• Title/Summary/Keyword: Titanium film

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Light-managing Techniques at Front and Rear Interfaces for High Performance Amorphous Silicon Thin Film Solar Cells (고성능 비정질실리콘 박막태양전지를 위한 전후면 계면에서의 빛의 효율적 관리 기술)

  • Kang, Dong-Won
    • The Transactions of The Korean Institute of Electrical Engineers
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    • v.66 no.2
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    • pp.354-356
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    • 2017
  • We focused on light management technology in amorphous silicon solar cells to suppress increase in absorber thickness for improving power conversion efficiency (PCE). $MgF_2$ and $TiO_2$ anti-reflection layers were coated on both sides of Asahi VU ($glass/SnO_2:F$) substrates, which contributed to increase in PCE from 9.16% to 9.81% at absorber thickness of only 150 nm. Also, we applied very thin $MgF_2$ as a rear reflector at n-type nanocrystalline silicon oxide/Ag interface to boost photocurrent. By reinforcing rear reflection, we could find the PCE increase from 10.08% up to 10.34% based on thin absorber about 200 nm.

Characteristic of $TiO_2$ Thin Film for Nonvolatile Memory Device's Gate-Blocking Layer (비휘발성 메모리 소자의 Gate-Blocking Layer 적용을 위한 $TiO_2$ 박막 특성)

  • Choi, Hak-Mo;Lee, Kwang-Soo;Lee, Jun-Sin
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2007.11a
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    • pp.199-200
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    • 2007
  • 본 논문에서는 $SiO_2$ Gate 유전체를 대체할 재료의 하나인 $TiO_2$, Gate 유전체의 기판 증착 온도에 따른 특성을 알아보고자 한다. 디바이스의 고집적화가 높아짐에 따라 얇은 두께의 Gate 유전체의 절대적인 필요에 따라 두께를 최소화하면서 유전율은 높아 전기적 특성이 우수한 소재를 찾게 되었다. 본 논문의 실험에서는 비휘발성 메모리 소자 제작시 Gate Blocking Layer 적용을 위해 High-k 물질인 $TiO_2$, 박막 증착 실험을 하였고, APCVD 방법을 사용하여 성장하였다. 증착 온도에 따른 I-V 특성을 분석하고 그에 따른 소자의 물리적 구조를 SEM을 통해 확인하면서 소자 제작시 최적의 온도를 찾고자 하였다.

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TiN coatings by HCD plasma enhanced reactive ion plating method (HCD플라즈마를 이용한 반응성 이온플레이팅법에 의한 TiN 코팅)

  • 서용운;황기웅
    • Journal of Surface Science and Engineering
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    • v.25 no.3
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    • pp.133-143
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    • 1992
  • Titanium nitride(TiN) films have been prepared by HCD plasma enhanced reactive ion plating. Density and temperature of the plasma generated by the HCD were investigated. It was shown that parameters such as the substrate bias voltage(0 350V) and N2 flow rate(10 180SCCM) influenced the growth, the growth, the microstructure and the color tone of the film mostly. In order to study the interface region, surface analysis by AES combined with sputter depth profiling was performed. Microhardness of the coated TiN films were measured by micro Vickers hardness tester. Also, the effect of coating parameters on composition, coating surface and fracture morphology, grain size and growth rate were examined.

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A Study of Structure & Composition Characteristics of the(Ti, Al) N Coating on the STS 304 by D.C. Magnetron Sputtering (D.C. Magnetron Sputter를 이용한 (Ti, Al) N 피막의 조성 및 조직특성연구)

  • 최장현;이상래
    • Journal of Surface Science and Engineering
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    • v.25 no.5
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    • pp.223-233
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    • 1992
  • (Ti, Al)N films were deposited on 304 stainless steel by D.C. magnetron sputtering using Al target and Ti plate. The properties of (Ti, Al)N films such as composition, microhardness, grain size, crystal structure were investigated. The chemical composition of (Ti, Al)N films was similar to the sputter area ratio of titanium to aluminum target by means of EDS and AES survey. The higher bias voltage to substrate and the smaller input of N2 gas showedthe increased microhardness and the finer grain size of the films. The results obtained from this study show, it is belived, that the (Ti, Al)N film by D.C.magne-tron sputtering is promising in the wear resistance use.

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Microstructure and Physical Properties of Sputtered Metal Containing Nanocrystalline Structured Carbon Coatings

  • Kim, Sung-I.;Han, Jeon-G.
    • Journal of Surface Science and Engineering
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    • v.40 no.2
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    • pp.59-62
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    • 2007
  • Metal containing hydrogen free nanocrystalline structured carbon (Me:nc-C) films were synthesized by closed-field unbalanced magnetron sputtering system (CFUBM). The aim of this study was to determine the relationship between the microstructure and physical properties of Me:nc-C films as a function of the concentration of materials. The film structures were examined by x-ray photoelectron spectroscopy and high resolution transmission electron microscopy. The physical properties of the Me:nc-C films were evaluated by using a 4-point probe. The fraction of graphite clusters was found to be increased by containing titanium and the electrical resistivity decreased with increasing amount of containing.

Structural, Morphological and Electrical Properties of TiO2 Thin Films Deposited by ALD Method

  • Seung-Yeon Oh;Jae-Min Shin;Gyeong-Hun Na;Min-Seok Kwon;Sang-Jeen Hong;Bumsuk Jung
    • Journal of the Semiconductor & Display Technology
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    • v.22 no.2
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    • pp.87-95
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    • 2023
  • TiO2 thin films were grown using the Atomic Layer Deposition (ALD) and their structural and electrical properties were investigated. The crystal structure, dielectric constant, and surface roughness of the TiO2 thin films grown by the ALD deposition method were studied. The grown TiO2 thin films showed an anatase crystal structure, and their properties varied with temperature. In particular, the properties of the TiO2 thin films were confirmed by changing the process temperature. The electrical properties of Metal-Insulator-Silicon (MIS) capacitor structures were analyzed using a probe station. The performance improvement of capacitors using TiO2 as a dielectric was confirmed by measuring capacitance through Capacitance-Voltage (C-V) curves.

