• Journal of Electrochemical Science and Technology
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• v.6 no.4
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• pp.116-120
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• 2015

Lithium diffusivity of fluorine-free and -doped tin-nickel (Sn-Ni) film model electrodes with improved interfacial (solid electrolyte interphase (SEI)) stability has been determined, utilizing variable rate cyclic voltammetry (CV). The method for interfacial stabilization comprises fluorine-doping on the electrode together with the use of electrolyte including fluorinated ethylene carbonate (FEC) solvent and trimethyl phosphite additive. It is found that lithium diffusivity of Sn is largely dependent on the fluorine-doping on the Sn-Ni electrode and interfacial stability. Lithium diffusivity of fluorine-doped electrode is one order higher than that of fluorine-free electrode, which is ascribed to the enhanced electrical conductivity and interfacial stabilization effect.

• Journal of the Microelectronics and Packaging Society
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• v.12 no.1 s.34
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• pp.65-71
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• 2005

At present, Electronic industries push ahead to eliminate the Pb(Lead) -a hazardous material-from all products. Especially, we have performed to select the optimum standard composition of lead free alloy for the application to products for about 3 years from 2000. These days, we have the chance for applying to the mass-production. This project constructed the system for applying the lead free solders on consumer electronic products, which is one of the major products of the LG Electronics. To select the lead free solders with corresponding to the product features, we have passed through the test and applied with Sn-3.0Ag-0.5Cu alloy system to our products, and for the application to the high melting temperature composition, we secured the thermal resistance of the many parts and substrate and optimized the processing conditions. We have operated the temperature cycling test and the high temperature storage test under the standards to confirm the reliability of the products. On these samples, we considered the consequence of our decision by the operating test. For the long life time of the product, we have operated the temperature cycling test at $-45^{\circ}C\;-\;+125^{\circ}C$, 1 cycle/hour, 1000 cycles. Also we have tested the tin whisker growth about lead free plating on lead finish. We have analyzed with the SEM, EDS and any other equipment for confirming the failure mode at the joint and the tin whisker growth on lead free finish.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.93-99
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• 2004

At present, LG Electronics pushes ahead to eliminate the Pb(Lead) -a hazardous material- from all products. Especially, we have performed to select the optimum standard composition of lead free alloy for the application to products for about 3 years from 2000. These days, we have the chance for applying to the mass-production. This project constructed the system for applying the lead free solders on consumer electronic products, which is one of the major products of the LG Electronics. To select the lead free solders with corresponding to the product features, we have passed through the test and applied with Sn-3.0Ag-0.5Cu alloy system to our products, and for the application to the high melting temperature composition, we secured the thermal resistance of the many parts and substrate and optimized the processing conditions. We have operated the temperature cycling test and the high temperature storage test under the standards to confirm the reliability of the products. On these samples, we considered the consequence of our decision by the operating test. For the long life time of the product, we have operated the temperature cycling test at $-45^{\circ}C-+125^{\circ}C$, 1 cycle/hour, 1000 cycles. Also we have tested the tin whisker growth about lead free plating on lead finish. We have analyzed with the SEM, EDS and any other equipment for confirming the failure mode at the joint and the tin whisker growth on lead free finish.

• 한국정보디스플레이학회:학술대회논문집
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• 2007.08a
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• pp.190-192
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• 2007

A neutral beam system has been developed to produce hyperthermal neutral beams composed of indium, tin, and oxygen atoms. Using these hyper thermal neutral beams with energies in the range of tens of eV, high quality indium-tin oxide (ITO) thin films have been obtained on glass substrates at room temperature. The optical transmittance of the films is higher than 85% at a wavelength of 550 nm and the electrical resistivity is lower than $1{\times}10^{-3}{\Omega}cm$.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.24 no.1
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• pp.49-55
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• 2015

This paper reports solution-processed, high-efficiency organic light-emitting diodes (OLEDs) fabricated by a knife coating method under ambient air conditions. In addition, indium tin oxide (ITO), traditionally used as the anode, was substituted by optimizing the conductivity enhancement treatment of poly(3,4-ethylene dioxythiophene):poly(styrene sulfonate) (PEDOT:PSS) films on a polyethylene terephthalate (PET) substrate. The transmittance and sheet resistance of the optimized PEDOT:PSS anode were 83.4% and $27.8{\Omega}/sq$., respectively. The root mean square surface roughness of the PEDOT:PSS anode, measured by atomic force microscopy, was only 2.95 nm. The optimized OLED device showed a maximum current efficiency and maximum luminous density of 5.44 cd/A and $8,356cd/m^2$, respectively. As a result, the OLEDs created using the PEDOT:PSS anode possessed highly comparable characteristics to those created using ITO anodes.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.209-209
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• 2012

