• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2008.11a
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• pp.15-16
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• 2008

In case manufacturing COF, through hole should be made to be used for a pathway connecting the conductive layers of its both faces. In case Cu-plating inside of through hole with electroless plating way, contact between Cu and PI film gets bad to be fell apart from PI by the impact of applying to the electric devices. Therefore, after sputtering is applying on inner through hole, then a method to perform electroplating process. In this study, after changing sputtering condition to manufacture FCCL, we looked the changeability of the upper PI and inner hole Cu layers. Making use of RF Magnetron sputtering equipment, we coated Cu thin film and Cu-plated on it through electroplating. After cold-mounting the completed FCCL, we examined hole section through an optical microscope. From the result of test, with parameters deposition pressure and deposition time, both the thickness of the hole plated layer and PI plated upper layer increased at regular rate, increasing the thickness of Cu sputter layer. However, from the result of test in increasing RF-power, we could know the increment rate of hole plated layer is considerably greater than that of PI plated upper layer. Therefore, we finally acquired good result; if you want only to increase the plated layer of inner hole, it's much better to increase RF-power.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.21 no.2
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• pp.188-193
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• 2010

In this paper, SI(Signal Integrity) characteristic of the 4-layer PCB(Printed Circuit Boards) with a through-hole via was analyzed by impedance mismatching between the through-hole via and the transmission line, and deterioration of clock pulse response characteristic due to the P/G plane resonances which are generated between the power and the ground plane. The minimized impedance mismatching between the through-hole via and the transmission line for the improving of SI characteristic is confirmed by the TDR(Time Domain Reflector) simulation and lumped element modeling of the through-hole via. And the cancellation method of P/G plane resonances for improvement of the SI characteristic is represented by simulation result.

• Transactions of the Korean Society of Automotive Engineers
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• v.9 no.6
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• pp.201-206
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• 2001

The hole-drilling method makes a little hole through the metal surface that has residual stress and measures the relieved stress with a strain gage. It is used widely in measuring the residual stress of surfaces. In this method, the inclined hole is one of the source of error. This paper presents a finite element analysis of influence of the inclined hole for the uniaxial residual stress field. The stress differences between measured and applied residual stress increase proportionally to inclined angle of the hole. The correction equations which easily obtain the residual stress taking account of the inclined angle and direction are derived. The measurement error of stress due to the inclined hole can be reduced to around 1% through this study.

• Proceedings of the KWS Conference
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• 2006.10a
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• pp.190-192
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• 2006

The 3-dimensional(3D) chip stacking technology is one of the leading technologies to realize a high density and high performance system in package(SIP). It could be found that it is the advanced process of through-hole via formation with the minimum damaged on the Si-wafer. Laser ablation is very effective method to penetrate through hole on the Si-wafer because it has the advantage that formed under $100{\mu}m$ diameter through-hole via without using a mask. In this paper, we studied the optimum method for a formation of through-hole via using femto-second laser heat sources. Furthermore, the processing parameters of the specimens were several conditions such as power of output, pulse repetition rate as well as irradiation method and time. And also the through-hole via form could be investigated and analyzed by microscope and analyzer.

• Transactions of the Korean Society of Automotive Engineers
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• v.16 no.3
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• pp.73-79
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• 2008

Atomization speed of diesel fuel injected from 8-hole nozzle is faster than that of 7-hole nozzle because the hole diameter of 8-hole nozzle is smaller than that of 7-hole nozzle. But both insufficient distance between the fuel sprays and short penetration of injected sprays through 8-hole nozzle hole cause many harmful effects on combustion. In this study, we installed the 8-hole injectors to diesel 2.0 liter class engine, and optimized in-cylinder swirl and penetration via selecting and matching proper cylinder head and combustion bowl. Through this process, we found out the performance and emission potential of 8-hole nozzle installed engine are better than those of 7-hole nozzle installed one.

• Journal of Mechanical Science and Technology
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• v.16 no.11
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• pp.1359-1366
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• 2002

The measurement of residual stresses by the hole-drilling method has been used to evaluate residual stresses in structural members. In this method, eccentricity can usually occur between the hole center and rosette gage center. In this study, we obtained the magnitude of the error due to eccentricity of a hole through the finite element analysis. To predict the magnitude of the error due to eccentricity of a hole in the biaxial residual stress field, it could be learned through the back propagation neural network. The prediction results of the error using the trained neural network showed good agreement with FE analyzed results.

