.42 no.5
• /
• pp.31-36
• /
• 2010

When corrugated board is folded at the severely low humidity condition, crack can occur along the scored (or creased) lines of linerboard. This phenomenon is called as score (or crease) crack. It is mainly resulted from the excessive concentration of stress on the outer layer of linerboard. To overcome score crack, many approaches including the installation of constant temperature and humidity system, displacement of low grade raw material by long and strong fibers, or application of water have been tried. We examined the effect of the weight fraction of top layer in two-ply sheet, freeness of top layer stock and wet pressing on strain and elastic modulus of sheet to prevent score crack. Lower freeness and higher press load increased the density and elastic modulus of sheet. Pressing load over the $50kgf/cm^2$, however, decreased the strain of sheet. The weight fraction of top layer had positive effect on strain as well as elastic modulus without increasing the density of sheet.

• Journal of the Korean Society for Precision Engineering
• /
• v.21 no.6
• /
• pp.153-159
• /
• 2004

In this study, a new process to pattern directly on a thin metal layer using improved nano replication printing (nRP) process is suggested to evaluate the possibilities of fabricating a stamp for nano-imprinting. In the nRP process, any figure can be replicated from a bitmap figure file in the range of several micrometers with nano-scaled details. In the process, liquid-state resins are polymerized by two-photon absorption which is induced by femto-second laser. A thin gold layer was sputtered on a glass plate and then, designed patterns or figures were developed on the gold layer by newly developed top-down building approach. Generally, stamps fur nano-imprinting have been fabricated by using the costly electron-beam lithography process combined with a reactive ion-etching process. Through this study, the effectiveness of the improved nRP process is evaluated to make a stamp with the resolution of around 200nm with reduced cost.

• Journal of the Semiconductor & Display Technology
• /
• v.23 no.2
• /
• pp.65-70
• /
• 2024

Using a computational fluid dynamics(CFD) simulation tool, we have provided a coating guideline for slot-die coating with a double layer slot die head. We have analyzed the fluid dynamics in terms of the coating speed, flow rate ratio, and viscosity ratio, which are critical for the stability of coating meniscus. We have identified the common coating defects such as break-up, air entrainment, and leakage by varying the coating speeds. The flow rate ratio is the critical parameter determining the wet film thickness of the top and bottom layers. It is shown that when the flow rate ratio exceeds or equals 1.8, air entrainment occurs due to insufficient hydraulic pressure in the bottom layer, even though the total flow rate remains constant. Furthermore, we have found that the flow of the bottom layer is significantly affected by the viscosity of top layer. The viscosity ratio of 4 or higher obstructs the flow of the bottom layer due to the increased hydraulic resistance, resulting in leakage. Finally, we have demonstrated that as the viscosity ratio increases from 0.1 to 10, the maximum coating speed rises from 0.4 mm/s to 1.6 mm/s, and the minimum wet film thickness decreases from 800 ㎛ to 200 ㎛.

• 한국정보디스플레이학회:학술대회논문집
• /
• 2006.08a
• /
• pp.990-993
• /
• 2006

We fabricated top emission organic light emitting diode (TEOLED) with transparent metal cathode Barium and Silver bilayer. Very thin Ba/Ag bilayer was deposited on the organic layer by thermal evaporation. This cathode shows high transmittance over 70% in visible range. And the device with a Ba-Ag has a low turn on voltage and good electrical properties.

• Journal of the Korea Organic Resources Recycling Association
• /
• v.24 no.3
• /
• pp.63-74
• /
• 2016

The objective of this study was to investigate the variations of physico-chemical properties during the swine manure composting, sawdust as the bulking agent was composted at different points (Top layer, Side of middle layer, Bottom layer). Air suction system with constant bottom aeration in bench scale reactors (30 L). The highest temperature was reached in the range of $58^{\circ}C$ to $62^{\circ}C$ on $3^{rd}$ day and this thermophilic phase (> $50^{\circ}C$) was continued for 3 days in all the treatment mixtures. However, the temperature was gradually decreased to room temperature at the end of 60 day composting process. Except control, the discharged ammonia ($NH_3$) was a maximum in the treatment order of Top layer>Bottom layer>Side of middle layer as 500 ppm, 162 ppm and 120 ppm, respectively, on the $4^{th}$ day and showing that Top layer point Air suction produce much more ammonia content than the other point. During the composting process, the total Kjeldahl nitrogen (TKN) was gradually increased due to the mass loss in the composting mixtures. At the same time, C/N ratio was decreased to Top layer, 13; Side of middle layer, 12 and Bottom layer, 13 at Air suction points. The significant reduction of C/N ratio in all different air suction system when manure was matured. The $NH_4-N$ to $NO_3-N$ ratio was recorded as 10.52 at the initial stage of the compost mixtures and reduced to 0.97 (Top layer), 0.70 (Side of middle layer), 3.2 (Bottom layer) because of manure decomposition. The overall results revealed that Top layer and Side of middle layer Air suction is a suitable option when compared other point for high quality composts.