• Title/Summary/Keyword: Thin foil

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A Study on BST Thin Films by MOD Process (MOD법에 의한 BST 박막의 특성에 대한 연구)

  • 송재훈
    • Journal of the Microelectronics and Packaging Society
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    • v.3 no.1
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    • pp.33-40
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    • 1996
  • MOD법에 의해 BST박막을 제조하고 전기적 특성을 측정함으로써 마이크로 회로에 적용가능성을 타진하였다. MOD 공정의 선구물질로서 barium neodecanoate, strontium 2-ethylhexanoate 및 titanium dimethoxy 야-2-ethylheanoate를 합성하였다, 합성된 선구물 질들을 Ba0.5Sr0.5TiO3가 되도록 화학양론적으로 혼합하여 공통용매인 p-xylene에 녹인다음 기판위에 spin coating 방법으로 박막을 형성하여 건조하고 소성하였다. 사용된 기판은 ITO/glass, Pt/SiO2/Si, Pt/Ti/SiO2/Si 및 Pt foil을 사용하였다. 소성 속도를 빨리했을 경우 소성속도를 느리게 했을때에 비하여 훨씬 균일하고 치밀한 박막을 얻을수 있었다, 여러 가 지 제조조건의 변화에 따른 유전상수 I-V 특성 및 C-V 측성 등의 전기적 특성을 측정하고 고찰하였다.

Entangled-Mesh Graphene for Highly Stretchable Electronics

  • Han, Jae-Hyeon;Yeo, Jong-Seok
    • Proceedings of the Korean Vacuum Society Conference
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    • 2016.02a
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    • pp.351.1-351.1
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    • 2016
  • While conventional electronic devices have been fabricated on the rigid and brittle Si based wafer as a semiconducting substrate, future devices are increasingly finding applications where flexibility and stretchability are further integrated to enable emerging and wearable devices. To achieve high flexibility and stretchability, various approaches are investigated such as polymer based conducting composite, thin metal films on the polymer substrate, and structural modifications for stretchable electronics. In spite of many efforts, it is still a challenge to identify a solution that offers both high stretchability and superior electrical properties. In this paper, we introduce a highly stretchable entangled-mesh graphene showing a potential to address such requirements as stretchability and good electrical performance. Entangle-mesh graphene was synthesized by CVD graphene on the Cu foil. To analyze the mechanical properties of entangled-mesh graphene, endurance and stretching tester have been used.

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A Development of SEM Applied Microjoining System (SEM을 이용한 미세 접합 시스템 개발)

  • 황일한;나석주
    • Journal of Welding and Joining
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    • v.21 no.4
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    • pp.63-68
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    • 2003
  • Scanning electron microscopy (SEM) has been used as a surface measurement instrument and a tool for lithography in semiconductor process due to its high density localized beam. For those purposes, however, the maximum current of SEM Is less than 100pA, which is not enough fo material processing. In this paper SEM was modified to increase the amount of current reaching a specimen from gun part where current is generated, the possibility of applying SEM to material processing, especially microjoining, was investigated. The maximum current of SEM after modifications was measured up to 10$\mu$A, which is about 10$^{5}$ times greater than before modifications. Through experiments such as eutectic solder wetting on thin 304 stainless steel foil and microjoining of 10$\mu$m thick 304 stainless steel, the intensity of electron beam of SEM proved to be great enough fur material processing as heat source. And a tight jig system was found necessary to hold materials close enough fur successful microloining.

Electroforming and Properties of Fe-Ni Alloy Thin Foils (Fe-Ni 합금 극박재 제조를 위한 전주성형기술 및 극박재 특성)

  • Yim T. H.;Lee H. Y.
    • Transactions of Materials Processing
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    • v.14 no.2 s.74
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    • pp.121-125
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    • 2005
  • Electroforming is a process that employs technology similar to that used for electroplating but which is used for manufacturing metallic articles, rather than as a means of producing surface coatings. Electroforming provides a cost-effective means of producing alloys and fully dense nanocrystalline metals as foils, sheets and complex shapes. Fe-Ni nanocrystalline alloy foils with composition in the $36\~80wt\%$ Ni range were fabricated by electroforming. The thickness of electroformed foils was in the range of $5\~30{\mu}m$. TEM and XRD analysis was applied for measuring the grain size. Very fine grain size$(\~10nm)$ was obtained in alloy foils. The yield and tensile strength of electroformed Fe-Ni alloy were 2000-2800 MPa and 2500-3300 MPa respectively. The magnetic permeability at high frequency of electroformed Fe-Ni foil was higher than that of thicker foils.

Evaluation of Surface Mechanical Properties of Electro-formed Fe-Ni-Co Thin Foil by Dynamic Nano-indentation and Finite Element Methods (Fe-Ni-Co 박판의 동적 나노 압침법과 유한 요소법에 의한 표면 기계적 특성 평가)

  • Gang, Bo-Gyeong;Choe, Yong
    • Proceedings of the Korean Institute of Surface Engineering Conference
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    • 2017.05a
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    • pp.124-124
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    • 2017
  • Fe-Ni-Co 합금 박막(<$100{\mu}m$)을 황화물계 용액에서 전주공정으로 제조하였다. XRF로 측정한 박판의 평균 조성은 Fe-34 wt.% Ni-3 wt.% Co 이다. AFM으로 측정한 표면 조도는 35.2 nm 이다. 표면의 나노 경도는 평균 5.4 GPa 이었다. Oliver 모델을 적용한 구리 박막의 탄성하강강성도는 약 75 이었다. Alekhin 모델을 적용한 구리 박막의 마찰계수, 피로한계는 각각 0.134, 0.027 이었다. 유한요소법으로 평가한 Berkovich 형 나노압침선단의 하중분포를 이차원 선형 및 비선형 해석하면 1 [mN]의 정적하중을 가한 Fe-Ni-Co 박막은 약 576 [mN]로 예측되었다. 압침선단의 하중집중정도는 표면탐침현미경으로 관찰한 압흔의 변형정도와 유사한 경향을 보였다.

