• Title/Summary/Keyword: Thin Film Process

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Effect of Glycine Adsorption on Polishing of Silicon Nitride in Chemical Mechanical Planarization Process (CeO2 슬러리에서 Glycine의 흡착이 질화규소 박막의 연마특성에 미치는 영향)

  • 김태은;임건자;이종호;김주선;이해원;임대순
    • Journal of the Korean Ceramic Society
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    • v.40 no.1
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    • pp.77-80
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    • 2003
  • Adsorption of glycine on$Si_3N_4$powder surface has been investigated, which is supposed to enhance the formation of passive layer inhibiting oxidation in aqueous solution. In the basic solution, multinuclear surface complexing between Si and dissociated ligands was responsible for the saturated adsorption of glycine. In addition, $CeO_2$-based CMP slurry containing glycine was manufactured and then applied to planarize$SiO_2$and$Si_3N_4$thin film. Owing to the passivation by glycine, the removal rates, Rh, were decreased, however, the selectivities, RE(SiO$_2$)/RR($Si_3N_4$), increased and showed maximum at pH=12. The suppressed oxidation and dissolution by adsorbate were correlated with the dissociation behavior of glycine at different pH and subsequent chemical adsorption.

Characterization of Cu2ZnSnSe4 Thin Films Selenized with Cu2-xSe/SnSe2/ZnSe and Cu/SnSe2/ZnSe Stacks

  • Munir, Rahim;Jung, Gwang Sun;Ko, Young Min;Ahn, Byung Tae
    • Korean Journal of Materials Research
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    • v.23 no.3
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    • pp.183-189
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    • 2013
  • $Cu_2ZnSn(S,Se)_4$ material is receiving an increased amount of attention for solar cell applications as an absorber layer because it consists of inexpensive and abundant materials (Zn and Sn) instead of the expensive and rare materials (In and Ga) in $Cu(In,Ga)Se_2$ solar cells. We were able to achieve a cell conversion efficiency to 4.7% by the selenization of a stacked metal precursor with the Cu/(Zn + Sn)/Mo/glass structure. However, the selenization of the metal precursor results in large voids at the absorber/Mo interface because metals diffuse out through the top CZTSe layer. To avoid the voids at the absorber/Mo interface, binary selenide compounds of ZnSe and $SnSe_2$ were employed as a precursor instead of Zn and Sn metals. It was found that the precursor with Cu/$SnSe_2$/ZnSe stack provided a uniform film with larger grains compared to that with $Cu_2Se/SnSe_2$/ZnSe stack. Also, voids were not observed at the $Cu_2ZnSnSe_4$/Mo interface. A severe loss of Sn was observed after a high-temperature annealing process, suggesting that selenization in this case should be performed in a closed system with a uniform temperature in a $SnSe_2$ environment. However, in the experiments, Cu top-layer stack had more of an effect on reducing Sn loss compared to $Cu_2Se$ top-layer stack.

Design of a Simply Structured High-efficiency Polarization-independent Multilayer Dielectric Grating for Spectral Beam Combining (SBC 시스템 구성을 위한 단순한 구조를 가지는 고효율 무편광 유전체 다층박막 회절격자 설계)

  • Cho, Hyun-Ju;Kim, Gwan-Ha;Kim, Dong Hwan;Lee, Yong-Soo;Kim, Sang-In;Cho, Joonyoung;Kim, Hyun Tae;Kwak, Young-seop
    • Korean Journal of Optics and Photonics
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    • v.31 no.4
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    • pp.169-175
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    • 2020
  • We design a polarization-independent dielectric multilayer thin-film diffraction grating for a spectral-beam-combining (SBC) system with a simple grating structure and low aspect ratio. To maintain the high quality of the SBC beam, we propose a multilayer mirror structure in which the wavefront distortion due to stress accumulation is minimized. Moreover, to prevent light absorption from contamination, an optimized design to minimize the grating thickness was performed. The optimally designed diffraction grating has 99.36% diffraction efficiency for -1st-order polarization-independent light, for incidence at the Littrow angle and 1055-nm wavelength. It is confirmed that the designed diffraction grating has sufficient process margin to secure a polarization-independent diffraction efficiency of 96% or greater.

Effects of Sulfuric Acid Concentration and Alloying Elements on the Corrosion Resistance of Cu-bearing low Alloy Steels

  • Kim, Ki Tae;Kim, Young Sik
    • Corrosion Science and Technology
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    • v.17 no.4
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    • pp.154-165
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    • 2018
  • During the process of sulfur dioxide removal, flue gas desulfurization equipment provides a serious internal corrosion environment in creating sulfuric acid dew point corrosion. Therefore, the utilities must use the excellent corrosion resistance of steel desulfurization facilities in the atmosphere. Until now, the trend in developing anti-sulfuric acid steels was essentially the addition of Cu, in order to improve the corrosion resistance. The experimental alloy used in this study is Fe-0.03C-1.0Mn-0.3Si-0.15Ni-0.31Cu alloys to which Ru, Zn and Ta were added. In order to investigate the effect of $H_2SO_4$ concentration and the alloying elements, chemical and electrochemical corrosion tests were performed. In a low concentration of $H_2SO_4$ solution, the major factor affecting the corrosion rate of low alloy steels was the exchange current density for $H^+/H_2$ reaction, while in a high concentration of $H_2SO_4$ solution, the major factors were the thin and dense passive film and resulting passivation behavior. The alloying elements reducing the exchange current density in low concentration of $H_2SO_4$, and the alloying elements decreasing the passive current density in high concentration of $H_2SO_4$, together play an important role in determining the corrosion rate of Cu-bearing low alloy steels in a wide range of $H_2SO_4$ solution.

