• Proceedings of the CALSEC Conference
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• 1999.07a
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• pp.277-299
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• 1999

Since Chrysler Motor Co. had experienced the digital development system in the beginning of 1990's, most of leading automobile companies are trying to apply a digital information system for their own business process reengineering based upon concurrent engineering system from product planning phase. This is called as virtual DMU(Digital Mock-Up) system instead of the traditional PMU(Physical Mock-Up) system. By using the virtual prototype, all of the design requirements and system specifications can be checked, changed and optimized more quickly and more efficiently. This paper consists of five chapters for the DMU information system. In the 1$^{st}$ chapter, the principle of digital design system is suggested by using four basic modules such as product design module, process design module, manufacturing system design module and central control module. The basic scheme of DMU is introduced with the benefits of application in the chapter 2. In the chapter 3, a digital design process of new car development is explained with the detailed DMU design and design review processes. In the chapter 4, the practical DMU manufacturing techniques and applications are introduced as CAD/CAM analyses, DPA(Digital Pre-Assembly)reviews for development, production, operation and maintenance phases, digital tolerance analyses and digital factory analyses for assembling line simulation, automated robot welding processes, production jig ＆ fixtures and painting process simulation. Finally, the activities of digital design support; CAS-styling, CAE-engineering and CAT-testing are summarized for design optimization in the chapter 5. As today's automobile manufactures and related business organizations are struggling to compete in the global marketplace, they are concentrating on efficient use of DMU information system to reduce the new car development cost, to have shorten the delivery schedule and to improve product design quality. To meet the demand of those automobile industries on digital information systems, the CALS(Computer aided Acquisition and Logistics Support) and EC(Electronic Commerce)initiative has been focused as a dominant philosophy in defense ＆ commercial industries, specially automobile industries.s.

• Journal of the Korean Society for Precision Engineering
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• v.25 no.6
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• pp.47-54
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• 2008

Fitting process carried out in the automobile transmission assembly line is classified into three classes; heat fitting, press fitting, and their combined fitting. Heat fitting is a method that heats gear to a suitable range under the tempering temperature and squeezes it toward the outer diameter of shaft. Its stress depends on the yield strength of gear. Press fitting is a method that generally squeezes gear toward that of shaft at room temperature by a press. Another method heats warmly gear and safely squeezes it toward that of shaft. Warm shrink fitting process for the automobile transmission part is now gradually increased, but the parts (shaft/gear) assembled by this process produced dimensional changes in both the outer diameter and profile of the gear. So that it may cause noise and vibration between gears. In order to solve these problems, we need an analysis of warm shrink fitting process, in which design parameters are involved; contact pressure according to fitting interference between outer diameter of shaft and inner diameter of gear, fitting temperature, and profile tolerance of gear. In this study, an closed form equation to predict contact pressure and fitting load was proposed in order to develop an optimization technique of the warm shrink fitting process and verified its reliability through the experimental results measured in the field and FEM, that is, thermal-structural coupled field analysis. Actual loads measured in the field was in good agreements with the results obtained by the theoretical and finite element analysis.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.11 no.11
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• pp.4121-4128
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• 2010

A probe card is used in testing semiconductor wafers. It must maintain a precise location tolerance for a fine pitch due to highly densified chips. However, high heat transferred from its lower chuck causes thermal deformations of the probe card. Vertical deformation due to the heat will bring contact problems to the pins in the probe card, while horizontal deformation will cause positional inaccuracies. Therefore, probe cards must be designed with proper materials and structures so that the thermal deformations are within allowable tolerances. In this paper, heat transfer analyses under realistic loading conditions are simulated using ANSYS$^{TM}$ finite element analysis program. Thermal deformations are calculated based on steady-state temperature gradients, and an optimal structure of the probe card is proposed by adjusting a set of relevant design parameters so that the deformations are minimized.

• Journal of the Korean Society for Railway
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• v.18 no.6
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• pp.619-629
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• 2015

The train conflict resolution problem refers to an adjustment of the train operation schedule in order to minimize the delay propagation when a train conflict is predicted or when a train conflict occurs. Previous train studies of train conflict resolutions are limited in terms of the size of the problems to be solved due to exponential increases in the variables. In this paper, we propose a train conflict resolution model using a time-space network to solve the train conflict situation in the operational phase. The proposed model adjusts the size of the problem by giving only the dwell tolerance in the time-space network only for stops at the station after a train conflict. In addition, the proposed model can solve large problems using a path flow variable. The study presents a train delay propagation analysis and experimental results of train conflict resolution assessments as well using the proposed model.

• Journal of the Microelectronics and Packaging Society
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• v.27 no.4
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• pp.47-54
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• 2020

Integration of active and passive waveguides is an essential component of the photonic integrated circuit and its elements. Butt joint is one of the important technologies to accomplish it with significant advantages. However, it suffers from high optical loss at the butt joint junction and need of accurate process control to align both waveguides. In this study, we used beam propagation method to simulate an integrated device composed of a laser diode and spot size converter (SSC). Two SSCs with different mode properties were combined with laser waveguide and optical coupling efficiency was simulated. The SSC with larger near field mode showed lower coupling efficiency, however its far field pattern was narrower and more symmetric. Tapered passive waveguide was utilized for enhancing the coupling efficiency and tolerance of waveguide offset at the butt joint without degrading the far field pattern. With this technique, high optical coupling efficiency of 89.6% with narrow far field divergence angle of 16°×16° was obtained.

