• Title/Summary/Keyword: Three-Dimensional Scanning

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Two-dimensional Surface Structures of Arenthiols Studied by STM

  • Gwon, Gi-Yeong
    • Proceedings of the Korean Vacuum Society Conference
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    • 2012.02a
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    • pp.89-89
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    • 2012
  • Arrangement of individual atoms and molecules with atomic precision and understanding the resulting properties at the molecular level are ultimate goals of chemistry, biology, and materials science. For the past three decades, scanning probe microscopy has made strides towards these goals through the direct observation of individual atoms and molecules, enabling the discovery of new and unexpected phenomena. This talk will discuss the origin of forces governing motion of small organic molecules and their extended self-assembly into two-dimensional surface structures by direct observation of individual molecules using scanning tunneling microscopy (STM).

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Accuracy and precision of integumental linear dimensions in a three-dimensional facial imaging system

  • Kim, Soo-Hwan;Jung, Woo-Young;Seo, Yu-Jin;Kim, Kyung-A;Park, Ki-Ho;Park, Young-Guk
    • The korean journal of orthodontics
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    • v.45 no.3
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    • pp.105-112
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    • 2015
  • Objective: A recently developed facial scanning method uses three-dimensional (3D) surface imaging with a light-emitting diode. Such scanning enables surface data to be captured in high-resolution color and at relatively fast speeds. The purpose of this study was to evaluate the accuracy and precision of 3D images obtained using the Morpheus 3D$^{(R)}$ scanner (Morpheus Co., Seoul, Korea). Methods: The sample comprised 30 subjects aged 24.34 years (mean $29.0{\pm}2.5$ years). To test the correlation between direct and 3D image measurements, 21 landmarks were labeled on the face of each subject. Sixteen direct measurements were obtained twice using digital calipers; the same measurements were then made on two sets of 3D facial images. The mean values of measurements obtained from both methods were compared. To investigate the precision, a comparison was made between two sets of measurements taken with each method. Results: When comparing the variables from both methods, five of the 16 possible anthropometric variables were found to be significantly different. However, in 12 of the 16 cases, the mean difference was under 1 mm. The average value of the differences for all variables was 0.75 mm. Precision was high in both methods, with error magnitudes under 0.5 mm. Conclusions: 3D scanning images have high levels of precision and fairly good congruence with traditional anthropometry methods, with mean differences of less than 1 mm. 3D surface imaging using the Morpheus 3D$^{(R)}$ scanner is therefore a clinically acceptable method of recording facial integumental data.

Methods to Measure the Critical Dimension of the Bottoms of Through-Silicon Vias Using White-Light Scanning Interferometry

  • Hyun, Changhong;Kim, Seongryong;Pahk, Heuijae
    • Journal of the Optical Society of Korea
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    • v.18 no.5
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    • pp.531-537
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    • 2014
  • Through-silicon vias (TSVs) are fine, deep holes fabricated for connecting vertically stacked wafers during three-dimensional packaging of semiconductors. Measurement of the TSV geometry is very important because TSVs that are not manufactured as designed can cause many problems, and measuring the critical dimension (CD) of TSVs becomes more and more important, along with depth measurement. Applying white-light scanning interferometry to TSV measurement, especially the bottom CD measurement, is difficult due to the attenuation of light around the edge of the bottom of the hole when using a low numerical aperture. In this paper we propose and demonstrate four bottom CD measurement methods for TSVs: the cross section method, profile analysis method, tomographic image analysis method, and the two-dimensional Gaussian fitting method. To verify and demonstrate these methods, a practical TSV sample with a high aspect ratio of 11.2 is prepared and tested. The results from the proposed measurement methods using white-light scanning interferometry are compared to results from scanning electron microscope (SEM) measurements. The accuracy is highest for the cross section method, with an error of 3.5%, while a relative repeatability of 3.2% is achieved by the two-dimensional Gaussian fitting method.

Three-dimensional vibration measurement algorithm using one laser scanning vibrometer (한대의 LSV 를 이용한 3 차원 진동측정방법)

  • Kim, Dong-Kyu;Song, Ha-Jun;Park, Kyi-Hwan
    • Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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    • 2012.04a
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    • pp.935-939
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    • 2012
  • 3D vibration measurement is achieved using one laser scanning vibrometer(LSV) and Laser scanner(LS) by moving the LSV to three arbitrarily locations from the principle that vibration analysis based on the frequency domain is independent of the vibration signal based on time domain. The proposed system has the same effect as using three sets of LSVs. It has an advantage of reducing equipment costs. Analytical approach of obtaining in-plane and out-of-plane vibration of surface is introduced using geometrical relations between three LSV coordinates and vibration measured at three different locations.

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Application Analysis of Digital Photogrammetry and Optical Scanning Technique for Cultural Heritages Restoration (문화재 원형복원을 위한 수치사진측량과 광학스캐닝기법의 응용분석)

  • Han, Seung Hee;Bae, Yeon Soung;Bae, Sang Ho
    • KSCE Journal of Civil and Environmental Engineering Research
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    • v.26 no.5D
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    • pp.869-876
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    • 2006
  • In the case of earthenware cultural heritages that are found in the form of fragments, the major task is quick and precise restoration. The existing method, which follows the rule of trial and error, is not only greatly time consuming but also lacked precision. If this job could be done by three dimensional scanning, matching up pieces could be done with remarkable efficiency. In this study, the original earthenware was modeled through three-dimensional pattern scanning and photogrammetry, and each of the fragments were scanned and modeled. In order to obtain images from the photogrammetry, we calibrated and used a Canon EOS 1DS real size camera. We analyzed the relationship among the sections of the formed model, efficiently compounded them, and analyzed the errors through residual and color error map. Also, we built a web-based three-dimensional simulation environment centering around the users, for the virtual museum.

