• Archives of design research
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• v.20 no.3 s.71
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• pp.279-288
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• 2007

Today, design is not free from fashion, which emerges and vanishes temporarily, and aims at equalization. As a result, products quickly become obsolete because of fashion. This means that the span of products is determined by a social concept, which is not clarified, regardless of their functions. Usable products will gradually disappear from us and it will cause serious environmental problems, unless we can find out measures against fashion. As such, it is important to study the characteristics of the shaker's design in this circumstance. The Shaker's community has a distinguishable difference from other general societies. Temporary fashion and misled information cannot interfere with their consciousness. Religion, the life and the principle of design have developed on the same level in their community. Especially, any decoration or the difference of materials is not allowed in shaker's design. It reflects their thinking that all people are equal in the sight of God. Therefore, any decoration for social and economical superiority can not be used. Through this consciousness, they can be free from fashion or decoration. They, also, believe that they can reach perfection through practicality and simplicity. The reason why shaker's design is not disturbed by fashion is that their belief is involved in their design. Consequently, if religious or conscious contents are primarily set up, design can be free from fashion and products can be used for a long time.

• Korean Journal of Food Science and Technology
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• v.12 no.3
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• pp.193-199
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• 1980

A series of tests were conducted on the reesterification of rice bran oil containing high free fatty acids (acid value=119.7) with theoretical equivalent of glycerol. Test results showed that reaction rate (in terms of decrease in acid value) was increased as the reaction temperature was increased regardless of the presence of the catalyst and reaction time (42.7, 21.5 and 10.0 at $170^{\circ}C,\;210^{\circ}C\;and\;250^{\circ}C$, respectively) and as the reaction time was increased regardless of the temperature and the presence of the catalyst (31.1 vs 18.3 for 3 hrs vs 6 hrs). The presence of the catalyst (0.2% tin chloride) also accelerated the rate regardless of the reaction temperature and time (36.9 vs 12.5). Analysis by column chromatography showed that content of triglyceride in the oil was increased to 72.9% and 61.1% from 10.4% and content of free fatty acids in the oil was decreased to 1.4% and 6.1% from 60.2%, when the degummed oil was esterified at $250^{\circ}C$ for 6 hrs in the presence of and in the absence of the catalyst, respectively. The results estimated from the iodine values indicate that polymer formation was not significant, when the oil was esterified for 6 hrs at temperatures up to $210^{\circ}C$. However, it was somewhat significant for the oil esterified at $250^{\circ}C$ for 6 hrs. The catalyst did not affect the polymer formation. Analysis by high performance liquid chromatography showed that oleic acid (42.5%), linoleic acid (29.0%) and palmitic acid (20.3%) were the major fatty acid components of the rice bran oil.

• Journal of the Microelectronics and Packaging Society
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• v.7 no.4
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• pp.23-29
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• 2000

We demonstrate the fabrication method of high-density and high-quality solder bump solving a copper (Cu) cross-contamination in Si-LSI laboratory. The Cu cross-contamination is solved by separating solder-bump process by two steps. Former is via-formation process excluding Cu/Ti under ball metallurgy (UBM) layer sputtering in Si-LSI laboratory. Latter is electroplating process including Ti-adhesion and Cu-seed layers sputtering out of Si-LSI laboratory. Thick photoresist (PR) is achieved by a multiple coating method. After TiW/Al-electrode sputtering for electroplating and via formation in Si-LSI laboratory, Cu/Ti UBM layer is sputtered on sample. The Cu-seed layer on the PR is etched during Cu-electroplating with low-electroplating rate due to a difference in resistance of UBM layer between via bottom and PR. Therefore Cu-buffer layer can be electroplated selectively at the via bottom. After etching the Ti-adhesion layer on the PR, Sn/Pb solder layer with a composition of 60/40 is electroplated using a tin-lead electroplating bath with a metal stoichiometry of 60/40 (weight percent ratio). Scanning electron microscope image shows that the fabricated solder bump is high-uniformity and high-quality as well as symmetric mushroom shape. The solder bumps with even 40/60 $\mu\textrm{m}$ in diameter/pitch do not touch during electroplating and reflow procedures. The solder-bump process of high-uniformity and high-density with the Cu cross-contamination free in Si-LSI laboratory will be effective for electronic microwave application.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.38 no.8
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• pp.695-700
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• 2014

In the present study, the melting temperature depression of Sn nanoparticles manufactured using the modified evaporation method was investigated. For this purpose, a modified evaporation method with mass productivity was developed. Using the manufacturing process, Sn nanoparticles of 10 nm size was manufactured in benzyl alcohol solution to prevent oxidation. To examine the morphology and size distribution of the nanonoparticles, a transmission electron microscope was used. The melting temperature of the Sn nanoparticles was measured using a Differential scanning calorimetry (DSC) which can calculate the endothermic energy during the phase changing process and an X-ray photoelectron spectroscopy (XPS) used for observing the manufactured Sn nanoparticle compound. The melting temperature of the Sn nanoparticles was observed to be $129^{\circ}C$, which is $44^{\circ}C$ lower than that of the bulk material. Finally, the melting temperature was compared with the Gibbs Thomson and Lai's equations, which can predict the melting temperature according to the particle size. Based on the experimental results, the melting temperature of the Sn nanoparticles was found to match well with those recommended by the Lai's equation.