High-efficient transparent conductive oxide (TCO) film-embedding Si heterojunction solar cells were fabricated. An additional doping was not applied for heterojunction solar cells due to the spontaneous junction formation between TCO films and an n-type Si substrate. Three different TCO coatings were formed by sputtering method for an Al-doped ZnO (AZO) film, an indium-tin-oxide (ITO) film and double stacks of ITO/AZO films. An improved crystalline ITO film was grown on an AZO template upon hetero-epitaxial growth. This double TCO films-embedding Si heterojunction solar cell provided significantly enhanced efficiency of 9.23% as compared to the single TCO/Si devices. The effective arrangement of TCO films (ITO/AZO) provides benefits of a lower front contact resistance and a smaller band offset to Si leading enhanced photovoltaic performances. This demonstrates a potential scheme of the effective TCO film-embedding heterojunction Si solar cells.

• Corrosion Science and Technology
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• v.21 no.5
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• pp.381-389
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• 2022

Cyclic Voltammetry and weight loss measurements were used to investigate corrosion prevention of tin in a 0.5M citric acid solution containing Anthocyanins extracted from grapes at various concentrations and temperatures. Results showed that the investigated chemicals, Anthocyanins extracted from grapes, performed well as tin corrosion inhibitors in 0.5M citric acid. Increasing the concentration of Anthocyanins increased their corrosion inhibition efficiencies. When the temperature dropped, their inhibition efficiencies, increased indicating that higher temperature tin dissolution predominated the adsorption of Anthocyanins at the surface of tin metal. When inhibitor concentrations were increased, their inhibition efficiencies were also increased. These results revealed that corrosion of tin metal was inhibited by a mixed type of adsorption on the metal surface. The adsorption isotherm of Langmuir governed the adsorption of Anthocyanins. Thermodynamic parameters such as the enthalpy of adsorption, the entropy of adsorption, and Gibbs free energy and kinetic parameters such as activation energy, enthalpy of activation, and entropy of activation were computed and discussed in this study.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.09a
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• pp.147-163
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• 2003

European Union bans the usage of Pb in electronics from July 1 st, 2006. The Near-eutectic Sn-Ag-Cu alloys are the leading candidate Pb-free solders (for SMT card assembly). .The microstructure of Sn-Ag-Cu alloys is discussed in terms of solidification, composition and cooling rate. Methods of controlling Ag3Sn plates are discussed. .Thermo-mechanical fatigue behaviors of Sn-Ag-Cu solder joints are reviewed. Tin pest, whisker growth, electromigration of Pb-free solders are discussed.

• Resources Recycling
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• v.31 no.3
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• pp.61-72
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• 2022

We investigated the electrochemical behavior of Sn (93.0 %)-Ag (4.06 %)-Cu (0.89 %) during electrolysis of Pb-free solder waste to recover tin and silver. A thin strip of the solder waste produced by high-temperature melting and casting was used as a working electrode to perform electrochemical analysis. During anodic polarization, the current peak of an active region decreased with an increase in the concentration of sulfuric acid used as an electrolyte. This resulted in the electro-dissolution of the working electrode in the electrolyte (1.0 molL^-1 sulfuric acid) for a constant current study. The study revealed that the thickening of an anode slime layer at the working surface continuously increased the electrode potential of the working electrode. At 10 mAcm^-2, the dissolution reaction continued for 25 h. By contrast, at 50 mAcm^-2, a sharp increase in the electrode potential stopped the dissolution in 2.5 h. During dissolution, silver enrichment in the anode slime reached 94.3% in the 1 molL^-1 sulfuric acid electrolyte containing a 0.3 molL^-1 chlorine ion, which was 12.7% higher than that without chlorine addition. Moreover, the chlorine enhanced the stability of the dissolved tin ions in the electrolyte as well as the current efficiency of tin electro-deposition at the counter electrode.

• Advances in materials Research
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• v.2 no.2
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• pp.93-98
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• 2013

Objective of this study is to calculate gamma buildup factors for pointed and isotropic gamma sources in depleted uranium, uranium dioxide, natural uranium, tin, water and concrete using MCNP4C code. The thickness of the media ranges from 0.5 to 10 mean-free-path (mfp) and gamma energy ranges from 0.5 to 10 MeV. Owing to the outstanding accuracy of MCNP in calculation involving gamma interaction, results fairly match those reported previously. The maximum relative error is 2%.