• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.06a
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• pp.489-493
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• 2005

TFT-LCD(Thin Film Transistor Liquid Crystal Display) module is representative commercial product of FPD(Flat Panel Display). Thickness of TFT-LCD module is very thin. It is adopted for major display unit for IT devices such as Cellular Phone, Camcorder, Digital camera and etc. Due to the harsh user environment of mobile IT devices, it requires complicated structure and tight assembly. And user requirements for the mechanical functionalities of TFT-LCD module become more strict. However, TFT-LCD module is normally weak to high level transient mechanical shock. Since it uses thin crystallized panel. Therefore, anti-shock performance is classified as one of the most important design specifications. Traditionally, the product reliability against mechanical shock is confirmed by empirical method in the design-prototype-drop/impact testredesign paradigm. The method is time-consuming and expensive process. It lacks scientific insight and quantitative evaluation. In this article, a systematic design evaluation of TFT-LCD module for mobile IT devices is presented with combinations of FEA and testing to support the optimal shock proof display design procedure.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.1 no.1
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• pp.37-42
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• 2000

Copper thin films have been prepared by a metal organic chemical vapor deposition (MOCVD) technology on polyimide and TiN substrates. The Cu-MOCVD technology has advantages of the high deposition rate and the good step coverage compared with the conventional physical vapor deposition (PVD) technology in several industrial applications. The Cu films have been deposited with varying the experimental conditions of substrate temperatures and copper source vapor pressures. The films were annealed in a vacuum condition after the deposition, and the annealing effect on the electrical properties of the films was measured. The crystallinity and the microstructures of the films were observed by scanning electron microscopy (SEM), and the electrical resistivity was measured by 4-point probe. In the case of the Cu deposition on TiN substrate, the best electrical property of the films was measured for the samples prepared at 18$0^{\circ}C$. Very high deposition rate of the Cu film up to 250 nm/min was obtained on the polyimide substrate when the mixture of liquid and vapour precursor was used.

• Journal of Energy Engineering
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• v.8 no.2
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• pp.325-332
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• 1999

When a rotating heat pipe is in operation, liquid condensate returns from the condenser to the evaporator along the inside surface by both components of gravitational and centrifugal forces. It was known that its performance was largely dependent on how to increase the flow rates of condensate and keep the condensate film thickness as thin as possible. Most of research works were focussed on this goal, and various inner wall structures such as tapered wall, stepped wall or coil inserted pipe etc. were developed. In the present study, a stepped wall structure with 3 internal grooves in the condenser and adiabatic zone was examined. For this system, the condensate would flow down to the evaporator through the grooves, resulting a reduced film thickness over the condenser surface. Experimental data showed an enhancement of heat transfer coefficient in the condenser zone. An analytical solution to the condensate film thickness showed that the analytically calculated values of heat transfer coefficient were considerably higher than the experimental data.

• Journal of Korea Multimedia Society
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• v.13 no.8
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• pp.1115-1127
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• 2010

In order to increase the productivity in manufacturing TFT-LCD(thin film transistor-liquid crystal display), it is essential to classify defects that occur during the production and make an appropriate decision on whether the product with defects is scrapped or not. The decision mainly depends on classifying the defects accurately. In this paper, we present an effective classification method for film defects acquired in the panel production line by analyzing the intensity distribution and shape feature of the defects. We first generate a binary image for each defect by separating defect regions from background (non-defect) regions. Then, we extract various features from the defect regions such as the linearity of the defect, the intensity distribution, and the shape characteristics considering intensity, and construct a referential image database that stores those feature values. Finally, we determine the type of a defect by matching a defect image with a referential image in the database through the matching cost function between the two images. To verify the effectiveness of our method, we conducted a classification experiment using defect images acquired from real TFT-LCD production lines. Experimental results show that our method has achieved highly effective classification enough to be used in the production line.

• Journal of Mechanical Science and Technology
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• v.18 no.9
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• pp.1680-1688
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• 2004

The information indicating device plays an important part in the information times. Recently, the classical CRT (Cathod Ray Tube) display is getting transferred to the LCD (Liquid Crystal Display) one which is a kind of the FPDs (Flat Panel Displays). The OLED (Organic Light Emitting Diodes) display of the FPDs has many advantages for the low power consumption, the luminescence in itself, the light weight, the thin thickness, the wide view angle, the fast response and so on as compared with the LCD one. The OLED has lately attracted considerable attention as the next generation device for the information indicators. And also it has already been applied for the outside panel of a mobile phone, and its demand will be gradually increased in the various fields. It is manufactured by the vapor deposition method in the vacuum state, and the uniformity of thin film on the substrate depends on the temperature distribution in the point-cell source. This paper describes the basic concepts that are obtained to design the point-cell source using the computational temperature analysis. The grids are generated using the module of AUTOHEXA in the ICEM CFD program and the temperature distributions are numerically obtained using the STAR-CD program. The temperature profiles are calculated for four cases, i.e., the charge rate for the source in the crucible, the ratio of diameter to height of the crucible, the ratio of interval to height of the heating bands, and the geometry modification for the basic crucible. As a result, the blowout phenomenon can be shown when the charge rate for the source increases. The temperature variation in the radial direction is decreased as the ratio of diameter to height is decreased and it is suggested that the thin film thickness can be uniformed. In case of using one heating band, the blowout can be shown as the higher temperature distribution in the center part of the source, and the clogging can appear in the top end of the crucible in the lower temperature. The phenomena of both the blowout and the clogging in the modified crucible with the nozzle-diffuser can be prevented because the temperature in the upper part of the crucible is higher than that of other parts and the temperature variation in the radial direction becomes small.