• Journal of the Microelectronics and Packaging Society
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• v.15 no.2
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• pp.29-36
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• 2008

In this paper, mechanical reliability issues of copper through-wafer interconnections are investigated numerically and experimentally. A hermetic wafer level packaging for MEMS devices is developed. Au-Sn eutectic bonding technology is used to achieve hermetic sealing, and the vertical through-hole via filled with electroplated copper for the electrical connection is also used. The MEMS package has the size of $1mm{\times}1mm{\times}700{\mu}m$. The robustness of the package is confirmed by several reliability tests. Several factors which could induce via hole cracking failure are investigated such as thermal expansion mismatch, via etch profile, and copper diffusion phenomenon. Alternative electroplating process is suggested for preventing Cu diffusion and increasing the adhesion performance of the electroplating process. After implementing several improvements, reliability tests were performed, and via hole cracking as well as significant changes in the shear strength were not observed. Helium leak testing indicated that the leak rate of the package meets the requirements of MIL-STD-883F specification.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.6 no.2
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• pp.34-41
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• 1997

The objective of this study is to investigate experimentally the frequency characteristics of the hole tones generated by a circular jet of low speed impinging on a plate with a round hole. The experimental results about the sound spectrum and the time wave of the hole tone are presented and discussed in relation with the hole type, the jet velocity and the distance of the nozzle-to-plate with a round hole. From the sound spectrum and time wave measurements, it is found that the hole tone is generated not only by an interaction of convected vortices with a round hole but also by a series of vortex shedding from jets passing through a hole. The hole tones generated by a feedback mechanism consist of many frequency stages and also have a hysteresis phenomenon like an edge tone. But the hole tones generated by a series of vortex shedding have nothing with the stage characteristics. The frequencies of hole tones are influenced by the jet velocity, the distance of the nozzle-to-plate with a round hole and the hole type.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.47 no.12
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• pp.55-67
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• 2010

The electrical properties of a back drilled via-hole (BDH) without the open-stub and the plated through via-hole (PTH) with the open-stub, which is called the conventional structure, in a high-count multi~layered (HCML) printed circuit board (PCB) were investigated for a high-speed digital system, and a selected inner layer to transmit a high-speed signal was farthest away from the side to mount the component. Within 10 GHz of the broadband frequency, a design of experiment (DOE) methodology was carried out with three cause factors of each via-hole structure, which were the distance between the via-holes, the dimensions of drilling pad and the anti-pad in the ground plane, and then the relation between cause and result factors which were the maximum return loss, the half-power frequency, and the minimum insertion loss was analyzed. Subsequently, the empirical formulae resulting in a macro model were extracted and compared with the experiment results. Even, out of the cause range, the calculated results obtained from the macro model can be also matched with the measured results within 5 % of the error.

• Nuclear Engineering and Technology
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• v.55 no.2
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• pp.780-791
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• 2023

To study oscillation characteristic of steam and non-condensable gas direct contact condensation through multi-hole sparger at low mass flux, a series of experiments of pure steam and mixture gas condensation have been carried out under the conditions of steam mass flux of 20-120kg/m²s, water temperature of 20-95 ℃ and mass fraction of non-condensable gas of 0-5%. The regime map of pure steam condensation through multi-hole sparger is divided into steam chugging, separated bubble, aggregated bubble and escaping aggregated bubble. The bubbles behavior of synchronization in the same hole columns and desynchronized excitation between different hole columns can be found. The coalescence effect of mixture bubbles increases with water temperature and non-condensable gas content increasing. Pressure oscillation intensity of pure steam condensation first increases and then decreases with water temperature increasing, and increases with steam mass flux increasing. Pressure oscillation intensity of mixture gas condensation decreases with water temperature and non-condensable gas content increasing, which is significantly weaker than that of pure steam condensation. The oscillation dominant frequency decreases with the rise of water temperature and non-condensable gas content. The correlations for oscillation intensity and dominant frequency respectively are developed in pure steam and mixture gas condensation at low mass flux.