• 제목/요약/키워드: Ti thickness

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TiN 이온 플레이팅한 강판의 내식성에 관한 연구(I)-Ti 하지 코팅 및 TiN 코팅 두께의 영향 (Corrosion Behavior of TiN Ion Plated Steel Plate(I)-Effects of Ti interlayer and TiN coating thickness)

  • 연윤모;한전건;김대진;배은현
    • 한국표면공학회지
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    • 제24권1호
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    • pp.34-34
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    • 1991
  • Corrosion behavior of TiN coated steel was studied in terms of thickness of interlayer Ti and TiN coating TiN was are ion plated to a thickness of 1$\mu\textrm{m}$ and 2$\mu\textrm{m}$ respectively with interlayer coating of Ti of 1$\mu\textrm{m}$, 2$\mu\textrm{m}$ and 3$\mu\textrm{m}$. Corrosion resistance of TiN coated steel was evaluated by anodic palarization test in 1N H2SO4 as well as salt spray test. Porosity of each coating was also tested by using SO2 test method. Corrosion current density decreased with increasing TiN coating thickness and Ti interlayer coating markedly enhanced the corrosion resistance. Ti interlayer coating of 2$\mu\textrm{m}$ and 3$\mu\textrm{m}$ prior to 2$\mu\textrm{m}$ TiN coating decreased the corrosion current density of active range by an order of 4 and that of passive range by an order of 2. This improvement was associated with the retardation of corrosive agent penetration with increasing coating thickness and inherent corrosion resistance of Ti interlayer. Ti interlayer coating was also very effective in improvement of corrosion resistance under salt atmosphere.

TiN 이온 플레이팅한 강판의 내식성에 관한 연구(I) - Ti 하지 코팅 및 TiN 코팅 두께의 영향 - (Corrosion Behavior of TiN Ion Plated Steel Plate(I) -Effects of Ti interlayer and TiN coating thickness-)

  • 연윤모;한전건;김대진;배은현
    • 한국표면공학회지
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    • 제25권1호
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    • pp.34-39
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    • 1992
  • Corrosion behavior of TiN coated steel was studied in terms of thickness of interlayer Ti and TiN coating. TiN was arc ion plated to a thickness of 1$\mu\textrm{m}$ and 2$\mu\textrm{m}$ respectively with interlayer coating of Ti of 1$\mu\textrm{m}$, $2\mu\textrm{m}$ and $3\mu\textrm{m}$. Corrosion resistance of TiN coated steel was evaluated by anodic palarization test in 1N $H_2$SO$_4$ as well as salt spray test. Porosity of each coating was also tested by using $SO_2$ test method. Corrosion current density decreased with increasing TiN coating thickness and Ti interlayer coating markedly enhanced the corrosion resistance. Ti interlayer coating of $2\mu\textrm{m}$ and $3\mu\textrm{m}$ prior to $2\mu\textrm{m}$ TiN coating decreased the corrosion current density of active range by an order of 4 and that of passive range by an order of 2. This improvement was associated with the retardation of corrosive agent penetration with increasing coating thickness and inherent corrosion resistance of Ti interlayer. Ti interlayer coating was also very effective in improvement of corrosion resistance under salt atmosphere.

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TiN 이온 플레이팅한 강판의 내식성에 관한 연구(III)-Ni 및 Ti 하지코팅두께의 영향- (Corrosion Behavior of TiN Ion Plated Steel Plate(III)-Effects of Ni and Ti interlayer thickness-)

  • 한전건;연윤모
    • 한국표면공학회지
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    • 제26권2호
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    • pp.55-62
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    • 1993
  • The effect of interlayer coating thickness of Ni and Ti on corrosion behavior was studied for TiN ion plat-ed steel plate. Interlayer coating was carried out in a single and bi-layer to a various thickness combination prior to final TiN coating. Corrosion behavior was evaluated by anodic polarization test in 1N H2SO4 as well as salt spray test. Ni interlayer coating was effectived in reducing corrosion current density of active region and Ti interlayer coating over Ni coating reduced the anodic corrosion current density by an order of 4 with increasing the thickness of Ti up to$ 3\mu\textrm{m}$. The improvement of corrosion resistance by Ni/Ti interlayer coating was attributed to the effective prevention of penetration of active corrosion agent resulting from the inherent corrosion resistance of Ni and Ti. Putting corrosion behavior was observed from salt spray test result for all specimens and corrosion resistance at salt atmosphere was enhanced with increasing Ni and Ti thickness, Cor-lay TiN coating was spalled out by the generation of corrosion products.