• Corrosion Science and Technology
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• v.11 no.1
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• pp.1-8
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• 2012

The development of martensitic grades which can be processed in continuous galvanizing lines requires the reduction of the oxides formed on the steel during the hot dip process. This reduction mechanism was investigated in detail by means of High Resolution Transmission Electron Microscopy (HR-TEM) of cross-sectional samples. Annealing of a martensitic steel in a 10% $H_2+N_2$ atmosphere with the dew point of $-35^{\circ}C$ resulted in the formation of a thin $_{C-X}MnO.SiO_{2}$ (x>1) oxide film and amorphous $_{a-X}MnO.SiO_{2}$ oxide particles on the surface. During the hot dip galvanizing in Zn-0.13%Al, the thin $_{C-X}MnO.SiO_{2}$ (x>1) oxide film was reduced by the Al. The $_{a-X}MnO.SiO_{2}$ (x<0.9) and $a-SiO_{2}$ oxides however remained embedded in the Zn coating close to the steel/coating interface. No $Fe_{2}Al_{5-X}Zn_{X}$ inhibition layer formation was observed. During hot dip galvanizing in Zn-0.20%Al, the $_{C-X}MnO.SiO_{2}$ (x>1) oxide film was also reduced and the amorphous $_{a-X}MnO.SiO_{2}$ and $a-SiO_{2}$ particles were embedded in the $Fe_{2}Al_{5-X}Zn_{X}$ inhibition layer formed at the steel/coating interface during hot dipping. The results clearly show that Al in the liquid Zn bath can reduce the crystalline $_{C-X}MnO.SiO_{2}$ (x>1) oxides but not the amorphous $_{a-X}MnO.SiO_{2}$ (x<0.9) and $a-SiO_{2}$ oxides. These oxides remain embedded in the Zn layer or in the inhibition layer, making it possible to apply a Zn or Zn-alloy coating on martensitic steel by hot dipping. The hot dipping process was also found to deteriorate the mechanical properties, independently of the Zn bath composition.

• Applied Chemistry for Engineering
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• v.3 no.3
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• pp.412-421
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• 1992

The superconducting thin films have shown a growing possibility for practical application in microelectronic fields in recent years. In this study, the high Tc superconducting Y-Ba-Cu-O thin films were prepared on various substrates by chemical vapor deposition method using organic metal chelates of $Y(thd)_3$, $Ba(thd)_2$, and $Cu(thd)_2$ as source materials. The deposition reactions were carried out on single crystalline MgO(100), YSZ(100), $SrTiO_3(100)$, and polycrystalline $SrTiO_3$ substrates. Deposition thickness of thin films was linearly increased with the increase of deposition time. It turned out that the Y-Ba-Cu-O thin films on MgO(100), YSZ(100), and $SrTiO_3(100)$ single crystal substrates showed superconductivities above liquid nitrogen temperature($T_{c,onset}=87{\sim}89K$, $T_{c,zero}=85{\sim}86K$), but the one on polycrystalline $SrTiO_3$ substrate did not.

• Proceedings of the KIEE Conference
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• 1999.07d
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• pp.1750-1752
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• 1999

An active-matrix liquid crystal display (LCD) using thin film transistors (TFTs) has been widely recognized as having potential for high-quality color flat-panel displays. Pixel-Design Array Simulation Tool (PDAST) was used to profoundly understand the gate signal distortion and pixel charging capability, which are the most critical limiting factors for high-quality TFT-LCDs. Since PDAST can simulate the sate, data and pixel voltages of a certain pixel on TFT array at any time and at any location on an array, the effect of the new set of capacitance models on the pixel operations can be effectively analyzed. The set of models which is adopted from VLSI interconnections calculate more precise capacitance. The information obtained from this study could be utilized to design the larger area and finer image quality panel.

• The Journal of the Acoustical Society of Korea
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• v.23 no.1
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• pp.1-7
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• 2004

We developed SH-SAW sensors to detect protein molecules in liquid solutions applying a particular antibody thin film on the delay line of transverse SAW devices. The antibody investigated was human-immune-globulin G (HigG) to hold the antigens (anti-HigG) in the protein solution. We fabricated the sensor generating 100 MHz with the piezoelectric single crystal LiTaO₃. We measured the frequency change of the sensor by adding the anti-body concentration on SAM (self assembled monolayer) deposited on the Au layer. The sensor showed stable response to the mass loading effects of the anti-HigG molecules with the sensitivity up to 10.8 ng/ml/Hz at noise level 400 Hz below.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2003.10a
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• pp.333-338
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• 2003

Nano-imprint lithography(NIL) is a polymer embossing technique, capable of transferring nano-scale patterns onto a thin film of thermoplastics such as polymethyl methacrylate(PMMA) using this parallel process. Feature size down 10 nm have been demonstrated. In NIL, the pattern is formed by displacing polymer material, which can be squeeze flow of a viscous liquid. Due to the size of the pattern, a thorough understood of the process through experiments may be very different. Therefore we nead to resort to numerical simulation on the embossing process. Generally, there are two ways of numerical simulation on nano-scale flow, namely top-down and bottom-up approach. Top-down approach is a way to simulate the flow assuming that polymer is a continuum. On the contrary, in the bottom-up approach, simulation is peformed using molecular dynamics(MD). However, as latter method is not feasible yet. we chose the top-down approach. For the numerical analysis, two dimensional moving grid was used since the moving grid can predict the flow front. Effects of surface tension as well as the slip at the boundary were also considered.