• 한국분말재료학회지
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• 제4권3호
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• pp.196-204
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• 1997

Joining of AIN ceramics to W and Cu by active-metal brazing method was tried with use of (Ag-Cu)-Ti alloy as insert-metal. Joints were produced under various conditions of temperature, holding time and Ti-content in (Ag-Cu) alloy Reaction and microstructural development in bonded interface were investigated through observation and analysis by SEM/EDS, EPMA and XRD. Joint strengths were measured by shear test. Bonded interface consists of two layers: an insert-metal layer of eutectic Ag- and Cu-rich phases and a reaction layer of TiN. Thickness of reaction layer increases with bonding temperature, holding time and Ti-content of insert-metal. It was confirmed that the growth of reaction layer is a diffusion-controlled process. Activation energy for this process was 260 KJ/mol which is lower than that for N diffusion in TiN. Maximum shear strength of 108 MPa and 72 MPa were obtained for AIN/W and AIN/Cu joints, respectively. Relationship between processing variables, joint strength and thickness of reaction layer was also explained.

• 한국표면공학회지
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• 제35권1호
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• pp.47-52
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• 2002

Intermetallic compound on the soldered interface plays important role on the bondability and mechanical properties of soldered joint. The formation of intermetallic compounds are influenced by many factors such as temperature, holding time, base metals and so on. On this study the effect of number of reflow times on the intermetallic growth was investigated. For the experimental materials, Sn-3.5Ag-0.7Cu solder ball of 0.3mm diameter and RMA-type flux were used. Thickness of intermetallic compound of solder ball by 2nd reflow showed nearly 60% higher than that of 1st reflow, and shear strength showed 10% higher value. Thickness and shear strength according to the position of interface such as upper side or lower side between two substrates were also investigated.

• The Korean Journal of Ceramics
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• 제2권2호
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• pp.95-101
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• 1996

Variations of the leakage current behaviors and interface potential barrier $({\Phi}_B)$ of rf-sputter deposited (Ba, Sr)$TiO_3$ (BST) thin films with thicknesses ranging from 20 nm to 150nm are investigated as a function of the thickness and bias voltages. The top and bottom electrodes are dc-sputter-deposited Pt films. ${\Phi}_B$ critically depends on the BST film deposition temperature, postannealing atmosphere and time after the annealing. The postannealing under $N_2$ atmosphere results in a high interface potential barrier height and low leakage current. Maintaining the BST capacitor in air for a long time reduces the ${\Phi}_B$ from about 2.4 eV to 1.6 eV due to the oxidation. ${\Phi}_B$ is not so dependent on the film thickness in this experimental range. The leakage conduction mechanism is very dependent on the BST film thickness; the 20 nm thick film shows tunneling current, 30 and 40 nm thick films show Shottky emission current.

• 한국정밀공학회지
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• 제20권7호
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• pp.171-176
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• 2003

In this study, stress analysis using Boundary Element Method (BEM) was carried to investigate stress distribution in the brazing joint between a Hardmetal and a HSS. The two models were proposed to analyze the stress singularity in the interfaces of the brazing joint. The material type, thickness of the filler metal and the length of the vertical brazing adhesive are considered in the BEM analysis. As results, the peak point of the stress is founded to be in the lower interface of the brazed joint. It should be noted that the maximum stress of the peak point is being affected by the thickness and length of the brazing joint.

• 한국결정성장학회지
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• 제7권3호
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• pp.494-503
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• 1997

Polyimide(PI)위에서 Cu의 초기 성장과정을 설명하기 위해, PI 위에 Cu를 조금씩 증착시키면서 그리고 PI 위에 Cu 층을 쌓아놓고 이 Cu 층을 $Ar^+$ 이온으로 깍아내면서 계면에서의 변화를 XPS를 이용하여 비교ㆍ관측하였다. 상온에서 PI위에 Cu를 조금씩 증착하면서 관측하였을 때, 그 성장과정에 따르는 phase의 변화는 Cu-N-O complex에서 $Cu_2O$ phase로, 그리고 metallic Cu 순으로 성장하는 것이 관측되었다. 반면에 PI위에 증착되어 있는 Cu를 조금씩 깎아내면서 관측하였을 때, metallic Cu가 $Ar^+$ 이온으로 깍아내어 polyimide와의 계면에 도달하게 되었을 때에는 Cu$_2$O phase로서 관측되었다. 이상의 결과로부터, in-situ로 Cu를 조금씩 올리면서 계면을 조사하는 것과 Cu를 증착시킨 후, 깍으면서 계면을 조사하는 것과는 다른 결과를 얻게 된다는 것을 알 수 있었다.

• Restorative Dentistry and Endodontics
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• 제20권1호
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• pp.152-163
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• 1995

This experiment was performed to observe the adhesion pattern and microleakage in the gingival margin according to variation in the resin cement thickness which results from thickness of Die spacer. which is considered to effect the adaptability of the composite resin inlays. Clearfil CR inlays were fabricated on stone models with CR Sep applicated once and Nice fit twice, 4 times, and 6 times each. After 2nd curing within the CRC-100 oven, CR inlays were cemented with CR inlay cement. Dye(2% methylene blue) penetration and adhesion pattern were evaluated after sectioning of gingival margin into :3 pieces. The results were as follows ; 1. The thickness of resin cement showed unevenchanging pattern with that of die spacer, namely, it was increased until 4 times' application of Nice-Fit but was decreased with 6 times' application of that. 2. The degree of dye penetration wasn't affected by cement thickness within a limited value. 3. Most of dye penetration was shown through the interface between cement and enamel rather than the interface between cement and CR inlay. This shows that the affinity of resin cement for CR inlay was superior to the adhesive strength with tooth structure. 4. No gap was found at the interface between enamel and cement but some showed separation between dentin and cement. It is concidered that the contraction force of cement was less than the bond strength with the enamel. 5. Lots of voids were found in the CR inlay and resin cement. There was a pooling tendency of bonding agent and cement in the axiogingival line angle portion. 6. In some specimens, cracks were shown in enamel margin. From this it could be considered that cavity preparation and surface treatment weakened the tooth structure.

