• Transactions of Materials Processing
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• v.29 no.6
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• pp.323-330
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• 2020

The surface region of a sheet metal may have different characteristics from the inner region because the surface region is less restricted than the interior. In addition, the grains on the free surface are less hardened because of surface adsorption of the dislocations, rather than piling up. In the case of bulk or thick sheet metals, this effect is negligible because the fraction of the surface region is much smaller than that of the inner region. However, this surface effect is important in the case of ultra-thin sheet metals. In order to evaluate the surface effect, tensile and bending tests were performed for the SS304 stainless steel with a thickness of 0.39 mm. The bending force predicted using the tensile behavior is higher than the measurement because of the surface effect. To account for the surface effect, the surface layer model was developed by dividing the sheet section into surface and inner layers. The mechanical behaviors of the two regions were calibrated using the tensile and bending properties. The surface layer model reproduced the bending behavior of the ultra-thin sheet metal.

• Journal of Welding and Joining
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• v.15 no.2
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• pp.54-63
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• 1997

For the purpose of establishing laser welding condition (laser power, welding speed and beam focus) and of evaluating tailored blanks for two kinds of thin steel sheets SPCC and SK5M using in the thin plate structure such as automobile, train, and so on, investigated their $CO^2$ laser weldability under various initial welding conditions. SPCC thin sheet showed good weldability under some welding conditions. But, high carbon steel sheet SK5M needed heat treatment after welding to obtain ductility of the welded joint. And next, tailored blank was tested through deep drawing to evaluate reliability of their obtained laser welding conditions. The forming depths by tailored blank were SPCC+SPCC=22-25mm and SK5M+SK5M=13-25mm.

• Journal of the Korean Ceramic Society
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• v.45 no.5
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• pp.276-279
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• 2008

In this research, properties of $N_2$-doped $Sb_2Te_3$ thin film were evaluated using 4-point probe, XRD and AFM. $Sb_2Te_3$ material has faster crystallization rate than $Ge_2Sb_2Te_5$, but sheet resistance difference between amorphous and crystallization state is very low. This low sheet resistance difference decreases sensing margin in reading operation at PRAM device operation. Therefore, in order to overcome this weak point, $N_2$ gas was doped on $Sb_2Te_3$ thin film. Sheet resistance difference between amorphous and crystallized state of $N_2$-doped $Sb_2Te_3$ thin film showed about $10^4$ times higher than Un-doped $Sb_2Te_3$ thin film because of the grain boundary scattering.

• Korean Journal of Materials Research
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• v.19 no.4
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• pp.203-206
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• 2009

$Sn_XSe_{100-X}$ (15|X|30) alloys have been studied to explore their suitability as phase change materials for nonvolatile memory applications. The phase change characteristics of thin films prepared by a Radio Frequency (RF) magnetron co-sputtering system were analyzed by an X-ray diffractometer and 4-point probe measurement. A phase change static tester was also used to determine their crystallization under the pulsed laser irradiation. X-ray diffraction measurements show that the transition in sheet resistance is accompanied by crystallization. The amorphous state showed sheet resistances five orders of magnitude higher than that of the crystalline state in $Sn_XSe_{100-X}$ (x = 15, 20, 25, 30) films. In the optimum composition, the minimum time of $Sn_XSe_{100-X}$ alloys for crystallization was 160, 140, 150, and 30ns at 15mW, respectively. The crystallization temperature and the minimum time for crystallization of thin films were increased by increasing the amount of Sn, which is correlated with the activation energy for crystallization.

• Transactions of Materials Processing
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• v.17 no.1
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• pp.35-45
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• 2008

Electromagnetic Forming (EMF) technology such as magnetic pulse forming, which is one of the high velocity forming methods, has been used for the joining and forming process in various industry fields. This method could be derived a series of deformation of sheet metal by using a strong magnetic field. In this study, numerical approach by finite element simulation of the electromagnetic forming process was presented. A transient electromagnetic finite element code was used to obtain the numerical model of the time-varying currents that are discharged through the coil in order to obtain the transient magnetic forces. Also, the body forces generated in electromagnetic field were used as the loading condition to analyze deformation of thin sheet metal workpiece using explicit dynamic finite element code. In this study, after finite element analysis for thin sheet metal forming process with free surface configuration was performed, analytical approach for a dimpled shape by using EMF was carried out. Furthermore, the simulated results of the dimpled shape by EMF were compared with that by a conventional solid tool in view of the deformed shape. From the results of finite element analysis, it is confirmed that the EMF process could be applied to thin sheet metal forming.

