• 한국광학회지
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• 제13권5호
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• pp.396-399
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• 2002

전자선 증착기를 이용하여 1.3$\mu\textrm{m}$ 광모드 변환기가 집적된 반도체 레이저 출력 단면에 $SiO_2$와 $TiO_2$ 두 개의 박막 층으로 무반사 증착 하였다. 증착 단면의 최소 단면 반사율 $~ 10^{-5}$을 얻었고, $~ 10^{-4}$이하 단면 반사율 밴드 폭은 약 27nm임을 측정하였다. 이러한 코팅은 외부 공진기 레이저 광원 및 반도체 광 증폭기 등에 응용 가능하다.

• 대한전자공학회논문지
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• 제23권5호
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• pp.699-705
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• 1986

Sb2S3 thin films were fabricated by vacuum evaporation of compound Sb2S3 at a pressure of 10**-5 torr. and in argon ambient. Then, their electrical and photoconductive properties were investigated. The Sb2S3 glass-layer showed maximum photosensitivity at the deposition rate of 250\ulcornersec, and Sb2S3 porous layer had mininum dielectric constant of 1.5 at the deposition rate of 0.3 um/sec and argon partial pressure of 0.2torr. Sb2S3 multi-layers were prepared at the different thickness ratio (B/A) to find the proper structural property suited for camera pick-up tube. Here, A is the sum of the thickness of Sb2S3 porous layer and Sb2S3 fine grain layer, and B is the thickness of Sb2S3 fine grain layer. As a result, photosensitivity had a peak value at the thickness ratio (B/A) of 60%.

• 한국재료학회지
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• 제1권4호
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• pp.229-235
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• 1991

$Ta_2O_5$ 박막은 실리콘산화막, 실리콘질화막 박막에 비해 유전율은 높으나 누설전류밀도가 높고, 절연파괴강도가 낮아 DRAM의 커패시터용 재료로서 실용화가 되지 못하고 있다. 본 연구에서는 LPCVD법으로 형성시킨 $300{\AA}$ 두께의 $Ta_2O_5$ 유전체박막에 대해 후속열처리 또는 전극재료를 변화시켜 열악한 전기적 특성의 원인을 규명하고자 하였다. 그 결과 다결정 실리콘 전극의 경우 성막상태의 $Ta_2O_5$ 박막은 전극에 의한 환원반응에 의해 전기적 특성이 열화됨을 알 수 있었고, 이를 TiN 전극의 사용으로 억제시킬 수 있었다. 다결정 실리콘 전극의 경우 성막상태의 $Ta_2O_5$ 유전체는 누설정류밀도가 $10^{-1}A/cm^2$, 절연파괴강도가 1.5MV/cm 정도였으며, $800^{\circ}C$에서 $O_2$열처리를 하면 전기적 특성은 개선되나, 유전율이 낮아진다 TiN 전극을 채용할 경우 누설전류밀도 $10^{-6}~10^{-7}A/cm^2$, 절연파괴강도 7~12MV/cm 로 ONO(Oxide-Nitride-Oxide) 박막과 비슷한 $Ta_2O_5$ 고유전막을 얻을 수 있었다.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2004년도 Asia Display / IMID 04
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• pp.540-543
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• 2004

The stress of MgO thin film, which is used as a dielectric protective layer in AC-PDP, was measured by a laser scanning method. MgO films were deposited bye-beam evaporation on glass substrates with dielectrics layer on them in various deposition temperatures ranging from room temperature to 300 $^{\circ}C$. The compressive stress of MgO films was increased with increasing substrate temperature due to intrinsic stress accumulation, causing the densification of the films. Both firing voltage ($V_f$) and sustaining voltage ($V_s$) were reduced for the higher compressively stressed and densified films. In the other hand, another film properties such as preferred crystallographic orientation and surface roughness seemed not to influence the discharge characteristics of $V_f$ and $V_s$ significantly.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1998년도 추계학술대회 논문집
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• pp.9-12
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• 1998

Film characteristics of thin reoxidized nitrided oxides were investigated by SIMS analysis and C-V method in order to use the gate dielectric for charge-trap type NVSMs instead of ONO stacked layers. Nitric oxide(NO) annealed film has the nitrogen content sharply peaked at the Si-SiO$_2$ interface, while it is broad for nitrous oxide($N_2$O) ambient. The nitrogen peak concentration increased with anneal temperature and time. The position of nitrogen content in the oxide layer was due to be precisely controlled. For the films annealed NO ambient at 80$0^{\circ}C$ for 30min. followed by reoxidized at 85$0^{\circ}C$, the maximum memory window of 3.5V was obtained and the program condition was +12V, 1msec for write and -l3V, 1msec for erase.

• 대한전기학회논문지:전기물성ㆍ응용부문C
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• 제55권3호
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• pp.116-121
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• 2006

Most high-k materials are well known not to be etched easily, Some problems such as low etch rate poor sidewall angle, plasma damage, and process complexity were emerged from the high-density DRAM fabrication. Chemical mechanical polishing (CMP) by a damascene process was proposed to pattern this high-k material was polished with some commercial silica slurry as a function of pH variation. Sufficient removal rate with adequate selectivity to realize the pattern mask of tera-ethyl ortho-silicate (TEOS) film for the vertical sidewall angle were obtained. The changes of X-ray diffraction pattern and dielectric constant by CMP process were negligible. The planarization was also achieved for the subsequent multi-level processes. Our new CMP approach will provide a guideline for effective patterning of high-k material by CMP technique.

