• The Korean Journal of Ceramics
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• 제3권2호
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• pp.124-128
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• 1997

An attempt was made to understand the dissolution and reprecipitation behavior of the constituent phases such as TiC, TiN, and Ti(CN) in TiC-TiN-Ni system. During the liquid-phase sintering the TiC phase was found to dissolve preferentially in Ni binder. The solid-solution phase, Ti(CN), formed around the TiN phase, resulting in a core/rim structure. This result was reproduced when large TiC particles were used with fine TiN particles. The path for the microstructural change in TiC-TiN-Ni system was largely controlled by the difference in the interfacial energy of each phase with the liquid binder phase. The results were discussed with thermodynamic principles.

• 한국세라믹학회지
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• 제35권10호
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• pp.1020-1029
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• 1998

The reaction-bonded TiC-Ni/Si/Co composites were prepared by the melt infiltration of Co, Si, and Ni me-tal into the TiC preforms. The miocrostructure reaction composition and mechanical properties were in-vestigated. In the case of the melt infiltrated with Co and Ni TiC grain shape was changed from angular to spherical shape with the average grain size of ∼5$\mu\textrm{m}$. In the case of the melt infiltrated with Co/Si or Ni/Si, Si was reacted with TiC particles and formed SiC particles. The bending strength of both specimens which have atomic ratio of 3 were 710 MPa and 515 MPa respectively. In the case of the melt infiltrated with Ni/Si/Co,. nonstoichiometric TiC was formed and its bending strength decreased to 420 MPa.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2008년도 추계학술대회 논문집 Vol.21
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• pp.138-138
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• 2008

Ti capping layer를 이용하여 NiGe의 열적 안정성을 향상시키는 연구를 수행하였다. N-type Ge(100) 기판에 30nm 두께의 Ni과 30nm 두께의 Ti capping layer를 E-beam evaporator를 이용하여 증착하고 $300^{\circ}C$에서 $700^{\circ}C$ 까지 30초간 $N_2$ 분위기에서 급속 열처리하여 Ni-Germanide를 형성하였다. XRD의 결과로부터 Ti capping layer 유무에 상관없이, 전 온도 범위에 걸쳐 NiGe 상이 형성된 것을 관찰할 수 있었다. 급속 열처리 온도에 따른 면저항 값을 측정한 경우, $300^{\circ}C$에서 $600^{\circ}C$까지의 열처리 온도 범위에서는 모든 시편들이 비슷한 면저항 값을 보인 반면, 열처리 온도가 $700^{\circ}C$ 이상에서는 Ti capping layer가 있는 시편이 Ti capping layer가 없는 시편보다 낮은 면저항 값을 갖는 것을 확인할 수 있었다. 이는 고온 열처리 시 Ti capping layer에 있는 Ti가 기판 방향으로 확산하여 NiGe grain boundary에 segregation 되고 그로 인하여 NiGe의 grain boundary 움직임을 억제하여 agglomeration 현상을 효과적으로 방지하였기 때문에 나타난 현상으로 사료된다.

• 한국전기전자재료학회논문지
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• 제21권11호
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• pp.968-972
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• 2008

Ni/Ti/Al multilayer system ('/'denotes the deposition sequence) was tested for low-resistance ohmic contact formation to Al-implanted p-type 4H-SiC. Ni 30 nm / Ti 50 nm / Al 300 nm layers were sequentially deposited by e-beam evaporation on the 4H-SiC samples which were implanted with Al (norminal doping concentration = $4\times10^{19}cm^{-3}$) and then annealed at $1700^{\circ}C$ for dopant activation. Rapid thermal anneal (RTA) temperature for ohmic contact formation was varied in the range of $840\sim930^{\circ}C$. Specific contact resistances were extracted from the measured current vs. voltage (I-V) data of linear- and circular transfer length method (TLM) patterns. In constrast to Ni contact, Ni/Ti/Al contact shows perfectly linear I-V characteristics, and possesses much lower contact resistance of about $2\sim3\times10^{-4}\Omega{\cdot}cm^2$ even after low-temperature RTA at $840^{\circ}C$, which is about 2 orders of magnitude smaller than that of Ni contact. Therefore, it was shown that RTA temperature for ohmic contact formation can be lowered to at least $840^{\circ}C$ without significant compromise of contact resistance. X-ray diffraction (XRD) analysis indicated the existence of intermetallic compounds of Ni and Al as well as $NiSi_{1-x}$, but characteristic peaks of $Ti_{3}SiC_2$, a probable narrow-gap interfacial alloy responsible for low-resistance Ti/Al ohmic contact formation, were not detected. Therefore, Al in-diffusion into SiC surface region is considered to be the dominant mechanism of improvement in conduction behavior of Ni/Ti/Al contact.

• 한국결정성장학회지
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• 제7권4호
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• pp.632-639
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• 1997

단일상으로서는 치밀한 소결이 힘든 TiC 와 $TiB_2$ 혼합조성을 상압소결하여 얻어진 TiC-$TiB_2$ 고온복합체의 소결밀도와 미세구조를 연구하였다. 소성조제의 임계첨가량은 1 wt% Fe 및 3 wt% Ni으로 최대 소결밀도는 약 95%이었다. TiC-$TiB_2$ 복합체의 미세구조에서 TiC상은 matrix로서 $TiB_2$입자성장을 저지하였고, wave 흑은 계단식 상계면의 존재는 석출된 Ni-rich phases가 소결중 액상으로 존재하다가 냉각시 고화한 것으로 TEM분석결과 확인할 수 있었다. 또한, 이들 Ni-rich phases는 matrix grain안에서 dislocation형성 요인으로 작용하고 있음이 확인되었다.

