• Title/Summary/Keyword: Tip/Tilt stage

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The design of XYZ 3-axis stage for AFM system (AFM 시스템을 위한 XYZ 3축 스테이지의 설계)

  • 김동민;김기현;심종엽;권대갑;엄천일
    • Proceedings of the Korea Crystallographic Association Conference
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    • 2002.11a
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    • pp.36-36
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    • 2002
  • To Establish of standard technique of length measurent in 2D plane, we develope AFM system. The XY scanner scans the sample only in XY plane, while the Z scanner scans the specimen only in Z-direction. Cantilever tip is controlled to has constant height relative to speciman surface by feedback of PSPD signal. To acquire high accuracy, Z-axis measuring sensor will be added.(COXI or others). In this paper we design XYZ stage suitable for this AEM system. For XY stage, single module parallel-kinnematic flexure stage is used which has high orthogonality and minimum out-of-plane motion. To obtain best performance optimal design is performed. For XY stage, to be robust about parasitic motion optimal design of maximizing Z and tilt stiffness is performed under the constraint of motion range and stage size. And for Z stage, optimal design of maximizing 1st resonant frequency is performed. Because if resonant frequency is get higher, scan speed is improved. So it makes reduce the error by sensor drift. Resultly XYZ stage each have 1st natural frequency of 115㎐, 201㎐, 2.66㎑ and range 109㎛, 110㎛, 12㎛.

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Upper Wafer Handling Module Design and Control for Wafer Hybrid Bonding (Wafer Hybrid Bonding을 위한 Upper Wafer Handling 모듈 설계 및 제어)

  • Kim, Tae Ho;Mun, Jea Wook;Choi, Young Man;An, Dahoon;Lee, Hak-Jun
    • Journal of the Semiconductor & Display Technology
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    • v.21 no.1
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    • pp.142-147
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    • 2022
  • After introducing Hybrid Bonding technology into image sensors using stacked sensors and image processors, large quantity production became possible. As a result, it is currently used in most of the CMOS image market in smartphones and other image-based devices worldwide, and almost all stacked CIS manufacturing sites have focused on miniaturization using hybrid bonding. In this study, an upper wafer handling module for Wafer to Wafer Hybrid Bonding developed to increase the alignment and precision between wafers when wafer bonding. The module was divided two parts to reduce error of both the alignment and degree of precision during wafer bonding. Wafer handling module developed both new Tip/Tilt system controlling θx,θy of upper wafer and striker to push upper wafer. Based on this, it was confirmed through the stability evaluation that the upper wafer handling module can be controlled without any problem during W2W hybrid bonding.

Development Plan for the GMT Fast-steering Secondary Mirror

  • Lee, Sugnho;Han, Jeong-Yeol;Park, Chan;Jeong, Ueejeong;Yoon, Yang-noh;Song, Je Heon;Moon, Bongkon;Park, Byeong-Gon;Cho, Myung K.;Dribusch, Christoph;Park, Won Hyun;Jun, Youra;Yang, Ho-Soon;Moon, Il-Kwon;Oh, Chang Jin;Kim, Ho-Sang;Lee, Kyoung-Don;Bernier, Robert;Gardner, Paul;Alongi, Chris;Rakich, Andrew;Dettmann, Lee;Rosenthal, Wylie
    • The Bulletin of The Korean Astronomical Society
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    • v.41 no.2
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    • pp.66.3-67
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    • 2016
  • The Giant Magellan Telescope (GMT) will feature two interchangeable Gregorian secondary mirrors, an adaptive secondary mirror (ASM) and a fast-steering secondary mirror (FSM). The FSM has an effective diameter of 3.2 m and built as seven 1.1 m diameter circular segments, which are conjugated 1:1 to the seven 8.4m segments of the primary. Each FSM segment contains a tip-tilt capability for fine co-alignment of the telescope subapertures and fast guiding to attenuate telescope wind shake and mount control jitter. This tip-tilt capability thus enhances performance of the telescope in the seeing limited observation mode. As the first stage of the FSM development, KASI conducted a Phase 0 study to develop a program plan detailing the design and manufacturing process for the seven FSM segments. The GMTO-KASI team matured this plan via an internal review in May 2016 and the revised plan was further assessed by an external review in June 2016. In this poster, we present the technical aspects of the FSM development plan.

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Analysis and Design of 3-DOF Parallel Mechanism Based on Kinematic Couplings (기구학적 커플링으로 구성된 3자유도 병렬 메커니즘 해석 및 설계)

  • Wang, Wei-Jun;Han, Chang-Soo
    • Journal of the Korean Society of Manufacturing Technology Engineers
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    • v.21 no.3
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    • pp.479-486
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    • 2012
  • This paper presents a high-speed automatic micro-alignment system that is a part of an inspection machine for small-sized molded lenses of mobile phones, palm-top computers, and so on. This work was motivated by the shortcomings of existing highest-grade commercial machine. A simple tip/tilt/Z parallel mechanism is designed based on kinematic couplings, which is a 3-degree-of-freedom (3-DOF) moderate-cost alignment stage. It is used to automatically adjust the posture of each lens on the tray, which is impossible by the conventional instrument. Amplified piezoelectric actuators are used to ensure the accuracy and dynamic response. Forward kinematic analysis and simulation show that the parasitic motion is small enough compared to the actuator stroke. From the workspace analysis of the moving platform, it is clear that the output motion range satisfies the design requirements.