• 제목/요약/키워드: Thin wire

검색결과 217건 처리시간 0.022초

초음파 진동에 의한 대류 및 비등 열전달 촉진 원리에 관한 연구 (Mechanisms of Convective and Boiling Heat Transfer Enhancement via Ultrasonic Vibration)

  • 김이구;김호영;강승민;강병하;이진호
    • 대한기계학회논문집B
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    • 제27권5호
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    • pp.612-619
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    • 2003
  • This work experimentally studies the fundamental mechanisms by which the ultrasonic vibration enhances convection and pool boiling heat transfer. A thin platinum wire is used as both a heat source and a temperature sensor. A high speed video imaging system is employed to observe the behavior of cavitation and thermal bubbles. It is found that when the liquid temperature is below its boiling point, cavitation takes place due to ultrasonic vibration while cavitation disappears when the liquid reaches the boiling point. Moreover, when the gas dissolved in liquid is removed by pre-degassing, the cavitation arises only locally. Depending on the liquid temperature, heat transfer rates in convection, subcooled boiling and saturated boiling regimes are examined. In convection heat transfer regime, fully agitated cavitation is the most efficient heat transfer enhancement mechanism. Subcooled boiling is most enhanced when tile local cavitation is induced after degassing. In saturated boiling regime, acoustic pressure is shown to be a dominant heat transfer enhancement mechanism.

크리프에 따른 CRT 텐션 마스크의 장력 이완 (Creep-Induced Tension Loosening of CRT Tension Mask)

  • 정일섭
    • 대한기계학회논문집A
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    • 제27권6호
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    • pp.1034-1040
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    • 2003
  • Tension mask is a part of CRT type devices, which is installed right behind glass-made front panel. Numerous slits on the thin metal sheet enable the electron beams emitted from posterior gun to be focused, resulting in enhanced definition. Flattened and enlarged displays necessitate the imposition of pretension on the masks, in order to improve the robustness of display quality against vibration or impact. High temperature assembly process subsequent to pretensioning, however, degenerates creep resistance of mask material, and common mask may become susceptible to undesirable elongation due to creep. Once tensile stress becomes high enough to induce creep deformation, pretension is substantially loosened. In this study, tension mask assembly is modeled as a combined structure of beams and wire array, and a numerical simulation is attempted for pretensioning followed by high temperature process. Based on a model study, creep occurrence is found to be probable and its adverse influence is quantified. As fur maintaining high tensile force, simply increasing pretension does not seem to be helpful. Instead, the structure of frame needs to be modified somehow, or material for mask needs to be selected properly.

Strengthening of bolted shear joints in industrialized ferrocement construction

  • Ismail, M.;Shariati, M.;Abdul Awal, A.S.M.;Chiong, C.E.;Chahnasir, E. Sadeghipour;Porbar, A.;Heydari, A.;Khorami, M.
    • Steel and Composite Structures
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    • 제28권6호
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    • pp.681-690
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    • 2018
  • This paper highlights results of some experimental work that deals with strengthening of bolted shear joints in thin-walled ferrocement structure where steel wires, bent into U-shape are considered as simple inserts around the bolt hole. The parameters investigated include the number of layers of wire mesh, edge distance of bolt hole, size and location of the inserts. Test results have shown that for small edge distance, failure occurred either in cleavage or shearing mode, and the strength of the joint increased with an increase in the edge distance. This continued up to an upper limit set by either tension or bearing failure. The experimental study further revealed that for a given edge distance the strength of a joint can significantly be enhanced by using U-inserts. The equations developed for predicting joint strength in ferrocement composites can also be modified to include the effects of the inserts with a good level of accuracy.

양극반응으로 제조된 다공질 WO3 박막의 가스센서 특성 (The gas sensing characteristic of the porous tungsten oxide thin films based on anodic reaction)

  • 이홍진;송갑득;이덕동
    • 센서학회지
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    • 제17권1호
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    • pp.9-14
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    • 2008
  • In this paper, the gas responses of tungsten oxide films prepared by anodic reaction was discussed. Sensing electrodes and heating electrodes were patterned by photolithography method on quartz substrate. Porous tungsten oxide was fabricated in electrolyte solutions of 5 % HF (HF :$C_2H_6OH:H_2O$=3 : 2 : 20) by anodic reaction. The anodic reaction with metal (platinum wire) as a cathode and the sensing device as an anode was conducted under the various reaction times (1-10 min) at 10 mA/$cm^2$ The surface structure and morphology of the fabricated sensor have been analysed by X-ray diffraction (XRD) and field-emission scanning electron microscopy (FE-SEM). All the peaks of XRD results were well indexed to the pure phase pattern. The average diameter of the porous tungsten oxide surface were ranged about 100 nm. The fabricaed sensor showed good sensitivity to 200 ppm toluene at operating temperature of $250^{\circ}C$.