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TiO2 광전극 두께와 두 기판 간격에 따른 DSSC의 효율 특성 (DSSCs Efficiency by Thickness of TiO2 Photoelectrode and Thickness Differences Between Two Substrates)

  • 박한석;권성열;양욱
    • 한국전기전자재료학회논문지
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    • 제25권7호
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    • pp.537-542
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    • 2012
  • DSSCs efficiency by thickness of $TiO_2$ photoelectrode and thickness differences between two substrates studied. DSSCs is made of the doctor blade method and photoelectrode annealing temperature elevated in a different ways. In addition, cells efficiencies of according to the different thickness between $TiO_2$ photoelectrode substrate and Pt counter electrode was measured. Efficiency of DSSCs made with $TiO_2$ photoelectrode of 18 ${\mu}m$ thickness and the gap difference between the substrate 28 ${\mu}m$ shows a highest 4.805% efficiency.

x-cut $LiNbO_3$ 광도파로 제작 및 Ti 두께에 따른 Near-field 특성 변 화 (Preparation of x-cut $LiNbO_3$ Optical Waveguide and the Change in Near-field Properties according to Ti thickness)

  • 김성구;윤형도;윤대원;한상필;김창민;박계춘;이진;유용택
    • 한국전기전자재료학회논문지
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    • 제11권2호
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    • pp.146-153
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    • 1998
  • The optical near-field patterns, propagation loss and mode sizes of x-cut $Ti:LiNbO_3$ optical waveguide which was fabricated by Ti-diffusion varying with Ti strip thickness in wet oxygen atmosphere were discussed at optical wavelength 1550nm. As Ti thickness increased from $760{\AA}$, the insertion loss of waveguide was decreased. But at Ti thickness $1500{\AA}$, mode sizes are widely broadened. The Ti thickness of below $1100{\AA}$ and above $1500{\AA}$ showed negative effects to propagation loss and fiber coupling. The best Ti thickness for fabricating low propagation loss and good fiber coupling was inferred to be between $1100{\AA}-1500{\AA}$ in our conditions. And for Ti thickness $1150{\AA}$, its propagation loss, horizontal/vertical mode sizes were showed 1.61 dB/cm, $11.9/8.9{\mu}m$ for TM, 0.22 dB/cm, $12.0/9.1{\mu}m$ for TE respectively.

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Ti 또는 Ti/TiN underlayer가 Al 박막의 배향성 및 면저항에 미치는 영향 (Effects of Ti or Ti/TiN Underlayers on the Crystallographic Texture and Sheet Resistance of Aluminum Thin Films)

  • 이원준;나사균
    • 한국재료학회지
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    • 제10권1호
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    • pp.90-96
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    • 2000
  • Underlayer의 종류 및 두께가 Al 박막의 배향성 및 면저항 변화에 미치는 영향을 연구하였다. Al의 underlayer로서 sputtering 방식으로 증착되는 Ti와 TiN이 적층된 구조인 Ti/TiN이 사용되었으며, 각각에 대해 두께를 변화시키면서 Al 박막의 배향성, 면저항을 조사하였고, $400^{\circ}C,\;N_2$ 분위기에서 열처리하면서 면저항의 변화를 조사하였다. Ti만을 Al의 underlayer로 사용한 경우, Ti두께가 10nm 이상이면 우수한 Al <111> 배향성을 나타냈으며 Al-Ti 반응 때문에 열처리 후 Al 배선의 면저항이 크게 상승하였다. Ti와 Al사이에 TiN을 적용함에 의해 Al <111> 배향성은 나빠지나 Al-Ti 반응에 의한 면저항의 증가는 억제할 수 있었다. Ti/TiN underlayer의 경우, 우수한 Al <111> 배향성을 확보하기 위한 Ti의 최소두께는 20nm이었고, Al-Ti 반응을 억제하기 위한 TiN의 최소두께는 20nm이었다.