• 한국자동차공학회논문집
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• 제14권2호
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• pp.67-75
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• 2006

In this paper, the compensation of ultrasonic scattering on interface crack depending on thickness variations of A1/Epoxy bonded dissimilar components was applied to improve measuring accuracy by using ultrasonic attenuation coefficient. The optimum conditions of theoretical value and experimental measuring accuracy by the ultrasonic method in A1/Epoxy bonded dissimilar components have been investigated. From the experimental results, the measurement method of interfacial crack lengths by using ultrasonic attenuation coefficient was proposed and discussed. After the ultrasonic scattering compensation depending on thickness variations of bonded dissimilar components was carried out, the measuring accuracy of interfacial crack length was improved by 5%.

• Journal of Periodontal and Implant Science
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• 제49권3호
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• pp.185-192
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• 2019

Purpose: Implant wall thickness and the height of the implant-abutment interface are known as factors that affect the distribution of stress on the marginal bone around the implant. The goal of this study was to evaluate the long-term effects of supracrestal implant placement and implant wall thickness on maintenance of the marginal bone level. Methods: In this retrospective study, 101 patients with a single implant were divided into the following 4 groups according to the thickness of the implant wall and the initial implant placement level immediately after surgery: 0.75 mm wall thickness, epicrestal position; 0.95 mm wall thickness, epicrestal position; 0.75 mm wall thickness, supracrestal position; 0.95 mm wall thickness, supracrestal position. The marginal bone level change was assessed 1 day after implant placement, immediately after functional loading, and 1 to 5 years after prosthesis delivery. To compare the marginal bone level change, repeated-measures analysis of variance was used to evaluate the statistical significance of differences within groups and between groups over time. Pearson correlation coefficients were also calculated to analyze the correlation between implant placement level and bone loss. Results: Statistically significant differences in bone loss among the 4 groups (P<0.01) and within each group over time (P<0.01) were observed. There was no significant difference between the groups with a wall thickness of 0.75 mm and 0.95 mm. In a multiple comparison, the groups with a supracrestal placement level showed greater bone loss than the epicrestal placement groups. In addition, a significant correlation between implant placement level and marginal bone loss was observed. Conclusions: The degree of bone resorption was significantly higher for implants with a supracrestal placement compared to those with an epicrestal placement.

• 한국정보통신학회논문지
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• 제21권9호
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• pp.1627-1634
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• 2017

비정질 InGaZnO 박막 두께가 다른 무접합 트랜지스터를 제작하고 두께에 따른 양과 음의 게이트 스트레스 전압 및 빛을 비춘 상태에서 소자 불안정성을 분석하였다. 채널 박막 두께가 얇을수록 게이트 스트레스 및 빛이 인가된 상태에서 문턱전압 및 드레인 전류 변화가 큰 것을 알 수 있었다. 그 원인을 stretched-exponential 모델과 소자 시뮬레이션을 수행하여 설명하였다. 박막이 얇을수록 캐리어 트랩핑 시간이 짧기 때문에 전자나 홀이 빨리 활성화되는 것과 채널 박막의 뒷부분에서 채널의 수직 전계가 증가하여 전자나 홀을 많이 축적할 수 있는 것으로 설명하였다. IGZO 무접합 트랜지스터 제작에서 채널 박막의 두께를 결정할 때 채널 박막 두께가 얇을수록 소자 불안정성이 큰 것을 고려해야 됨을 알 수 있다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 1999년도 제17회 학술발표회 논문개요집
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• pp.169-169
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• 1999

We studied magnetic properties of co thin films deposited on Pd (111) surface, which attracted much attention recently due to the perpendicular magnetic anisotropy, using magnetic circular dichroism(MCD). Special attention was paid on the effect of Pd capping and interface roughness on the direction of magnetic easy axis, and for that purpose MCD signals for all Co thicknesses were measured with two different ways : in-plane and out-of-plane geometry. In case of bare Co films deposited on smooth Pd(111) surface, no MCD signal was observed under 4$\AA$ co thickness. At 4$\AA$ Co thickness, MCD signal at the out-of-plane geometry was observed, and for thicker Co films, only in-plane MCD signal was measured. This type of magnetic easy axis transition has been reported for other cases like Co/Pt system. The effect of 5$\AA$ Pd capping on these bare Co films made an remarkable change on the transition of magnetic easy axis. Out-of-plane MCD signals exists up to 20$\AA$ Co thickness, and disappears at 24$\AA$ Co thickness. In-plane MCD signals first appears at 10$\AA$ Co thickness and gradually increases up to 24$\AA$ Co thickness. Between 10$\AA$ and 20$\AA$ Co thickness, in-plane and out-of-plane MCD signal coexist. The formation of multi-domain structure or the existence of tilted magnetic easy axis is an possible scenario for such an interesting coexistence. The effect of interface roughness was also tested by measuring MCD signal on Co films deposited on un-annealed Pd(111) surface. Out-of-plane MCD signal was observed up to 8$\AA$ Co thickness and the anisotropy of MCD signal at 4$\AA$ Co thickness was very large with respect to that of Co film deposited on the smooth substrate. Above 8$\AA$ thickness, there exists only in-plane MCD signal. From above results, it was concluded that both Pd capping and interface roughness induce and reenforce the perpendicular magnetic anisotropy. The large perpendicular magnetic anisotropy of Co/Pd multilayer system made by sputtering method can be well understood from our results.