Hydrogen Effect on Deposition Rate of Aluminum Thin Films from Chemical Vapor Deposition Using Dimethylethylamine Alane (DMEAA를 사용해 CVD법으로 증착한 알루미늄 박막의 증착속도에 관한 수소 효과)

  • Jang, Tae-Ung;Lee, Hwa-Seong;Baek, Jong-Tae;An, Byeong-Tae
    • Korean Journal of Materials Research
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    • v.8 no.2
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    • pp.131-134
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    • 1998
  • The deposition rate and surface morphology of Al films deposited by MOCVD have been studied on the $SiO_{2}$ and TiN(60nm/Si) substrates. A1 films were deposited with the pyrolysis of dimethylethylamine alane(DMEAA). When A1 was deposited on Ti& substrate without carrier gas, Al deposition rate increased with H\ulcorner pre- treatment. The $H_2$ gas enhances the CVD reaction at the substrate surface. When Al was deposited on $SiO_{2}$ substrate, $H_2$ plasma pretreatment reduced Al incubation time and made a dense Al film compared with Ar plasma pre- treatment or no pretreatment.

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Technical Tasks and Development Current Status of Organic Solar Cells (유기 태양전지의 개발 현황과 기술 과제)

  • Jang, Ji Geun;Park, Byung Min;Lim, Sungkyoo;Chang, Ho Jung
    • Korean Journal of Materials Research
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    • v.24 no.8
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    • pp.434-442
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    • 2014
  • Serious environmental problems have been caused by the greenhouse effect due to carbon dioxide($CO_2$) or nitrogen oxides($NO_x$) generated by the use of fossil fuels, including oil and liquefied natural gas. Many countries, including our own, the United States, those of the European Union and other developed countries around the world; have shown growing interest in clean energy, and have been concentrating on the development of new energy-saving materials and devices. Typical non-fossil-fuel sources include solar cells, wind power, tidal power, nuclear power, and fuel cells. In particular, organic solar cells(OSCs) have relatively low power-conversion efficiency(PCE) in comparison with inorganic(silicon) based solar cells, compound semiconductor solar cells and the CIGS [$Cu(In_{1-x}Ga_x)Se_2$] thin film solar cells. Recently, organic cell efficiencies greater than 10 % have been obtained by means of the development of new organic semiconducting materials, which feature improvements in crystalline properties, as well as in the quantum-dot nano-structure of the active layers. In this paper, a brief overview of solar cells in general is presented. In particular, the current development status of the next-generation OSCs including their operation principle, device-manufacturing processes, and improvements in the PCE are described.

Resistive Switching Effect of the $In_2O_3$ Nanoparticles on Monolayered Graphene for Flexible Hybrid Memory Device

  • Lee, Dong Uk;Kim, Dongwook;Oh, Gyujin;Kim, Eun Kyu
    • Proceedings of the Korean Vacuum Society Conference
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    • 2013.02a
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    • pp.396-396
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    • 2013
  • The resistive random access memory (ReRAM) has several advantages to apply next generation non-volatile memory device, because of fast switching time, long retentions, and large memory windows. The high mobility of monolayered graphene showed several possibilities for scale down and electrical property enhancement of memory device. In this study, the monolayered graphene grown by chemical vapor deposition was transferred to $SiO_2$ (100 nm)/Si substrate and glass by using PMMA coating method. For formation of metal-oxide nanoparticles, we used a chemical reaction between metal films and polyamic acid layer. The 50-nm thick BPDA-PDA polyamic acid layer was coated on the graphene layer. Through soft baking at $125^{\circ}C$ or 30 min, solvent in polyimide layer was removed. Then, 5-nm-thick indium layer was deposited by using thermal evaporator at room temperature. And then, the second polyimide layer was coated on the indium thin film. After remove solvent and open bottom graphene layer, the samples were annealed at $400^{\circ}C$ or 1 hr by using furnace in $N_2$ ambient. The average diameter and density of nanoparticle were depending on annealing temperature and times. During annealing process, the metal and oxygen ions combined to create $In_2O_3$ nanoparticle in the polyimide layer. The electrical properties of $In_2O_3$ nanoparticle ReRAM such as current-voltage curve, operation speed and retention discussed for applictions of transparent and flexible hybrid ReRAM device.