• Korean Journal of Optics and Photonics
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• v.32 no.6
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• pp.259-265
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• 2021

Recently, lens manufacturing and assembly technology has greatly improved. However, tight requirements of manufacturing and assembly lead to an increase in cost and manufacturing time, and in some cases the performance of an optical system may deteriorate depending on the operating environment's conditions, such as temperature or vibration. In addition, the use of a compensator is an effective method to reduce sensitivity in an ultra-precision optical system, but in the case of a small lens, such as that in an endoscope, it is difficult to use a compensator due to the size limitation of the lens barrel. Therefore, minimizing lens sensitivity is the most important technology in lens design. For this reason, there have been various attempts to reduce the lens sensitivity, and there is a trend to add functions to reduce the sensitivity in the lens design S/W. In this paper, we introduce a design technology that minimizes lens sensitivity. We first design a lens with quite good performance, then analyze the sensitivity of this lens, make a multi-configuration with high-sensitivity element error, and then reoptimize it. We prove with an example that this design technique is very effective.

• Composites Research
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• v.35 no.5
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• pp.309-316
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• 2022

The demand for cold-resistant cable material is increasing due to the rapid increase in the development of devices that operate in a low temperature environment. Cold tolerance of a thermoplastic polymer largely depends on the type and content of about 20 or more additives used to make the polymer. The phenomenon of polymer hardening at low temperature can be classified into hardening by simple temperature effect, embrittlement at the glass transition temperature, and hardening by crystallization of polymers that tend to crystallize. In this study, a thermoplastic polymer having a low glass transition temperature, a flame retardant, and an additive were mixed to evaluate the mechanical properties of a thermoplastic polymer composite material for electric wires. It has been confirmed that mechanical properties and processability are determined depending on the additives and compatibilizers added, and this study is considered to be useful as basic data for optimization to meet the performance requirements of wires developed for low-temperature use.

• Korean Journal of Food Science and Technology
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• v.34 no.2
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• pp.255-262
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• 2002

This experiment was performed to improve the stability of Lactobacillus fermentum YL-3 as a poultry probiotics. The culture conditions that improve acid tolerance of L. fermentum YL-3 were investigated by changing several factors such as medium composition, temperature, anaerobic incubation and culture time. Also, L. fermentum YL-3 was encapsulated with alginate, calcium chloride and chitosan. The stable culture conditions of L. fermentum YL-3 were obtained in anaerobic incubation using MRS media without tween 80 for 20 hour at $42^{\circ}C$. The capsule after treatment with 1% chitosan was formed close membrane by a bridge bond. Immobilization of L. fermentum YL-3 in capsule was observed by confocal laser scanning microscopy, and cell viability was $2.0{\times}10^9\;CFU/g$ above the average. L. fermentum YL-3 capsule after acid treated at pH 2.0 for 3 hour survived about 40%, but those encapsulated with 1% chitosan survived about 65%. Survival rate of capsule stored at room temperature decreased about $2{\sim}3$ log cycle during 3 weeks, but viability of capsule stored at $4^{\circ}C$ during 3 weeks maintained almost $10^8\;CFU/g$ levels.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.22 no.7
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• pp.694-704
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• 2011

In this paper, we present a design of a 5th order Chebyshev interdigital band-pass filter using inverter and susceptance slope parameter values obtained from EM simulated multi-port Y-parameters. The shifted length of the resonator is determined when the frequency of the transmission zero is separated far away from the center frequency. For the initial dimensions of the interdigital filter, the filter is decomposed into the individual resonators, and the dimensions are obtained using EM Simulation of the decomposed resonators. However, the interdigital filter with the dimensions determined from the EM simulation of the decomposed resonators shows slightly distorted response from the desired frequency response due to the coupling between non-adjacent resonators. To obtain a EM simulation dataset, EM simulation for this filter is carried out by parameter sweep with constant ratio for the initial values. In this dataset, it is determined the final values for the filter by optimization. The fabricated filter by PCB shows an upper-shift of center frequency of about 70 MHz, which was caused by permittivity changed and tolerance of fabrication.

• The KIPS Transactions:PartD
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• v.13D no.7 s.110
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• pp.901-908
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• 2006

With the development of wireless communication techniques and mobile environment we are able to transmit data between mobile systems without restriction of time and space. Recently, researches on the data communication between mobile systems have focused on a small amount of sending out or receiving data and data synchronization at a fixed server and mobile clients in mobile environment. However, two more servers should be able to move mutual independently, information is shared with other systems, and data is synchronized in the special environment like a battlefield situation. Therefore, we propose a data synchronization method between systems moving mutual independently in mobile environment. The proposed method is an optimization solution to data propagation path between servers that considers limited bandwidth and process of data for disconnection communication. In addition, we propose a data reduction method that considers importance and sharing of information in order to reduce data transmission between huge servers. We verified the accuracy of data after accomplishing our data synchronization method by applying it in the real world environment. Additionally, we showed that our method could accomplish data synchronization normally within an allowance tolerance when we considered data propagating delay time by server extension.