• Progress in Superconductivity
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• v.1 no.1
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• pp.51-55
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• 1999

A Ni/Ag/Stainless steel 310S(SS310S) multi-layer sheet has been fabricated by a combination of vacuum brazing, cold rolling and texture annealing processes. After heat-treating the thin Ni/Ag/SS310S multi-layer sheet at $900^{\circ}C$ for 2h, development of (100)<001>cube texture on Ni surface was revealed by (111) pole figure. Quantitative chemical analysis was made by EPMA for the cross-section of the Ni/Ag/SS310S multi-layer sheet. EPMA results showed that Ag diffusion into the Ni layer, which may suppress the cube texture development, was negligible. A small amount of Cr atoms were detected in the Ni layer. It showed that Ag can be used as a chemical barrier of alloying element atoms in Ni layer for the Ni/Ag/SS310S multi-layer sheet and a strong cube texture was developed for the Ni layer in the Ni/Ag/SS310S multi-layer sheet.

• Journal of Integrative Natural Science
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• v.5 no.4
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• pp.237-240
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• 2012

In this study, PEDOT thin films polymerized with Iron(III)tosylate ($Fe(PTS)_3$) and grown on atomically smooth and highly dense 3-aminopropyltriethoxysilane self-assembled monolayer (APS-SAM) surfaces by VPP method have been investigated. PEDOT thin films were synthesized on APS self-assembled $SiO_2$ wafer surface at two different concentrations (20 wt% and 40 wt%) and growth time (3 and 30 minutes), and then their sheet resistance were measured and compared. PEDOT thin films grown with 20 wt% $Fe(PTS)_3$ oxidant are highly conductive when compared with the film grown with 40 wt% $Fe(PTS)_3$, as ascertained by the measured sheet resistance values down to 0.06 ${\Omega}/cm$. It clearly suggests that 20 wt% is more effective oxidant concentration for VPP than 40 wt% even though the film grown with 40 wt% oxidant has better quality than the film with 20 wt% $Fe(PTS)_3$ does.

• Korean Journal of Materials Research
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• v.10 no.1
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• pp.90-96
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• 2000

The effects of the type and thickness of underlayers on the crystallographic texture and the sheet resistance of aluminum thin films were studied. Sputtered Ti and Ti/TiN were examined as the underlayer of the aluminum films. The texture and the sheet resistance of the metal thin film stacks were investigated at various thicknesses of Ti or TiN, and the sheet resistance was measured after annealing at $400^{\circ}C$ in an nitrogen ambient. For the Ti underlayer, the minimum thickness to obtain excellent texture of aluminum <111> was 10nm, and the sheet resistance of the metal stack was greatly increased after annealing due to the interdiffusion and reaction of Al and Ti. TiN between Ti and Al could suppress the Al-Ti reaction, while it deteriorated the texture of the aluminum film. For the Ti/TiN underlayer, the minimum Ti thickness to obtain excellent texture of aluminum <111> was 20nm, and the minimum thickness of TiN to function as a diffusion barrier between Ti and Al was 20nm.

• Korean Journal of Materials Research
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• v.9 no.5
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• pp.533-537
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• 1999

ATO(Sb doped $SnO_2$) thin films whose thicknesses were 600, 1100 and $2100\AA$ were prepared by DC magnetron sputtering method. They showed the lowest resistivity at DC sputtering power 0.24kW and had lower resistivity with increasing thickness. The power dependence of resistivity among ATO thin films was also different with thickness. The increase of carrier concentration in ATO thin films was responsible for the decrease of resistivity with thickness increase. ATO thin films which were prepared at 30sccm oxygen flow rate showed a great change of sheet resistance under 1M HCl solution. The investigation of SAM(Scanning Auger Microprobe) revealed that oxygen atomic percentage on the surface of ATO thin films was changed. The decrease of sheet resistance also occurred when ATO thin films, prepared at 30sccm oxygen flow rate, were exposed to air for a long period of time. For this reason, it was considered that the desorption of oxygen on ATO surface was accelerated by HCl.

• Journal of the Korean Institute of Gas
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• v.14 no.6
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• pp.38-43
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• 2010

According to the lack of resources and the stringency of environmental regulations, a study of the high strength thin plate sheet steels for automobile have been become an important issue for automobile industry. However, the problem of hydrogen embrittlement of high strength sheet steels was concerned with the degradation of mechanical properties. Therefore, we studied the hydrogen behavior of surface layers of 590MPa DP sheet steels on development using by relationship the microstructure of subsurface and the distribution of micro hardnesses. Hydrogen was charged into the specimens using by the cathodic electrolytic method. The behavors of under surface layers were investigated by the observation of microstructures and the micro vickers hardness test with the amount of hydrogen charging with hydrogen charging conditions.