• Proceedings of the Materials Research Society of Korea Conference
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• 2003.11a
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• pp.208-208
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• 2003

RF 마그네트론 스퍼터링법을 이용하여 Ar과 $O_2$의 유량을 25sccm씩 흘리면서 $SiO_2$/Si기판 위에 Sn $O_2$ 박막을 증착하였다. 증착된 박막은 columnar 구조로 성장하였으며 많은 입자들이 뭉쳐서 형성된 양배추꽃(cauliflower) 형태의 뭉친 입자(agglomerates)를 가지는 표면형상이 관찰되었다. 분위기에 따른 어닐링 효과를 확인하기 위하여 50$0^{\circ}C$에서 공기와 질소 분위기하에서 열처리하였다. 열처리한 후 표면거칠기가 개선되었으며, 표면형상의 변화가 발생하였다. 특히 50$0^{\circ}C$, 질소분위기에서 어닐링한 경우는 양배추꽃 형태의 표면형상이 소수의 작은 입자가 뭉친 형태로 분리되면서 입도분포가 개선되었다. 이러한 결과는 어닐링 과정에서 발생되는 응력을 완화시키기 위하여 표면형상의 변화가 발생하는 것으로 판단된다. XPS 측정 결과, 질소 분위기에서 어닐링한 후에 OIs와 Sn5/3d 피크가 낮은 결합에너지에 위치하고 있어 산소공공의 농도가 어닐링 전에 비하여 증가하였음을 확인할 수 있다. 어닐링 전후에 Sn $O_2$ 박막의 면저항 측정 값은 XPS 결과와는 달리 질소 분위기 어닐링한 후에 오히려 면저항값이 크게 증가하였다. 이러한 결과는 질소 분위기 어닐링한 후 표면형상의 변화에 기인하여 입자간의 연결성이 저하되어 면저항값이 증가한 것으로 추정된다. 산소분위기에서 어닐링한 후에 전체적으로 전기적 특성의 재현성이 개선되었으며 Sensitivity( $R_{air}$/ $R_{gas}$)가 향상되었음을 확인하였다.하였다.석을 통하여 La의 분포를 확인하였으며, HRTEM 분석을 통하여 미세구조분석을 실시하였다.2463eV였다. 10K에서 광발광 봉우리의 919.8nm (1.3479eV)는 free exciton(Ex), 954.5nm (1.2989eV)는 donor-bound exciton 인 I2(DO,X)와 959.5nm (1.2921eV)는 acceptor-bound exciton 인 I1(AO,X) 이고, 964.6nm(1.2853eV)는 donor-acceptor pair(DAP) 발광, 1341.9nm (0.9239eV)는 self activated(SA)에 기인하는 광발광 봉우리로 고찰되었다.가 높을수록 방출전류가 시간에 따라 급격히 감소하였다. 각 duty비에서 방출전류의 양이 1/2로 감소하는 시점을 에미터의 수명으로 볼 때 duty비 대 에미터 수명관계를 구해 높은 duty비에서 전계방출을 시킴으로써 실제의 구동조건인 낮은 duty비에서의 수명을 단시간에 예측할 수 있었다. 단속적으로 일어난 것으로 생각된다.리 폐 관류는 정맥주입 방법에 비해 고농도의 cisplatin 투여로 인한 다른 장기에서의 농도 증가 없이 폐 조직에 약 50배 정도의 고농도 cisplatin을 투여할 수 있었으며, 또한 분리 폐 관류 시 cisplatin에 의한 직접적 폐 독성은 발견되지 않았다이 낮았으나 통계학적 의의는 없었다[10.0%(4/40) : 8.2%(20/244), p>0.05]. 결론: 비디오흉강경술에서 재발을 낮추기 위해 수술시 폐야 전체를 관찰하여 존재하는 폐기포를 놓치지 않는 것이 중요하며, 폐기포를 확인하지 못한 경우와 이차성 자연기흉에 대해서는 흉막유착술에 더 세심한 주의가 필요하다는 것을 확인하였다. 비디오흉강경수술은 통증이 적고, 입원기간이 짧고,

• Journal of the Microelectronics and Packaging Society
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• v.13 no.1 s.38
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• pp.23-29
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• 2006