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A study on the laser ablation of the copper metal foil by 355nm pulse laser (355nm 펄스 레이저를 이용한 구리 박막의 레이저 어블레이션에 대한 연구)

  • Oh J.Y;Shin B.S.
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2006.05a
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    • pp.667-668
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    • 2006
  • Usually nanosecond pulsing laser ablation of metal is under thermal effect. Many studies of the theoretical analysis and modeling to predict a result of laser ablation of metal are suggested on the basis of the photothermal mechanism. In this paper, we investigate the etching depth and laser fluence of laser ablation of copper films. We proposed the simplified SSB Model(Srinivasan-Smrtic-Babudp model) to study the photothermal effect of nanosecond pulsing laser ablation of copper thin metal. The experimental results were obtained by using the 355nm DPSS $Nd:YVO_4$ laser.

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An evaluation method on the surface characteristics of ultra-thin copper foil using chemical copper plating (화학 동도금을 이용한 캐리어 극박 동박 표면 특성 평가에 관한 연구)

  • Heo, Jin-Yeong;Lee, Hong-Gi;Gu, Seok-Bon;Jeon, Jun-Mi;Kim, Ik-Beom
    • Proceedings of the Korean Institute of Surface Engineering Conference
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    • 2014.11a
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    • pp.129-129
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    • 2014
  • 본 연구는 알루미늄 및 구리 캐리어 소재상에 화학 동도금(Chemical Copper)으로 형성된 극박 동박 표면 및 석출막의 특성 평가에 관한 연구이다. 평가에 사용된 극박 동박은 현재 캐리어박 선점률이 높은 M, J, Y사의 제품이다. 최상층 구리 표면에서 조직, 조성, 표면조도를 평가하였고, 단면 평가에서는 copper layer 및 nodule layer, adhesion layer, anti-corrosion layer, release layer, substrate에서의 물성 및 특성을 평가하였다.

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The Thermal Transformation of Tobermorite-Studies on The Thermal Transformation of Calcium Silicate Hydrates(II)- (Tobermorite의 가열변화 -규산칼슘 수화물의 가열성상에 관한 연구(II)-)

  • 이종근;최상흘;한상목
    • Journal of the Korean Ceramic Society
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    • v.11 no.4
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    • pp.25-30
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    • 1974
  • The mixture of quartz powder and slaked lime with plenty water was oscillated in an autoclave and treated hydrothermally under the pressure of 10 kg/$\textrm{cm}^2$ for 8 hours. The main mineral synthesized was confirmed 11$\AA$ tobermorite by the method of X-ray diffraction and selected area electron diffraction. Tobermorite was heat-treated at 40$0^{\circ}C$, 80$0^{\circ}C$ and 100$0^{\circ}C$ for investigation of transformation of morphology and structure. Electron micrographs showed the thin platy structure of synthetic tobermorite with a little of crumpled foil or fibrous semi-crystalline calcium silicate hydrates. No difference in structure was appeared under the temperature of 80$0^{\circ}C$ but tobermorite converted gradually into wollastonite at 800$^{\circ}$~85$0^{\circ}C$. On heating, moulded material from tobermorite hardly shrinks under 80$0^{\circ}C$.

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Spray-coated single-wall carbon nanotube film strain sensor (스프레이코팅 방식으로 제작된 단일벽 탄소나노튜브막 스트레인센서)

  • Park, Chan-Won
    • Journal of Industrial Technology
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    • v.32 no.A
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    • pp.29-33
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    • 2012
  • We demonstrated the viability of fully microfabricating SWCNT(single-wall carbon nanotube) film strain sensors for force and weight sensing. Our spray-deposited SWCNT film strain sensors showed good linearity over a range from 0 to 400 microstrain, and much higher sensitivity compared to commercial metal foil-type gauges. The number of grids and the thickness of the SWCNT film were found to have a significant effect on the strain sensing properties of the SWCNT film gauges. A strain sensing methode for the CNT-based strain gauges was also investigated using a binocular type beam load cells. Preliminary results indicate that the microfabrication method shown here is promising for developing a commercial strain gauge using a spray-coated SWCNT thin film. In the near future, various studies will be performed to further enhance the properties of the spray-coated SWCNT film strain sensors.

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Stretchable and Foldable Electronics by Use of Printable Single-Crystal Silicon

  • Ahn, Jong-Hyun
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2008.06a
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    • pp.29-29
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    • 2008
  • Realization of electronics with performance equal to established technologies that use rigid semiconductor wafers, but in lightweight, foldable and stretchable formats would enable many new application possibilities. Examples include wearable systems for personal health monitoring, 'smart' surgical gloves with integrated electronics and electronic eye type imagers that incorporate focal plane arrays on hemispherical substrates. Circuits that use organic or certain classes of inorganic electronic materials on plastic or steel foil substrates can provide some degree of mechanical flexibility, but they cannot be folded or stretched. Also, with few exceptions such systems offer only modest electrical performance. In this talk, I will present a new approach to high performance, flexible and stretchable integrated circuits. These systems combine single-crystal silicon nanoribbons with thin plastic or elastomeric substrates using both "top-down" and "transfer-printing" technologies. The strategies represent promising routes to high performance, flexible and stretchable optoelectronic devices that can incorporate established, high performance inorganic electronic materials.

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