Confocal Scanning Microscopy with Multiple Optical Probes for High Speed 3D Measurements and Color Imaging (고속 3차원 측정 및 칼라 이미징을 위한 다중 광탐침 공초점 주사 현미경)

  • Chun, Wan-Hee;Lee, Seung-Woo;Ahn, Jin-Woo;Gweon, Dae-Gab
    • Journal of the Semiconductor & Display Technology
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    • v.7 no.1
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    • pp.11-16
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    • 2008
  • Confocal scanning microscopy is a widely used technique for three dimensional measurements because it is characterized by high resolution, high SNR and depth discrimination. Generally an image is generated by moving one optical probe that satisfies the confocal condition on the specimen. Measurement speed is limited by movement speed of the optical probe; scanning speed. To improve measurement speed we increase the number of optical probes. Specimen region to scan is divided by optical probes. Multi-point information each optical probe points to can be obtained simultaneously. Therefore image acquisition speed is increased in proportion to the number of optical probes. And multiple optical probes from red, green and blue laser sources can be used for color imaging and image quality, i.e., contrast, is improved by adding color information by this way. To conclude, this technique contributes to the improvement of measurement speed and image quality.

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Binocular Holographic Three-Dimensional Imaging System Using Optical Scanning Holography (광 스캐닝 홀로그래피를 이용한 양안식 3차원 홀로그래픽 영상 시스템)

  • Kim, You Seok;Kim, Taegeun
    • Korean Journal of Optics and Photonics
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    • v.26 no.5
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    • pp.249-254
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    • 2015
  • In this paper we propose a binocular holographic three-dimensional (3D) imaging system using optical scanning holography. To realize a binocular 3D holographic imaging system, we could acquire the complex holograms of a real object after designing a holographic display system based on interpupillary distance and pupil size, and these holograms could be optically reconstructed following numerical signal processing with an amplitude spatial light modulator. The proposed binocular 3D holographic imaging system using optical scanning holography was verified experimentally.

Development of Large-area Two-photon Stereolithography Process for the Fabrication of Large Three-dimensional Microstructures (대면적 3 차원 마이크로 형상제작을 위한 스테이지 스캐닝 시스템을 이용한 이광자 흡수 광조형 공정 개발)

  • Lim, Tae-Woo;Son, Yong;Yi, Shin-Wook;Kong, Hong-Jin;Park, Sang-Hu;Yang, Dong-Yol
    • Journal of the Korean Society for Precision Engineering
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    • v.25 no.1
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    • pp.122-129
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    • 2008
  • Two-photon stereolithography is recognized as a promising process for the fabrication of three-dimensional (3D) microstructures with 100 nm resolution. Generally, beam-scanning system has been used in the conventional process of two-photon stereolithography, which is limited to the fabrication of micro-prototypes in small area of several tens micrometers. For the applications to 3D high-functional micro-devices, the fabrication area of the process is required to be enlarged. In this paper, large-area two-photon stereolithography (L-TPS) employing stage scanning system has been developed. Continuous scanning method is suggested to improve the fabrication speed and parameter study is conducted. An objective lens of high numerical aperture (N.A.) and high strength material were employed in this system. Through this work, 3D microstructures of $600*600*100\;{\mu}m$ were fabricated.

The Development and Evaluation of OMM(On the Machine Measuring) System Using Scanning Probe (Scanning Probe를 이용한 OMM(On the Machine Measuring) 시스템 개발 및 평가)

  • Kim, S.H.;Kim, I.H.
    • Journal of the Korean Society for Precision Engineering
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    • v.13 no.10
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    • pp.71-77
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    • 1996
  • This paper describes the development of on the machine measuring(OMM) system which can directlry measure the three dimensional machined dimensilnal accuracy using scanning probe in milling machine. Two algolithms, continuous path(CP) measurement using UC program and CAD data assisted point to point(PTP) measurement, were developed regarding specification of scanning probe. The OMM system was contructed to verify the developed system suing the proposed algorithm, and actually measured three kinds of machined TV shadow mask molds. The developed system was evaluated it's repeatability and compared with the current measurement system of CMM(Coording Measuring Machine) in terms of relative accuracy and time reduction and productivity increase.

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A Study on the Indirect Copy of Dancheong Patterns Using Three-dimensional Scanning (3차원 스캐닝을 활용한 단청문양의 간접전사 연구)

  • An, Ji Eun;Choi, Chan Ho;Kim, Sung June;Yoon, Man Young
    • Journal of Conservation Science
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    • v.34 no.6
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    • pp.471-479
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    • 2018
  • Seonunsa Temple is a site of Dancheong cultural significance in Daewoongjeon. Three-dimensional (3D) scanning can be used to create a simulation in 1:1 ratio without touching the Dancheong patterns directly. The traditional method of recreating Dancheong was paining with tracing paper using a fix pin. However, manual direct copy processes can cause and damage to the objects. This study shows the results of a simulation of a tranditional Dancheong patterns as an alternative; the simulation was able to reduce dimensional errors and prevent damage by using 3D scanning. As a result, objective and precise proportions of the simulation were acquired. The 3D scanning method may be applied for work such as the replication and restoration of the drawing, 3D fabrication of the original data, and printing of the additional drawing. In addition, with the production of 3D materials, a virtual museum is possible.