Ultrasonic soldering of Si-wafer to FR-4 PCB at ambient temperature was investigated. The UBM of Si-substrate was Cu/ Ni/ Al from top to bottom with thickness of $0.4{\mu}m,\;0.4{\mu}m$, and $0.3{\mu}m$ respectively. The pad on FR-4 PCB comprised of Au/ Ni/ Cu from top to bottom with thickness of $0.05{\mu}m,\;5{\mu}m$, and $18{\mu}m$ respectively. Sn-3.5wt%Ag foil rolled to $100{\mu}m$ was used for solder. The ultrasonic soldering time was varied from 0.5 s to 3.0 s and the ultrasonic power was 1,400 W. The experimental results show that a reliable bond by ultrasonic soldering at ambient temperature was obtained. The shear strength increased with soldering time up to a maximum of 65 N at 2.5 s. The strength decreased to 34 N at 3.0 s because cracks were generated along the intermetallic compound between Si-wafer and Sn-3.5wt%Ag solder. The Intermetallic compound produced by ultrasonic soldering between the Si-wafer and the solder was $(Cu,Ni)_{6}Sn_{5}$.

• Korean Journal of Environmental Biology
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• v.26 no.2
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• pp.102-108
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• 2008

Many alternative biocidal additives were applied to antifouling paint to replace TBT, and Sea-Nine 211 is one of alternating organic booster compounds used in antifouling paint. In this study, extent of Sea-Nine 211 toxicity on marine benthic bivalve is evaluated. Sea-Nine 211 was injected to surf clam, Pseudocardium sachalinensis, that inhabitate northern part of Gangwon Province, Korea. Survival rate of the clam and xenobiotics metabolizing enzyme activities in digestive gland were measured during 4 day-exposure period. The results were compared with those of TBT exposed clam. There were no mortality of clam in the solvent (DMSO) control group and the three Sea-Nine 211 exposure groups (5, 25, 50 mg kg$^{-1}$ body weight), while the clam exposed to 1, 2 and 5 mg kg$^{-1}$ TBT chloride (TBTC) demonstrated 70, 30 and 0% survival rate, respectively. The Sea-Nine 211 exposure group showed a tendency of cytochrome P450 (CYP) induction according to the exposure duration, on the other hand, CYP content was decreased in the TBT exposure group. NADPH cytochrome P450 reductase activity slightly increase according to the exposure duration in the Sea-Nine 211 exposure group, while TBTC inhibit its activity as CYP content. Moreover, there was no significant change of NADH cytochrome b5 reductate activity in the clam epxosed to Sea-Nine 211. In the TBTC exposure group, its activity increased in early exposure period and then significantly decreased the rest of exposure period. All the results indicate that Sea-Nine 211 demonstrated a tendency to induce CYP level, while TBTC inhibits the CYP level, NADPH cytochrome P450 reductase and NADH cytochrome b5 reductase activities.

• Proceedings of the Materials Research Society of Korea Conference
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• 2012.05a
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• pp.65-65
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• 2012

Copper zinc tin sulfide ($Cu_2ZnSnS_4$, CZTS) is a very promising material as a low cost absorber alternative to other chalcopyrite-type semiconductors based on Ga or In because of the abundant and economical elements. In addition, CZTS has a band-gap energy of 1.4~1.5eV and large absorption coefficient over ${\sim}10^4cm^{-1}$, which is similar to those of $Cu(In,Ga)Se_2$(CIGS) regarded as one of the most successful absorber materials for high efficient solar cell. Most previous works on the fabrication of CZTS thin films were based on the vacuum deposition such as thermal evaporation and RF magnetron sputtering. Although the vacuum deposition has been widely adopted, it is quite expensive and complicated. In this regard, the solution processes such as sol-gel method, nanocrystal dispersion and hybrid slurry method have been developed for easy and cost-effective fabrication of CZTS film. Among these methods, the hybrid slurry method is favorable to make high crystalline and dense absorber layer. However, this method has the demerit using the toxic and explosive hydrazine solvent, which has severe limitation for common use. With these considerations, it is highly desirable to develop a robust, easily scalable and relatively safe solution-based process for the fabrication of a high quality CZTS absorber layer. Here, we demonstrate the fabrication of a high quality CZTS absorber layer with a thickness of 1.5~2.0 ${\mu}m$ and micrometer-scaled grains using two different non-vacuum approaches. The first solution-processing approach includes air-stable non-toxic solvent-based inks in which the commercially available precursor nanoparticles are dispersed in ethanol. Our readily achievable air-stable precursor ink, without the involvement of complex particle synthesis, high toxic solvents, or organic additives, facilitates a convenient method to fabricate a high quality CZTS absorber layer with uniform surface composition and across the film depth when annealed at $530^{\circ}C$. The conversion efficiency and fill factor for the non-toxic ink based solar cells are 5.14% and 52.8%, respectively. The other method is based on the nanocrystal dispersions that are a key ingredient in the deposition of thermally annealed absorber layers. We report a facile synthetic method to produce phase-pure CZTS nanocrystals capped with less toxic and more easily removable ligands. The resulting CZTS nanoparticle dispersion enables us to fabricate uniform, crack-free absorber layer onto Mo-coated soda-lime glass at $500^{\circ}C$, which exhibits a robust and reproducible photovoltaic response. Our simple and less-toxic approach for the fabrication of CZTS layer, reported here, will be the first step in realizing the low-cost solution-processed CZTS solar cell with high efficiency.

