• Korean Journal of Materials Research
• /
• v.27 no.10
• /
• pp.544-551
• /
• 2017

In order to develop a new commercial Al-12%Si casting alloy with improved physical properties, we investigated the effect of adding Sr and TiB to the alloy. Al-12%Si alloys were prepared by die casting at $660^{\circ}C$. The eutectic temperature of the Sr-modified Al-12%Si alloy decreased to $9^{\circ}C$ and the mushy zone region increased. The shape of the Si phase changed from coarse acicula to fine fiber with the addition of Sr. The addition of TiB in the Al-12%Si alloy reduced the size of the primary ${\alpha}$-Al and eutectic Si phases. When Sr and TiB were added together, it worked more effectively in refinement and modification. The density of twins in the Si phase-doped Sr increased and the width of the twins was refined to 5 nm. These results are related to the impurity induced twinning(IIT) growth.

• Journal of Surface Science and Engineering
• /
• v.54 no.5
• /
• pp.285-293
• /
• 2021

High-entropy TiAlCrSiN nano-composite coating was designed to improve mold life for high temperature liquid molding. Alloy design, powder fabrication and single alloying target fabrication for the high-entropy nano-composite coating were carried out. Using the single alloying target, an arc ion plating method was applied to prepare a TiAlCrSiN nano-composite coating had a 30 nm TiAlCrSiN layers are deposited layer by layer, and form about 4 ㎛-thickness of multi-layered coating. TiAlCrSiN nano-composite coating had a high hardness of about 39.9 GPa and a low coefficient of friction of less than about 0.47 in a dry environment. In addition, there was no change in the structure of the coating after the dissolution loss test in the molten metal at a temperature of about 1100 degrees.

• Proceedings of the International Microelectronics And Packaging Society Conference
• /
• 2000.04a
• /
• pp.103-108
• /
• 2000

The texture of Al/Ti thin films deposited on low-dielectric polymer substrates has been investigated. Fifty-nm-thick Ti films and 500-nm-thick Al-1%Si-0.5%Cu (wt%) films were deposited sequentially onto low-k polymers and SiO$_2$ by using a DC magnetron sputtering system. The texture of Al thin film was determined using X-ray diffraction (XRD) theta-2theta ($\theta$-2$\theta$) and rocking curve and the microstructure of Al/Ti films on low-k polymer and SiO$_2$ substrates was characterized by Transmission electron microscopy (TEM). hall thin films deposited on SiO$_2$ had stronger texture than those deposited on low-k polymer. The texture of Al thin films strongly depended on that of Ti films. Cross-sectional TEM resealed that Brains of Ti films on SiO$_2$ substrates had grown perpendicular to the substrate, while the grains of Ti films on SiLK substrates were farmed randomly. The lower degree of 111 texture of Al thin films on low-k polymer was due to Ti underlayer.

• Journal of the Korean Ceramic Society
• /
• v.54 no.4
• /
• pp.340-348
• /
• 2017

$SiC_f/SiC$ composites were joined using a $60{\mu}m-thick$ $Ti_3AlC_2$ or $Ti_3SiC_2$ MAX phase tape. The filler tape was inserted between the $SiC_f/SiC$ composites containing a 12 wt.% $Al_2O_3-Y_2O_3$ sintering additive. The joining was performed to a butt-joint configuration at $1600^{\circ}C$ or $1750^{\circ}C$ in an Ar atmosphere by applying 3.5 MPa using a hot press. Microstructural and phase analyses at the joining interface confirmed the decomposition of $Ti_3AlC_2$ and $Ti_3SiC_2$, indicating the joining by solid-state diffusion. The results showed sound joining interface without the presence of cracks. Joining strengths higher than 150 MPa could be obtained for the joints using $Ti_3AlC_2$ or $Ti_3SiC_2$ at $1750^{\circ}C$, while those for joined at $1600^{\circ}C$ decreased to 100 MPa approximately without the deformation of the joining bodies. The thickness of initial filler tape was reduced significantly after joining because of the decomposition and migration of MAX phase owing to the plasticity at high temperatures.

