• 제목/요약/키워드: Thin film polyimide

검색결과 184건 처리시간 0.028초

플렉시블 OLED 패시베이션용 유기 박막 제작 및 특성 (Fabrication of Organic Thin Film for Flexible OLED Passivation and Its Characterization)

  • 김관도
    • 반도체디스플레이기술학회지
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    • 제19권1호
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    • pp.93-96
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    • 2020
  • Polyimide thin film was prepared by annealing the polyamic acid that was synthesized through co-deposition of diamine and dianhydride. The polyamic acid and polyimide thin film were characterized with FT-IR and HR FE-SEM. The average roughness of the film surface, evaluated with AFM, were 0.385 nm and 0.299 nm after co-deposition, and annealing at 120 ℃ respectively. OLED was passivated with the polyimide layer of 200 nm thickness. While the inorganic passivation layer enhances the WVTR of OLED, the organic passivation layer gives flexibility to the OLED. The in-situ passivation of OLED with organic thin film layer provides the leading technique to develop flexible OLED Display.

Investigation of Pyrolyzed Polyimide Thin Film as MEMS Material

  • Naka, Keisuke;Nagae, Hideki;Ichiyanagi, Masao;Jeong, Ok-Chan;Konishi, Satoshi
    • JSTS:Journal of Semiconductor Technology and Science
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    • 제5권1호
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    • pp.38-44
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    • 2005
  • Pyrolyzed polyimide is explored in terms of MEMS material. This paper describes chemical, electrical, mechanical properties of pyrolyzed polyimide (PIX-1400) thin film as MEMS material. When polyimide thin film was pyrolyzed at $800^{\circ}C$ for 60 minutes in $N_{2}$ ambient, the residual ratio of pyrolyzed film thickness measured with a surface profiler is about 49 %, and the resistivity is about $2.17{\times}10^{-2}\;{Omega}cm$. From the result of the load-deflection test, the estimated Young's modulus and initial average stress of pyrolyzed polyimide are 67 GPa and 30 MPa, respectively. As one demonstration of MEMS structures of pyrolyzed polyimide, the fabrication method of the microbridge structure is proposed for a micro heater and a resonator.

Pentacene Thin-Film Transistors with Polyimide/$SiO_2$ Dual Gate Dielectric

  • Imahara, Hirokazu;Kim, Woo-Yeol;Oana, Yasuhisa;Majima, Yutaka
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2007년도 7th International Meeting on Information Display 제7권1호
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    • pp.972-973
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    • 2007
  • Relationships between field effect mobility and grain size on pentacene thin-film transistors with $polyimide/SiO_2$ gate dielectrics have been studied. 6 kinds of polyimide were used as surface treatment gate dielectric layer. Grain size of the pentacene thin film were between 5 and $30\;{\mu}m$ and depended on the polyimide. The field effect mobility were also depended on the polyimide and the those values were from 0.027 to $0.69\;cm^2/(Vs)$. The field effect mobility tends to increase with increasing the grain size. Precursor type polyimide containing polyamic acid show better mobility of $0.69\;cm^2/(Vs)$ than soluble type polyimide. Bias stress characteristics in air are discussed in the basis of the grain size.

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Polyimide 기판을 이용한 Flexible CIGS 박막 태양전지 제조 (Fabrication of Flexible CIGS thin film solar cells using Polyimide substrate)

  • 정승철;안세진;윤재호;곽지혜;김도진;윤경훈
    • 한국신재생에너지학회:학술대회논문집
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    • 한국신재생에너지학회 2009년도 춘계학술대회 논문집
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    • pp.153-155
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    • 2009
  • In this study, we fabricated the $Cu(In,Ga)Se_2$ (CIGS) thin-film solar cells by using a polyimide substrate. The CIGS thin-film was deposited on Mo coated polyimide substrate by a 3-stage co-evaporation technique. Because the polyimide shows thermal transformation at about $400^{\circ}C$, the substrate temperature of co-evaporation process was set to below $400^{\circ}C$. Corresponding solar cell showed a conversion efficiency of 7.08 % with $V_{OC}$ of 0.58 V, $J_{SC}$ of 24.99 $mA/cm^2$ and FF of 0.49.

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Polyimide 기판과 ZnO 박막의 접합강도에 미치는 증착조건에 관한 연구 (A Study on the Deposition Conditions on Joint Strength of Polyimide Substrate and ZnO Thin Film)

  • 허장욱
    • 한국기계가공학회지
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    • 제12권2호
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    • pp.62-67
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    • 2013
  • The influence of internal stress and joint strength(shear, tensile) according to the deposition conditions was investigated by the Polyimide substrate and ZnO thin film. Deposition thickness and temperature affect the internal stress and the internal stress was minimum at the 60nm and $200^{\circ}C$ of the deposition conditions. Tensile strength is large at the deposition condition that shear strength is large and the shear strength was about 50% of the tensile strength. The shear strength and tensile strength were large at deposition condition that internal stress was small. Crack occurred near the joint interface of Polyimide substrate and progressed along the interface until the final fracture.