• Journal of the Korean institute of surface engineering
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• v.50 no.5
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• pp.411-420
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• 2017

In this paper, two methods of making the Pd-added $SnO_2$ ($Pd-SnO_2$) powder with pure tetragonal phase by the hydrazine method were suggested and compared in terms of crystal structure, surface morphology, and alcohol gas response. One of the addition methods is to use $PdCl_2$ as a Pd source, the other is to use Pd-based organic with oleylamine (OAM). When Pd concentration was increased from 0 to 5 wt%, the average grain size of $Pd-SnO_2$ made with Pd-OAM were decreased from 32 to 12 nm. In the case of using with $PdCl_2$, grain size of the $PdCl_2$ fell to less than 10 nm. However, agglomerated and extruded surface morphology was observed for the films with Pd addition over 4 wt%. The crack-free $Pd-SnO_2$ thick films were able to successfully fill the $30{\mu}m$ gap of patterned Pt electrodes by optimized ink dropping method. Also, the 2 wt% $Pd-SnO_2$ thick film made with PdCl2 showed gas responses ($R_{air}/R_{gas}$) of 3.7, 5.7 and 9.0 at alcohol concentrations of 10, 50 and 100 ppm, respectively. On the other hand, the prepared 3 wt% $Pd-SnO_2$ thick film with Pd-OAM exhibited very excellent responses of 3.4, 6.8 and 12.2 at the equivalent measurement conditions, respectively. The 3 wt% $Pd-SnO_2$ thick film with Pd-OAM has a specific surface area of $31.39m^2/g$.

• Journal of Chest Surgery
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• v.39 no.2 s.259
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• pp.106-110
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• 2006

Background: Bronchioloalveolar carcinoma (BAC) is an uncommon primary malignancy of the lung, and it accounts for $2{\~}14\%$ of all pulmonary malignancies. According to World Health Organization (WHO) categorisation, BAC is a subtype of adenocarcinoma. The current definition of BAC includes the following: malignant neoplasms of the lung that have no evidence of extrathoracic primary adenocarcinoma, an absence of a central bronchogenic source, a peripheral parenchymal location, and neoplastic cells growing along the alveolar septa. Previous reports had demonstrated a better prognosis following surgery for patients affected by BAC than those affected by other type of non-small cell lung cancer (NSCLC). We aim to analyse Asan Medical Center experiences of BAC. Material and Method: Between 1990 and 2002, 31 patients were received operations for BAC. We analyse retrosepectively sex, age, disease location, preoperative clinical stage, postoperative pathologic stage & complications, survival according to medical record. Result: There were 12 men and 19 women, the average age was 61.09$\pm$10.63 ($31{\~}79$) years. Tumor locations were 7 in RUL, 1 in RML, 4 in RLL, 8 in LUL, 11 in LLL. Operations were 28 lobectomies, 2 pneumonectomies. Postoperative pathologic stage were 12 T1N0M0, 15 T2N0M0, 1 T1N1M0, 1 T1N2M0, 1 T2N2M0, 1 T1N0M1. Mortality were 4 cases ($12.9\%$) and there were no early mortality. Cancer free death was 1 cases, other 3 were cancer related deaths. All of them were affected by distal metastasis and received chemotherapy and each metastatic locations were right rib, brain, and both lung field. The average follow up periods were 50.87$\pm$24.77 months. The overall 3, 5-year survival rate among all patients was $97.1\%,\;83.7\%$, stage I patients overall 2, 5year survival rate was $96.3\%$. The overall disease free 1, 2, 5-year survival rate among all patients was $100\%,\;90\%,\;76\%$ and 2, 5-year survival rate in cases of stage I was $96.4\%,\;90.6\%$. 7 cases ($22.58\%$) were chemotherapies, 1 case ($3.22\%$) was radiation therapy, and 2 cases ($6.45\%$) were chemoradiation therapies. Metastatic locations were 3 cases in lung, 1 case in bone, 1 cases in brain. Conclusion: BAC has a favourable survival and low recurrence rate compare with reported other NSCLC after operative resections.