• Korean Journal of Materials Research
• /
• v.5 no.1
• /
• pp.87-95
• /
• 1995

The effect of stuffing of TiN on the diffusion barrier property between A1 and Si was investigated. The stuffing of TiN was performed by annealing in a Nz ambient at $450^{\circ}C$ for 30min. By TEM analysis, it is identified that there are solid-free or open spaces of a b u t 10-20$\AA$ between the grains of asdeposited TiN. In the case of stuffed TiN, the width of solid-free or open spaces has been reduced to about 10$\AA$ or below. The combination of RBS and AES analyses showed that the asdeposited TiN had about 7at.% of oxygen, and that the stuffed TiN had about 10-15at.% of oxygen. The diffusion barrier test result shows that after annealing at $650^{\circ}C$ for lhour, the asdeposited TiN fails due to the formation of A1 spikes and Si pits in the Si substrate. However, in the case of stuffed TiN, there is no indication of Al spikes and Si pits at the same annealing condition. Thus, it is concluded that this stuffing of TiN significantly improves the diffusion barrier property of TiN between A1 and Si. It is considered that the stuffing effect results from the reduced diffusion through grain boundaries due to the reduced spacing of grain boundaries.

• Journal of Welding and Joining
• /
• v.18 no.5
• /
• pp.98-104
• /
• 2000

Aluminum alloys are being employed in automobile parts as strive to reduce overall vehicle weight to meet demands for improved fuel economy and reduction in vehicle emissions. Al-based composites reinforced with ceramic ($Al_2O_3,\;SiC,\;TiC\;and\;B_4C$) applications in a variety of components in automotive engines, such as liners, where the tribological properties of the material are important. In this study, Al-base composites reinforced with TiC particle powders has been developed for producing plasma spray coatings. The composite plasma spray powders were prepared Al-13Si-3Mg(wt%) alloy with TiC(40, 60 and 80wt%) particles ($0.2~5{\mu}textrm{m}$) by drum type ball milling. The composite powders ($36~76{\mu}textrm{m}$) were sprayed with plasma torch. Plasma sprayed coatings were heat-treated at $500^{\circ}C$ for 3 hours. The wear resistances of the plasma sprayed coatings were found to decrease with increasing TiC content and improved with heat treatment. AlSiMg-40% TiC heat-treated coatings were showed the best wear resistance in this study.

• Proceedings of the Materials Research Society of Korea Conference
• /
• 2007.11a
• /
• pp.112.2-112.2
• /
• 2007

• Proceedings of the Materials Research Society of Korea Conference
• /
• 2001.11a
• /
• pp.133-133
• /
• 2001

• Journal of Korea Foundry Society
• /
• v.20 no.4
• /
• pp.254-259
• /
• 2000

Metal matrix composites(MMCs) reinforced with hard particles have many potential application in aerospace structures, auto parts, semiconductor package, heat resistant panels, wear resistant materials and so on. In this work, the effect of SiC partioel sizes(50 and 100 ${\mu}m$) and additional elements such as Si, Cu and Ti on the microstructure and the wear property of $Al-5Mg-X(Si,Cu,Ti)/SiC_p$ composites produced by pressureless infiltration method have been investigated using optical microscopy, scanning eletron microcopy(SEM) with EDS(energy dispersive spectrometry), hardness test, X-ray diffractometer(XRD) and wear test. In present study, the sound $Al-5Mg-X(Si,Cu,Ti)/SiC_p$(50 and 100 ${\mu}m$) composites were fabricated by pressureless infiltration method. The $Al-5Mg-0.3Si-O.1Cu-O.1Ti/SiC_p$ composite with $50 {\mu}m$ size of SiC particle has higher hardness and better wear property than any other composite with $100{\mu}m$ size of SiC particle produced by pressureless infiltration method. The hardness and wear property of $Al-5Mg/SiC_p$(50 and 100 ${\mu}m$) composites were enhanced by the addition of Si, Cu and Ti in Al-5%Mg matrix alloy.

• Proceedings of the KIEE Conference
• /
• 1991.07a
• /
• pp.178-182
• /
• 1991

Contact resistance and contact leakage current of the $Al/TiSi_2/Si$ system are investigated for $N^+\;and\;P^+$ junctions. Titanium disilicide is one of the most common silicides because of its thermal stability, ability, to form selective formation and low resistivity. In this paper, the effect of RTA temperature and Junction implant dose are characterized. The $TiSi_2$ contact resistance to $N^+$ silicon is lower than that of Al to $N^+$ silicon, but $TiSi_2$ of contact resistance to $P^+$ silicon is higher than that of Al to $P^+$ silicon. The $TiSi_2$ of contact leakage current to $N^+\;and\;P^+$ silicon is similar to that of Al contact.