Cu 전해도금을 이용한 TSV 충전 기술 (TSV Filling Technology using Cu Electrodeposition)

  • 기세호;신지오;정일호;김원중;정재필
    • Journal of Welding and Joining
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    • 제32권3호
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    • pp.11-18
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    • 2014
  • TSV(through silicon via) filling technology is making a hole in Si wafer and electrically connecting technique between front and back of Si die by filling with conductive metal. This technology allows that a three-dimensionally connected Si die can make without a large number of wire-bonding. These TSV technologies require various engineering skills such as forming a via hole, forming a functional thin film, filling a conductive metal, polishing a wafer, chip stacking and TSV reliability analysis. This paper addresses the TSV filling using Cu electrodeposition. The impact of plating conditions with additives and current density on electrodeposition will be considered. There are additives such as accelerator, inhibitor, leveler, etc. suitably controlling the amount of the additive is important. Also, in order to fill conductive material in whole TSV hole, current wave forms such as PR(pulse reverse), PPR(periodic pulse reverse) are used. This study about semiconductor packaging will be able to contribute to the commercialization of 3D TSV technology.

방향성 있는 감쇠재료가 삽입된 복합적층판의 진동 및 감쇠특성 (Vibration and Damping Characteristic of Composite Laminates Embedding Directional Damping Materials)

  • 김성준
    • Composites Research
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    • 제16권5호
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    • pp.39-44
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    • 2003
  • 복합재료에 삽입된 점탄성 재료는 복합재구조물의 감쇠물성을 크게 증가시킨다. 일반적으로 점탄성 재료는 등방성이므로 모든 방향의 감쇠물성이 동일하다. 최근 재료의 방향에 따라 감쇠물성이 변하는 이방성 감쇠재료의 개발이 요구되고 있다. 이방성 감쇠재료는 점탄성 재료 내부에 얇은 섬유를 삽입하여 제작한다. 삽입된 섬유는 댐핑재료의 강성에 큰 영향을 주며 강성은 고전 적층판 이론을 따르게 된다. 본 논문에서는 Ni와 Adams의 이론을 이용하여 손실계수를 평가하였다. 그리고 방향성 있는 감쇠재료의 영향을 평가하기 위해 저속충격 거동해석을 수행하였다. 해석결과로부터 방향성 있는 감쇠재료는 복합적층판의 진동 및 감쇠특성에 큰 영향을 줌을 보였다

An Electrochemical Approach for Fabricating Organic Thin Film Photoelectrodes Consisting of Gold Nanoparticles and Polythiophene

  • Takahashi, Yukina;Umino, Hidehisa;Taura, Sakiko;Yamada, Sunao
    • Rapid Communication in Photoscience
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    • 제2권3호
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    • pp.79-81
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    • 2013
  • A novel method of fabricating polythiophene-gold nanoparticle composite film electrodes for photoelectric conversion is demonstrated. The method includes electrodeposition of gold and electropolymerization of 2,2'-bithiophene onto an indium-tin-oxide (ITO) electrode. First, electrodeposition of gold onto the ITO electrode was carried out with various repetition times of pulsed applied potential (0.25 s at -2.0 V vs. Ag/AgCl) in an aqueous solution of $HAuCl_4$. Significant progress of the number density of deposited gold nanoparticles was confirmed from scanning electron micrographs, from 4 (1 time) to 25% (15 times). Next, electropolymerization of 2,2'-bithiophene onto the above ITO electrode was performed under controlled charge condition (+1.4 V vs. Ag wire, 15 $mC/cm^2$). Structural characterization of as-fabricated films were carried out by spectroscopic and electron micrographic methods. Photocurrent responses from the sample film electrodes were investigated in the presence of electron acceptors (methyl viologen and oxygen). Photocurrent intensities increased with increasing the density of deposited gold nanoparticles up to ~10%, and tended to decrease above it. It suggests that the surplus gold nanoparticles exhibit quenching effects rather than enhancement effects based on localized electric fields induced by surface plasmon resonance of the deposited gold nanoparticles.