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Thermal Degradation of BZO Layer on the CIGS Solar Cells

  • Choi, Pyungho;Kim, Sangsub;Choi, Byoungdeog
    • Proceedings of the Korean Vacuum Society Conference
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    • 2013.02a
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    • pp.458-458
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    • 2013
  • We investigated a study on the thermal degradation of boron doped zinc-oxide (BZO) layer which used as a transparent conducting layer on the Cu (In1-xGax) Se2 (CIGS) based thin film solar cells. Devices were annealed under the temperature of $100^{\circ}C$ or 100 hours and then Hall measurement was carried out to characterize the parameters of mobility (${\mu}Hall$), resistivity (${\rho}$), conductivity (${\sigma}$) and sheet resistance (Rsh). The initial values of ${\mu}Hall$, ${\rho}$, ${\sigma}$ and Rsh were $29.3cm^2$/$V{\cdot}s$, $2.1{\times}10^{-3}{\Omega}{\cdot}cm$, $476.4{\Omega}^{-1}{\cdot}cm^{-1}$ and $19.1{\Omega}$/${\Box}$ respectively. After the annealing process, the values were $4.5cm^2$/$V{\cdot}s$, $12.8{\times}10^{-3}{\Omega}{\cdot}cm$, $77.9{\Omega}^{-1}{\cdot}cm^{-1}$ and $116.6{\Omega}$/${\Box}$ respectively. We observed that ${\mu}Hall$ and ${\sigma}$ were decreased, and ${\rho}$ and Rsh were increased. In this study, BZO layer plays an important role of conducting path for electrons generated by incident light onthe CIGS absorption layer. Therefore, the degradation of BZO layer characterized by the parameters of ${\mu}Hall$, ${\rho}$, ${\sigma}$ and Rsh, affect to the cell efficiency.

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Process Characteristics for $YB_{2}Cu_{3}O_{7-d}$ Films Fabricated by Single Target Sputter and Surface Modification Technique

  • Lee, Eue-Jae
    • Korean Journal of Materials Research
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    • v.5 no.5
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    • pp.598-605
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    • 1995
  • Thin films of $YB_{2}Cu_{3}O_{7-d}$ were prepared on various substrated of MgO(100), $SrTiO_{3}$, and $LaAlO_{3}$ by using off-axis magentron sputtering methods and annealing in-situ. The prarameters of film fabrication processes had been optimized through a "follow the lcoal maxima" strategy to yield good quality films in therms of the critical temperature $T_{c}$ and the critical current density $J_{c}$. Optimizedproecsses employing a plane magndtron and an cylindrical magnetron yielded $T_{c}$>90K along with $J_{c}$$10^{6}$A/$\textrm{cm}^2$ at 77K and > 2${\times}$$10^{7}$A/$\textrm{cm}^2$ at 5K. The sampels, however, showed degradationinthe properties, after chemical etching for fabrication of microbridges with the line width of 2-10 mocrons. In particular, the value of $T_{c}$ for the microbridges of 2microns was as small as 80%. The degradation was strongly dependent on the line width through a formula : $T_{c}$(e)=$T_{c}$)b) [1-a exp(-1000 bL)} where $T_{c}$(e) and $T_{c}$ (b) are the values of $T_{c}$ in the absolute scale measured after and before chemical etching, respectively and L is the line width in mm. By utilizing a best fitting technique, the proper constant values of a and to b were found as exp(-1.2) and 0.22, respectively. This formula was very useful in estimatiing the upper limit of the device operationtemperature.

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Investigation of Top-Contact Organic Field Effect Transistors by the Treatment Using the VDP Process on Dielectric

  • Kim, Young-Kwan;Hyung, Gun-Woo;Park, Il-Houng;Seo, Ji-Hoon;Seo, Ji-Hyun;Kim, Woo-Young
    • Journal of the Korean Applied Science and Technology
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    • v.24 no.1
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    • pp.54-60
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    • 2007
  • 이 논문에서는 게이트 절연막 위에 vapor deposition polymerization(VDP)방법을 사용하여 성막한 유기 점착층을 진공 열증착하여 유기 박막 트랜지스터(OTFTs)소자를 제작할 수 있음을 증명하였다. 우리가 제작한 Staggered-inverted top-contact 구조를 사용한 유기 박막 트랜지스터는 전기적 output 특성이 포화 영역안에서는 포화곡선을, triode 영역에서는 비선형적인 subthreshold를 확실히 볼 수 있음을 발견했다. $0.2{\mu}m$ 두께를 가진 게이트 절연막위에 유기 점착층을 사용한 OTFTs의 장 효과 정공의 이동도와 문턱전압, 그리고 절멸비는 각각, 약 0.4cm2/Vs, -0.8V, 106 이 측정되었다. 게이트 절연막의 점착층으로써 폴리이미드의 성막을 위해, 스핀코팅 방법 대신 VDP 방법을 도입하였다. 폴리이미드 고분자막은 2,2bis(3,4-dicarboxyphenyl)hexafluoropropane dianhydride(6FDA)와 4,4'-oxydianiline(ODA)을 고진공에서 동시에 열 증착 시킨 후, 그리고 $150^{\circ}C$에서 1시간, 다시 $200^{\circ}C$에서 1시간 열처리하여 고분자화된 막을 형성하였다. 그리고 점착층이 OTFTs의 전기적 특성에 주는 영향을 설명하기 위해 비교 연구하였다.