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Characteristics of Ti Thin films and Application as a Working Electrode in TCO-Less Dye-Sensitized Solar Cells

  • Joo, Yong Hwan;Kim, Nam-Hoon;Park, Yong Seob
    • Transactions on Electrical and Electronic Materials
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    • 제18권2호
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    • pp.93-96
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    • 2017
  • The structural, electrical and optical properties of Ti thin films fabricated by dual magnetron sputtering were investigated under various film thicknesses. The fabricated Ti thin films exhibited uniform surfaces, crystallinity, various grain sizes, and with various film thicknesses. Also, the crystallinity and grain size of the Ti thin films increased with the increase of film thickness. The electrical properties of Ti thin films improved with the increase of film thickness. The results showed that the performance of TCO-less DSSC critically depended on the film thickness of the Ti working electrodes, due to the conductivity of Ti thin film. However, the maximum conversion efficiency of TCO-less DSSC was exhibited at the condition of 100 nm thickness due to the surface scattering of photons caused by the variation of grain size.

광전기 화학변환에 미치는 $TiO_2$ 전극의 두께와 첨가제의 영향 (Effects of the Thickness and Dopant on the Photoelectro- chemical Conversion in the Polycrystalline $TiO_2$ Electrodes)

  • 윤기현;강동헌
    • 한국세라믹학회지
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    • 제21권3호
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    • pp.266-270
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    • 1984
  • The photoelectrochemical properties of the reduced $TiO_2$ceramic electrodes are investigated varying the thickness of the electrodes and the amounts of $Sb_2O_3$ as dopant. As the thickness of the undoped. $TiO_2$ceramic electrode increases the photocurrent tends to decrease. However for the R-F sputtered $TiO_2$ thin film electrodes the photocurrent tends to increase to about 1$\mu\textrm{m}$ thick and then decreases with increasing thickness. For the $TiO_2$ ceramic electrodes doped with $Sb_2O_3$ the photocurrent decreases with inreasing the amounts of dopant and in the case of rapid cooling in air without reduction treatment the photocurrent shows lower value. Also visible light excitation is observed at 500~550(nm) wavelength for the $TiO_2$ ceramic electrodes doped with $Sb_2O_3$comparing wtih the $TiO_2$ ceramic electrodes (~420nm)

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A study on magnetic layer thickness effects on magnetic properties of CoCrPt/Ti perpendicular media.

  • M. S. Hwang;Lee, T. D.
    • 한국자기학회:학술대회 개요집
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    • 한국자기학회 2000년도 International Symposium on Magnetics The 2000 Fall Conference
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    • pp.369-376
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    • 2000
  • Change of magnetic properties in CoCrPt/Ti perpendicular media with varying CoCrPt films thickness has been studied. As CoCrPt films thickness increase, the Ms(magnetization saturation) drastically increases at thinner thickness and gradually increases with further increase in thickness from 25nm. This Ms behaviour is associated with primarily the formation of "amorphous-like" reacted layer by intermixing of CoCrPt and Ti at CoCrPt/Ti interface and secondarily change of Cr segregation mode with varying the CoCrPt films thickness. Magnetic domain structure distinctively changes with increasing CoCrPt magnetic layer(ML) thickness. Also the strength of exchange coupling measured from the slope in demagnetizing region in M-H loop changes with ML thickness. Details of the above magnetic properties will be discussed. The expansion of lattice parameters a and c at thinner thickness suggests that Cr segregation mode may be connected with the residual stress of the films. Finally, negative nucleation field(Hn) behaviour with the exchange slope will be reported.

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Co 두께가 $CoSi_2$ 에피박막 형성에 미치는 영향 (Effects of Co Thickness on the Formation of Epitaxial CoSi2 Thin Film)

  • 김종렬;배규식
    • 전자공학회논문지D
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    • 제34D권1호
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    • pp.23-29
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    • 1997
  • Effects of Co thickness on the formation of epitaxial $CoSi_2$ from the Co/Ti bilayer have been investigated. Ti and Co were sequentially deposited with the Ti thickness fixed at 5 or 10nm, while the Co thickness was varied from 5 to 30nm. The metal-deposited samples were then rapidly thermal-annealed in $N_2$ at $900^{\circ}C$ for 20 sec. Material properties of $CoSi_2$ thin films were analyzed by the 4-point probe, XRD, AES, andXTEM. When the as-deposited Co thickness was below 15nm, the $CoSi_2$ with high resistivity and rough interface was formed. On the other hand, when the Co thickness was above 15 nm, the epitaxial $CoSi_2$ with the resistivity of about 16 ~ 19 $\mu\Omega.cm$, uniform composition and thickness and flat interface was formed. Initial Ti thickness has sizable effect on the formation of $CoSi_2$, when the Co layer was very thin (~ 5 nm). But there was no significant effect of the Ti thickness for the initial Co thickness of above 15 nm.

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