다중 동흡진기를 이용한 장력구배를 갖는 박판의 진동 제어 (Vibration Control of Membrane with Tension Gradient Using Multiple Dynamic Absorber)

  • 박종현;김성대;김원진
    • 한국소음진동공학회논문집
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    • 제15권5호
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    • pp.595-603
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    • 2005
  • In this work, the multiple dynamic absorber( MDA ) is introduced to reduce several vibration modes of shadow mask simultaneously and its design method is developed from the theory of the simple dynamic absorber. When designing the dynamic absorber, there are three significant design parameters such as mass, damping ratio and tuning frequency. Therefore the sensitivity analysis for those parameters has been executed in order to find out the design criteria of multiple dynamic absorber using the finite element model of shadow mask. The multiple dynamic absorber(MDA) designed by the proposed method is tested theoretically and experimentally to estimate the efficiency of vibration reduction. From the results, it is verified that the method is feasible to apply the system having the multiple nitration modes and more efficient than the thin wire-type damper used commercially to reduce the vibration of shadow mask.

FDTD 방법을 이용한 Corrugated Feed-Horn Antenna 의 특성에 대한 연구 (A Study on the Characteristics of the Corrugated Feed-Horn Antenna Using FDTD Method)

  • 박혁균;성혁제;손병문;구연건
    • 한국전자파학회논문지
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    • 제11권4호
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    • pp.619-626
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    • 2000
  • 본 논문에서는 $\infty$rrugation이 개구변에 수직인 환형 급전-혼 안테나의 전파반사를 FDTD 방법으로 해석하였 다. 동축선로로 혼 안테나가 급전할 때 thin wire 안테나 모델과 전계와 자계를 전압과 전류로 모댈렁한 1차원 F FDTD코딩방법을 이용하여 계산시간을 효율적으로 줄일 수 있었다. 중심주파수 11.8 GHz(X -band)에서 급천 동축선로의 특성임피던스를 50$\Omega$에서 20$\Omega$까지 lO$\Omega$씩 변화시켜 가며 계산한 결과 특성임피던스가 30$\Omega$인 경우 11 GHz-14 GHz의 넓은 주파수 영역에서 반사손실이 -25 dB 이상의 좋은 특성을 보인다. 또한 corrugation이 있을 때 방사패턴의 지향성이 개선되며 개구변에서의 위상오차가 감소됨을 확인하였다.

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유기초박막의 산화-환원 반응에 관한 연구 (A Study on the Oxidation-reduction Reaction of Organic Thin Films)

  • 박근호;송주영
    • 한국전기전자재료학회논문지
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    • 제19권8호
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    • pp.724-731
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    • 2006
  • We investigated the electrochemical properties for Langmuir-Blodgett (LB) films mixed with 4-octyl-4'-(5-carboxylpentamethyleneoxy)azobenzene (denoted as 8A5H) and phospholipid(L-a-dimyristoylphosphatidylcholine, denoted as DMPC and L-a-dilauroylphosphayidylcholine, denoted as DLPC). The LB films of 8A5H, 8A5H-DMPC and 8A5H-DLPC mixture monolayers were deposited by using the LB method on the indium tin oxide(ITO) glass. The electrochemical properties measured by using cyclic voltammetry with a three-electrode system, an Ag/AgCl reference electrode, a platinum wire counter electrode and LB film-coated ITO working electrode at various concentrations(0.1, 0.5, and 1.0 mol/L) of $NaClO_4$ solution. A measuring range was reduced from initial potential to -1350 mV, continuously oxidized to 1650 mV and measured to the initial point. The scan rates were 50, 100, 150 and 200 mV/s, respectively. As a result, LB films of 8A5H and 8A5H-DLPC mixture monolayers appeared irreversible process caused by only the oxidation current from the cyclic voltammogram and LB films of 8A5H-DMPC monolayer mixture was found to be caused by a reversible oxidation-reduction process.