• Title/Summary/Keyword: Thin liquid film

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Anchoring and Alignment Behavior of Liquid Crystals on Poly(vinyl cinnamate) Thin Films Treated in Various Ways

  • Lee, Taek-Joon;Hahm, Suk-Gyu;Lee, Seung-Woo;Ree, Moon-Hor
    • Proceedings of the Polymer Society of Korea Conference
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    • 2006.10a
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    • pp.240-240
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    • 2006
  • Thin films of poly(vinyl cinnamate) (PVCi) were prepared on indium tin oxide (ITO) glass and silicon substrates by conventional spin coating and subsequent drying process. The thicknesses of the films ranged 50-120 nm. The films' surface was treated by rubbing, ultraviolet exposure or their combinations in various ways with changing rubbing strength and exposure dose. These films were examined in detail in the aspects of surface morphology and chain orientation. Further, the anchoring and orientation behaviors of liquid crystals on the film surfaces were investigated. All the results will be discussed in detail.

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Reactor design of PECVD system using a liquid aerosol feed method (미립액상법을 위한 PECVD 반응로설계)

  • 정용선;오근호
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • v.7 no.2
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    • pp.235-243
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    • 1997
  • The high-$T_c$ superconducting phase, $YBa_2Cu_3O_x$, was deposited on the single crystal MgO substrate, using a liquid aerosol feed method in a plasma enhanced chemical vapor deposition(PECVD) reactor. The effect of the plasma distribution depending on the design of a reactor was studied by the analysis of the microstructures of thin films. The particles landed were frequently observed on the films and the two causes that were responsible for the particle deposition were explained. The particles were deposited by the unstable and non-uniform plasma and the low evaporation rate of the precursors. Also, the thin film deposition rate decreased significantly as the distance between the evaporating location and the substrate increased.

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The Comparison to Physical Properties of Large Size Indium Zinc Oxide Transparent Conductive Layer (대면적 상온 Indium Zinc Oxide 투명 도전막의 물성 특성 비교)

  • Joung, Dae-Young;Lee, Young-Joon;Park, Joon-Yong;Yi, Jun-Sin
    • Journal of Surface Science and Engineering
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    • v.41 no.1
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    • pp.6-11
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    • 2008
  • An Indium Zinc Oxide(IZO) transparent conductive layer was deposited on a large size glass substrate by using magnetron dc sputtering method with varying a deposition temperature. As the deposition temperature decreased to a room temperature, the sheet resistance of IZO film increased. But this deposition temperature range is included in an applicable to a device. From a standpoint of the sheet resistance, the differences of the sheet resistance were not great and the uniformity of the layer was uniformed around 10%. Crystallization particles were shown on the surface of the layer as deposition temperature increased, but these particles were not shown on the surface of the layer as deposition temperature decreased to the room temperature. It didn't make a scrap of difference in a transmittance of varying deposition temperature. Therefore, it is concluded that IZO thin film manufactured by the room temperature deposition condition can be used as a large size transparent conductive layer of a liquid crystal display device.

The Melting Process in an Ice-Ball Capsule (아이스볼내의 융해과정에 대한 해석)

  • Suh, J.S.
    • Korean Journal of Air-Conditioning and Refrigeration Engineering
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    • v.7 no.4
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    • pp.577-588
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    • 1995
  • A numerical study is made on the melting process of an unconstrained ice inside an isothermal ice-ball capsule. The unmelted ice core is continuously ascending on account of buoyancy forces. Such a buoyancy-assisted melting is commonly characterized by the existence of a thin liquid film above the ice core. The present study is motivated to present a full-equation-based analysis of the influences of the initial subcooling and the natural convection on the fluid flow associated with the buoyancy-assisted melting. In the light of the solution strategy, the present study is substantially distinguished from the existing works in that the complete set of governing equations in both the melted and unmelted regions are resolved in one domain. Numerical results are obtained by varying the wall temperature and initial temperature. The present results reported the transition of the flow pattern in a spherical capsule, as the wall temperature was increased over the density inversion point. In addition, time wise variation of the shapes for the liquid film and the lower ice surface, the time rate of change in the melt volume fraction and the melting distance at symmetric line is analyzed and is presented.