• 한국분말재료학회지
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• 제9권5호
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• pp.352-358
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• 2002

The effects of boron or manganese added as $B_4C$, Mn, $TiB_2$, B on TiC-30vo1.%$Ni_3Al$ cermet sintered at 1380 and $1400^{\circ}C$ for 1 hour, were examined in relation with shrinkage, relative density, microstructure, lattice parameter, hardness and fracture toughness ($K_{IC}$). The results are summarized as follows: 1) The highest shrink-age showed about 30.5% in the specimen added B$_4$C and the maximum relative density was about 99% in the specimen added $TiB_2$; 2) The grains of TiC were grown during sintering and made the surrounding structure by adding boron and manganese. The largest grain size showed about $2.8\mutextrm{m}$ in the specimen with boron sintered at $1400^{\circ}C$;3) The lattice parameter of TiC was about $4.325\AA$ and $Ni_3Al$ about $3.592\AA$ by adding other elements; 4) The highest hardness was about $1100kgf/\textrm{mm}^2$ in the specimen with B4C; 5) The fracture toughness ($K_{IC}$) showed about $15MNm^{-3/2}$ in the specimen added $TiB_2$.

• 한국분말재료학회지
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• 제6권2호
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• pp.139-144
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• 1999

The pure Ti, Ni and carbon powders were reaction milled to synthesize the TiC-Ni based cermet powders with ultrafine microstructures. After milling, the ultrafine TiC or amorphous Ti-Ni phase was obtained, respectively, according to the milling condition. The effects of milling variables on the synthesizing behavior of the powders were investigated in detail. The sintered TiC-Ni based cermet of the reaction milled powders consisted of very fine TiC of 0.2~1.5$\mu$m, as compared with that of a commercial cermet of 3~5$\mu$m. This demonstrates the potenial of reaction milling as an effective processing route for the preparation of cermet materials.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2002년도 하계학술대회 논문집
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• pp.288-291
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• 2002

Application of metal silicides such as TiSi$_2$ and CoSi$_2$ as contacts and gate electrodes are being studied. However, TiSi$_2$ due to the linewidth-dependance, and CoSi$_2$ due to the excessive Si consumption during silicidation cannot be applied to the deep-submicron MOSFET device. NiSi shows no such problems and can be formed at the low temperature. But, NiSi shows thermal instability. In this investigation, NiSi was formed with a Ti-capping layer to improve the thermal stability. Ni and Ti films were deposited by the thermal evaporator. The samples were then annealed in the N$_2$ ambient at 300-800$^{\circ}C$ in a RTA (rapid thermal annealing) system. Four point probe, FESEM, and AES were used to study the thermal properties of Ti-capped NiSi layers. The Ti-capped NiSi was stable up to 700$^{\circ}C$ for 100 sec. RTA, while the uncapped NiSi layers showed high sheet resistance after 600$^{\circ}C$. The AES results revealed that the Ni diffusion further into the Si substrate was retarded by the capping layer, resulting in the suppression of agglomeration of NiSi films.

• 한국분말재료학회지
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• 제3권3호
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• pp.174-180
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• 1996

Microstructure and phase transformation of mechanically alloyed TiNi powders added to aluminium matrix for enhancing the damping properties were studied. Four compositions between 48.5 and 51.5 at% Ti intermetallic compounds were selected to control the fraction of martensite phase. Mechanically alloyed TiNi powders were heat-treated at vacuum of $10^{-6}$ torr for crystallization. Ball milled AI/TiNi composite powders were swaged at room temperature and rolled at 450 $^{\circ}C$. After mechanical alloying for 10 hours, Ti and Ni elements were alloyed completely and amorphous phase was formed. Amorphous phase was crystallized to martensite (Bl9') and austenite(B2) after heat treating for 1 hour at the temperature of 850 $^{\circ}C$, and TiNi$_3$, intermetallic compound was partially formed. Considerable amount of martensite phase was remained after swaging and rolling.

• 한국분말재료학회지
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• 제5권4호
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• pp.286-292
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• 1998

Ni$_3$Al intermetallic compound has been tested as a binder phase, in order to improve the oxidation resistance and the mechanical properties of TiC-Ni cermet at a high temperature. The wettability of $Ni_3Al$ on TiC and the optimum sintering condition were investigated in TiC-(30, 40) vol% $Ni_3Al$ cermets with the sintering temperature (1380~$1430^{\circ}C$) and time (30~99 min). The results are summarized as follows: 1) Ni$_3$Al showed good wettability on TiC above 1400$^{\circ}C$ ; 2) The shrinkages of the specimens increased with the sintering temperature, the sintering time and the binder content, whereas the relative densities were decreased; 3) Any other phase did not appeared in the microstructures of all sintered cermets. The grain sizes of TiC became larger as the sintering temperature and the sintering time as well as the binder content increased; 4) The hardness of the cermets decreased with increase in the sintering temperature and the sintering time as well as the binder content; 5) The transverse-rupture strength of the cermets increased with the sintering temperature and the sintering time, whereas it decreased with the binder content.