• 대한전자공학회논문지TC
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• 제46권2호
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• pp.126-133
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• 2009

본 논문에서는 차량용 위성 안테나에 적합한 평판형 도파관 슬롯 배열 안테나를 설계 제작하였다. 제안된 안테나는 마이크로스트립 패치 배열 안테나의 유전체 손실 및 급전 라인의 손실을 대체하고자 조립하기에 간단한 3층 구조의 급전 도파관을 이용하여 고이득의 안테나를 구현하였다. 또한 얇은 단일 필름을 이용한 편파기를 사용하여 위성에서 송신한 RHCP(Right Handed Circular Polarization), LHCP(Left Handed Circular Polarization)를 기계적으로 모두 수신 가능하도록 설계 제작하였다. 제작된 4X8 배열 안테나의 이득은 27.5dB, 8X16 배열 안테나의 이득은 32dB이다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2006년도 하계학술대회 논문집 Vol.7
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• pp.370-371
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• 2006

Maxwell displacement current (MDC) measurement has been employed to study the dielectric property of Langmuir-films. MDC flowing across monolayers is analyzed using a rod-like molecular model. A linear relationship between the monolayer compression speed and the molecular area Am. Compression speed was about 30, 40, 50mm/min. Langmuir-Blodgett(LB)layers of Arachidic acid deposited by LB method were deposited onto slide glass as Y-type film. The structure of manufactured device is Au/Arachidic acid/Al, the number of accumulated layers are 9~21. Also, we then examined of the Metal-Insulator-Metal(MIM) device by means of I-V. The I-V characteristics of the device are measured from -3 to +3[V]. The insulation property of a thin film is better as the distance between electrodes is larger.

• Safety and Health at Work
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• 제12권3호
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• pp.403-415
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• 2021

Background: This study aimed to assess the possibility of benzene exposure in workers of a Korean semiconductor manufacturing company by reviewing the issued patents. Methods: A systematic patent search was conducted with the Google "Advanced Patent Search" engine using the keywords "semiconductor" and "benzene" combined with all of the words accessed on January 24, 2016. Results: As a result of the search, we reviewed 75 patent documents filed by a Korean semiconductor manufacturing company from 1994 to 2010. From 22 patents, we found that benzene could have been used as one of the carbon sources in chemical vapor deposition for capacitor; as diamond-like carbon for solar cell, graphene formation, or etching for transition metal thin film; and as a solvent for dielectric film, silicon oxide layer, nanomaterials, photoresist, rise for immersion lithography, electrophotography, and quantum dot ink. Conclusion: Considering the date of patent filing, it is possible that workers in the chemical vapor deposition, immersion lithography, and graphene formation processes could be exposed to benzene from 1996 to 2010.

• 대한전자공학회논문지SD
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• 제37권11호
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• pp.18-24
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• 2000

(Ba,Sr)$TiO_3$ 박막은 ULSI-DRAM 즉 1-4 Gbit급 DRAM용 셀(cell) 커패시터의 새로운 유전물질로 각광받고 있다. 본 연구에서는 ICP 장비에서 $BCl_3/Cl_2/Ar$ 플라즈마로 (Ba,Sr)$TiO_3$ 박막을 식각하였다. 이때 RF power/dc bias voltage는 600W/-250V, 반응로의 압력은 10mTorr 이었다. $Cl_2/(Cl_2+Ar)$은 0.2로 고정하였고, $BCl_3$ 가스를 첨가하면서 (Ba,Sr)$TiO_3$ 박막을 식각하였다. $BCl_3$ 가스를 10% 첨가하였을 때, $480{\AA}/min$으로 (Ba,Sr)$TiO_3$ 박막은 가장 높은 식각 속도를 나타내었다. $Cl_2/Ar$가스에 $BCl_3$의 첨가 비에 따른 Cl, BCl 및 B의 라디칼 밀도를 optical emission spectroscopy(OES)에 의해 구하였다. $BCl_3$를 10% 첨가하였을 때 Cl의 라디칼 밀도가 가장 높았다. (Ba,Sr)$TiO_3$ 박막의 표면반응을 규명하기 위하여 XPS 분석을 수행한 결과 이온 bombardment 식각이 Ba-O 결합을 파괴하고 Ba와 Cl의 결합형태인 $BaCl_2$을 제거하기 위하여 필요하다. Sr과 Cl의 결합의 양은 많지 않고, Sr은 주로 물리적인 스퍼터링에 의하여 제거된다. Ti와 Cl은 화학적으로 반응하여 $TiCl_4$ 결합형태로 용이하게 제거된다. 식각후 단면사진을 SEM을 통해 본 결과 식각단면이 약 65~70$^{\circ}$ 정도였다.