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A Dry-patterned Cu(Mg) Alloy Film as a Gate Electrode in a Thin Film Transistor Liquid Crystal Displays (TFT- LCDs) (TFT-LCDs 게이트 전극에 적용한 Cu(Mg) 합금 박막의 건식식각)

  • Yang Heejung;Lee Jaegab
    • Korean Journal of Materials Research
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    • v.14 no.1
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    • pp.46-51
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    • 2004
  • The annealing of a Cu(4.5at.% Mg)/$SiO_2$/Si structure in ambient $O_2$, at 10 mTorr, and $300-500^{\circ}C$, allows for the outdiffusion of the Mg to the Cu surface, forming a thin MgO (15 nm) layer on the surface. The surface MgO layer was patterned, and successfully served as a hard mask, for the subsequent dry etching of the underlying Mg-depleted Cu films using an $O_2$ plasma and hexafluoroacetylacetone [H(hfac)] chemistry. The resultant MgO/Cu structure, with a taper slope of about $30^{\circ}C$ shows the feasibility of the dry etching of Cu(Mg) alloy films using a surface MgO mask scheme. A dry-etched Cu(4.5at.% Mg) gate a-Si:H TFT has a field effect mobility of 0.86 $\textrm{cm}^2$/Vs, a subthreshold swing of 1.08 V/dec, and a threshold voltage of 5.7 V. A novel process for the dry etching of Cu(Mg) alloy films, which eliminates the use of a hard mask, such as Ti, and results in a reduction in the process steps is reported for the first time in this work.

Development of Spray Thin Film Coating Method using an Air Pressure and Electrostatic Force (공압과 정전기력을 이용한 스프레이 박막 코팅 기술 개발)

  • Kim, Jung Su;Kim, Dong Soo
    • Journal of the Korean Society for Precision Engineering
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    • v.30 no.6
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    • pp.567-572
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    • 2013
  • In many electro-devices, the vacuum process is used as the manufacturing process. However, the vacuum process has a problem, it is difficult to apply to a continuous process such as a R2R(roll to roll) printing process. In this paper, we propose an ESD (electro static deposition) printing process has been used to apply an organic solar cell of thin film forming. ESD is a method of liquid atomization by electrical forces, an electrostatic atomizer sprays micro-drops from the solution injected into the capillary with electrostatic force generated by electric potential of about several tens kV. The organic solar cell based on a P3HT/PCBM active layer and a PEDOT:PSS electron blocking layer prepared from ESD method shows solar-to-electrical conversion efficiency of 1.42% at AM 1.5G 1sun light illumination, while 1.86% efficiency is observed when the ESD deposition of P3HT/PCBM is performed on a spin-coated PEDOT:PSS layer.

The Organic-Inorganic Hybrid Encapsulation Layer of Aluminium Oxide and F-Alucone for Organic Light Emitting Diodes

  • Gwon, Deok-Hyeon;Seong, Myeong-Mo
    • Proceedings of the Korean Vacuum Society Conference
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    • 2012.08a
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    • pp.374-374
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    • 2012
  • Nowadays, Active Matrix Organic Light-Emitting Diodes (AM-OLEDs) are the superior display device due to their vivid full color, perfect video capability, light weight, low driving power, and potential flexibility. One of the advantages of AM-OLED over Liquid Crystal Display (LCD) lies in its flexibility. The potential flexibility of AM-OLED is not fully explored due to its sensitivity to moisture and oxygen which are readily present in atmosphere, and there are no flexible encapsulation layers available to protect these. Therefore, we come up with a new concept of Inorganic-Organic hybrid thin film as the encapsulation layer. Our Inorganic layer is Al2O3 and Organic layer is F-Alucone. We deposited these layers in vacuum state using Atomic Layer Deposition (ALD) and Molecular Layer Deposition (MLD) techniques. We found the results are comparable to commercial requirement of 10-6 g/m2 day for Water Vapor Transmission Rate (WVTR). Using ALD and MLD, we can control the exact thin film thickness and fabricate more dense films than chemical or physical vapor deposition methods. Moreover, this hybrid encapsulation layer potentially has both the flexibility of organic layers and superior protection properties of inorganic layer.