건식법에 의해 제조된 내열성 폴리이미드박막의 열적특성 및 습도감지특성 (Thermal and Humidity Sensing Properties of Heat Resistant Polyimide Thin Film Manufactured by Dry Process)

  • 임경범;김기환;황선양;김종윤;황명환
    • 전기학회논문지
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    • 제56권6호
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    • pp.1080-1086
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    • 2007
  • The aim of this paper is to establish the optimum fabrication condition of specimens, using the Vapor Deposition Polymerization Method(VDPM), which is one of modesto prepare functional organic thin films using a dry process, and to develop a thin film type humidity sensor which has good humidity sensitive characteristics. The inner part of the film became denser and roughness of the film surface eased as curing temperature increased so that thickness of the film could be made uniform. This also shows the appropriate curing temperature was $250^{\circ}C$. The basic structure of the humidity sensor is a parallel capacitor which consists of three layers of Aluminum/Polyimide/Aluminum. The result of SEM and AFM measurement shows that the thickness of PI thin films decreased and the refraction increased as curing temperature increased, which indicates that a capacitance-type humidity sensor utilizing polyimide thin film is fabricated on a glass substrate. The characteristics of fabricated samples were measured under various conditions, and the samples had linear characteristics in the range of 20-80 %RH, independent of temperature change, and low hysteresis characteristic.

Non Leaky Conductor-Backed CPW Based on Thin Film Polyimide on CMOS-grade Silicon for Ku-band Application

  • Lee, Sang-No;Lee, Joon-Ik;Yook, Jong-Gwan;Kim, Yong-Jun
    • KIEE International Transactions on Electrophysics and Applications
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    • 제4C권4호
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    • pp.165-169
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    • 2004
  • This paper reports a miniaturized conductor-backed CPW (CBCPW) bandpass filter based on a thin film polyimide layer coated on CMOS-grade silicon. With a 20 ${\mu}{\textrm}{m}$-thick polyimide interface layer and back metallization on the CMOS-grade silicon, the interaction of electromagnetic fields with the lossy silicon substrate has been isolated, and as a result a low-loss and low-dispersive CBCPW line has been obtained. Measured attenuation constant at 20 GHz is below 1.2 ㏈/cm, which is compatible with the CPW on GaAs. In addition, by using the proposed CBCPW geometry, miniaturized BPF for Ku band application is designed and its measured frequency response shows excellent agreement with the predicted value with validating the performances of the proposed CBCPW geometry for RFIC interconnects and filter applications.

클로로메틸 폴리이미드(CMPI) 박막과 근접장 나노 프로브 레이저 패터닝을 이용한 미세 형상 가공 기술 (Micro Patterning Using Near-Field Coupled Nano Probe Laser Photo Patterning Of Chloromethylated Polyimide Thin Film)

  • 최무진;장원석;김재구;조성학;황경현
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2004년도 추계학술대회 논문집
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    • pp.369-372
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    • 2004
  • Photo-induced surface alignment is charming as a non-contact photo-patternable alignment technology which can be used in the next generation of displays, such as large area, multi-domain. For decades, many polymer film have been investigated and developed to be used in the photo alignment. Among these photoreactive materials, recently developed polyimide, Chloromethylated Polyimide(CMPI) now became the focus of interests in this area because of its high photosensitivity and superior thermal stability. In this report, we present micro patterning method to form the nanoscale structure by Mask-Less laser patterning using this CMPI film and NSOM probe.

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저온 공정을 이용한 플라스틱 STN 셀의 전기 광학 특성 (Electro-Optical Characteristics of Plastic STN Cell using Low Temperature Process)

  • 김강우;황정연;김종환;서대식
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2004년도 춘계학술대회 논문집 디스플레이 광소자분야
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    • pp.202-205
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    • 2004
  • We investigated the electro-optical(EO) performances of the super twisted nematic liquid crystal display(STN-LCD) on the polyimide(PI) surface using polymer film. The NLC pretilt angles generated are about $18^{\circ}$ by the rubbing alignment method on thin plastic substrates. However, the pretilt angle are at about $13^{\circ}$ lower on the glass substrate than on thin plastic substrate. Monodomain alignment of the plastic STN-LCD can be observed. A stable voltage-transmittance(V-T) curve of the plastic STN-LCD was observed on the polyimide(PI) surfaces using polymer film. Also, a faster response time for the plastic STN-LCD on the polyimide(PI) surfaces using polymer film can be achieved.

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저온 공정을 이용한 플라스틱 STN 셀의 전기 광학 특성 (Electro-Optical Characteristics of Plastic STN Cell using Low Temperature Process)

  • 김강우;황정연;김종환;서대식
    • 한국전기전자재료학회논문지
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    • 제17권10호
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    • pp.1095-1099
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    • 2004
  • We investigated the electro-optica](EO) performances of the super twisted nematic liquid crystal display(STN-LCD) on the polyimide(PI) surface using polymer film. The NLC(Nematic Liquid Crystal) pretilt angles generated are about 18$^{\circ}$by the rubbing alignment method on thin plastic substrates. However, the pretilt angle are at about 13$^{\circ}$ lower on the glass substrate than on thin plastic substrate. Monodomain alignment of the plastic STN-LCD can be observed. A stable voltage-transmittance(V-T) curve of the plastic STN-LCD was observed on the polyimide(PI) surfaces using polymer film. Also, a faster response time for the plastic STN-LCD on the polyimide(PI) surfaces using polymer film can be achieved.