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A Study on the Phase Transformations of (TiAl)N Films Deposited by TFT Sputtering System (TFT(Two-Facing-Targets) 스퍼터장치에 의해 증착된 (TiAl)N 박막의 상변태에 관한 연구)

  • Han, Chang-Suk
    • Journal of the Korean Society for Heat Treatment
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    • v.18 no.5
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    • pp.281-287
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    • 2005
  • Titanium aluminium nitride((TiAl)N) film is anticipated as an advanced coating film with wear resistance used for drills, bites etc. and with corrosion resistance at a high temperature. In this study, (TiAl)N thin films were deposited both at room temperature and at elevated substrate temperatures of 573 to 773 K by using a two-facing-targets type DC sputtering system in a mixture Ar and $N_2$ gases. Atomic compositions of the binary Ti-Al alloy target is Al-rich (25Ti-75Al (atm%)). Process parameters such as precursor volume %, substrate temperature and Ar/$N_2$ gas ratio were optimized. The crystallization processes and phase transformations of (TiAl)N thin films were investigated by X-ray diffraction, field-emission scanning electron microscopy. The microhardness of (TiAl)N thin films were measured by a dynamic hardness tester. The films obtained with Ar/$N_2$ gas ratio of 1:3 and at 673 K substrate temperature showed the highest microhardness of $H_v$ 810. The crystallized and phase transformations of (TiAl)N thin films were $Ti_2AlN+AlN{\rightarrow}TiN+AlN$ for Ar/$N_2$ gas ratio of 1:3, $Ti_2AlN+AlN{\rightarrow}TiN+AlN{\rightarrow}Ti_2AlN+TiN+AlN$ for Ar/$N_2$ gas ratio of 1:1 and $TiN+AlN{\rightarrow}Ti_2AlN+TiN+AlN{\rightarrow}Ti_2AlN+AlN{\rightarrow}Ti_2AlN+TiN+AlN$ for Ar/$N_2$ gas ratio of 3:1. The above results are discussed in terms of crystallized phases and microhardness.

Effect of Hosts on the Aggregation Behavior of Oxazine 720 (Oxazine 720의 응집 현상에 미치는 호스트의 영향)

  • Kang, Tae-Wook;Lee, In-Ja
    • Applied Chemistry for Engineering
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    • v.18 no.1
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    • pp.90-93
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    • 2007
  • The effects of the host on the aggregation behavior of Oxaxine 720 (Ox720) were studied using absorption, fluorescence, and excitation spectra. The host materials used in this study were water, ethanol, and $TiO_2/P123$ nanocomposite. Ox720 aqueous solution contains a significant amount of H-aggregates, which increases with the increase in the concentration. In ethanol solution, Ox720 mainly exists in the monomer form and tiny amount of Ox720 exists in H- and J-aggregate forms. In the $TiO_2/P123$ nanocomposite thin film, the amount of H-aggregates was smaller than that in the aqueous solution but greater than that in the ethanol solution. $TiO_2$ nanocomposite thin film was proven to be a moderately good host for Ox720.

Polymer Waveguide Based Refractive Index Sensor Using Polarimetric Interference (편광 간섭을 이용한 광도파로 기반의 표면 굴절률 센서)

  • Son, Geun-Sik;Kwon, Soon-Woo;Kim, Woo-Kyung;Yang, Woo-Seok;Lee, Hyung-Man;Lee, Han-Young;Lee, Sung-Dong;Lee, Sang-Shin
    • Korean Journal of Optics and Photonics
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    • v.19 no.3
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    • pp.193-198
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    • 2008
  • A novel refractive index sensor, which consists of polymer channel waveguide overlaid with $TiO_2$ thin film, is demonstrated. To evaluate the fabricated sensor, we measured the polarimetric interference induced by concentration change of injected glycerol solution. Our experimental results show that thicker $TiO_2$ film improves the sensitivity of the polarimetric interferometer. For the fabricated waveguide with a 20 nm thick $TiO_2$ film, the measured index change to lead phase variation of $2{\pi}$ is $1.8{\times}10^{-3}$.

Effects of Oxygen on Preparation of TiO2 Thin Films by MOCVD (MOCVD법에 의한 TiO2 박막의 제조에 미치는 산소의 영향)

  • Yu, Seong-Uk;Park, Byeong-Ok;Jo, Sang-Hui
    • Korean Journal of Crystallography
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    • v.6 no.2
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    • pp.111-117
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    • 1995
  • TiO2 thin films were prepared on a (100)silicon wafer using a chemical vapor deposition(CVD) method. The deposition experiments were performed using the TTIP in the deposition temperature ransing from 200 content. The deposition rate of TiO2 was increased with the substrate temperature and the oxygen content. The thickness of the deposited thin film and the compositional analysis of this thin films with theoxygen content were measured using Ellipsometry, SEM and ESCA, respectively. The deposited thin film was composed of a bilayer, external TiO2 and internal Ti. Carbon as a residual impurity was found to remain when zero sccm O2 was purged into a reaction chamber and the composition of the deposited thin film was found to change Ti into TiO in a deeper layer. However, when 600sccm O2 was supplied to a reaction chamber, it has been found to reside less carbon content than without O2. Finally, in the condition of 1200sccm O2, no impurity level of carbon was observed and a deeper layer consisted of the Ti composite, even though the deposited surface was composed of TiO2.

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