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A Study on the Electrical Characteristics of Low Temperature Polycrystalline Thin Film Transistor(TFT) using Silicide Mediated Crystallization(SMC) (금속유도 결정화를 이용한 저온 다결정 실리콘 TFT 특성에 관한 연구)

  • 김강석;남영민;손송호;정영균;주상민;박원규;김동환
    • Proceedings of the Materials Research Society of Korea Conference
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    • 2003.03a
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    • pp.129-129
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    • 2003
  • 최근에 능동 영역 액정 표시 소자(Active Matrix Liquid Crystal Display, AMLCD)에서 고해상도와 빠른 응답속도를 요구하게 되면서부터 다결정 실리콘(poly-Si) 박막 트랜지스터(Thin Film Transistor, TFT)가 쓰이게 되었다. 그리고 일반적으로 디스플레이의 기판을 상대적으로 저가의 유리를 사용하기 때문에 저온 공정이 필수적이다. 따라서 새로운 저온 결정화 방법과 부가적으로 최근 디스플레이 개발 동향 중 하나인 대화면에 적용 가능한 공정인 금속유도 결정화 (Silicide Mediated Crystallization, SMC)가 연구되고 있다. 이 소자는 top-gated coplanar구조로 설계되었다. (그림 1)(100) 실리콘 웨이퍼위에 3000$\AA$의 열산화막을 올리고, LPCVD로 55$0^{\circ}C$에서 비정질 실리콘(a-Si:H) 박막을 550$\AA$ 증착 시켰다. 그리고 시편은 SMC 방법으로 결정화 시켜 TEM(Transmission Electron Microscopy)으로 SMC 다결정 실리콘을 분석하였다. 그 위에 TFT의 게이트 산화막을 열산화막 만큼 우수한 TEOS(Tetraethoxysilane)소스로 사용하여 실리콘 산화막을 1000$\AA$ 형성하였고 게이트는 3000$\AA$ 두께로 몰리브덴을 스퍼터링을 통하여 형성하였다. 이 다결정 실리콘은 3$\times$10^15 cm^-2의 보론(B)을 도핑시켰다. 채널, 소스, 드래인을 정의하기 위해 플라즈마 식각이 이루어 졌으며, 실리콘 산화막과 실리콘 질화막으로 passivation하고, 알루미늄으로 전극을 형성하였다 그리고 마지막에 TFT의 출력특성과 전이특성을 측정함으로써 threshold voltage, the subthreshold slope 와 the field effect mobility를 계산하였다.

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New Process Development for Hybrid Silicon Thin Film Transistor

  • Cho, Sung-Haeng;Choi, Yong-Mo;Jeong, Yu-Gwang;Kim, Hyung-Jun;Yang, Sung-Hoon;Song, Jun-Ho;Jeong, Chang-Oh;Kim, Shi-Yul
    • 한국정보디스플레이학회:학술대회논문집
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    • 2008.10a
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    • pp.205-207
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    • 2008
  • The new process for hybrid silicon thin film transistor (TFT) using DPSS laser has been developed for realizing both low-temperature poly-Si (LTPS) TFT and a-Si:H TFT on the same substrate as a backplane of active matrix liquid crystal display. LTPS TFTs are integrated on the peripheral area of the panel for gate driver integrated circuit and a-Si:H TFTs are used as a switching device for pixel in the active area. The technology has been developed based on the current a-Si:H TFT fabrication process without introducing ion-doping and activation process and the field effect mobility of $4{\sim}5\;cm^2/V{\cdot}s$ and $0.5\;cm^2/V{\cdot}s$ for each TFT was obtained. The low power consumption, high reliability, and low photosensitivity are realized compared with amorphous silicon gate driver circuit and are demonstrated on the 14.1 inch WXGA+ ($1440{\times}900$) LCD Panel.

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Integrated IR Photo Sensor for Display Application (디스플레이 패널에 집적이 가능한 적외선 포토센서)

  • Jeon, Ho-Sik;Heo, Yang-Wook;Lee, Jae-Pyo;Han, Sang-Youn;Bae, Byung-Seong
    • Journal of the Korean Society for Precision Engineering
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    • v.29 no.11
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    • pp.1164-1169
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    • 2012
  • This paper presents a study of an integrated infrared (IR) photo sensor for display application. We fabricated hydrogenated amorphous silicon thin film transistor (a-Si:H TFT) and hydrogenated amorphous silicon germanium thin film transistor (a-SiGe:H TFT) which were bottom gate structure. We investigated the dependence of a-SiGe:H TFT characteristics on incident wavelengths. We proposed photo sensor which responded to wavelengths of IR region. Proposed pixel circuit of photo sensor was consists of switch TFT and photo TFT, and one capacitor. We developed integrated photo sensor circuit and investigated the performance of the proposed sensor circuit according to the input wavelengths. The developed photo sensor circuit with a-SiGe:H TFT was suitable for IR.