• 한국정보디스플레이학회:학술대회논문집
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• 2004.08a
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• pp.544-547
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• 2004

Glass frits for dielectric layers are mostly used for screen printing process. Several additives have already been known to be well matched with lead-oxide glasses system. The use of lead oxide, however, creates environmental problems, so many recent studies on lead-free glasses compositions have been carried out. A study of the suitability between additives and lead-free glass system is needed. In this study, we have used a screen-printing method to make thick films of lead-oxide glass and lead-free glass using different additives, and analyzed and compared the transmittance of the thick films.

• Applied Chemistry for Engineering
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• v.2 no.3
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• pp.289-299
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• 1991

In order to obtain glasses appropriate to the thick film copper conductors, nine glasses based on both lead borosilicate and leadless borosilicate systems were made and the applicabilities of them were examined in conjunction with the requirements for thick film copper conductors. As the results, it was found that all the glasses are fitted to provide suitable sheet resistance, solderability and solder leach resistance to thick film copper conductors. However, it was turned out that only the lead borosilicate based glasses worked for getting usable aged adhesion strength of copper thick film to the alumina substrate, while copper conductor films made from the other glasses had poor aged adhesion strengths. Particularly cuprous oxide added lead borosilicate glass was considered as one of the most favorable glasses for manufacturing thick film copper conductors.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.24 no.3
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• pp.200-207
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• 2011

Abstract: The effect of lead free glass frit compositions on the properties of thick film conductor and resistor pastes were investigated. Two types lead free frits, HBF-A(without $Bi_2O_3$) and HBF-B(with $Bi_2O_3$) were made from $SiO_2$, $B_2O_3$, $Al_2O_3$, CaO, MgO, $Na_2O$, $K_2O$, ZnO, MnO, $ZrO_2$, $Bi_2O_3$. And Ag based conductor pastes and $RuO_2$ based resistor paste were prepared by mixed with these frits and functional phase(Ag and $RuO_2$), and organic vehicle. The properties of thick film conductor and resistor sintered at $850^{\circ}C$ were studied after printing on $Al_2O_3$ substrate. The morphology of the sintered films surface were SEM and EDS were carried out to analysis the chemical composition on resistor surface and state of Ru atom in frit matrix.

• Journal of the Korean Ceramic Society
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• v.30 no.11
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• pp.974-978
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• 1993

Glass viscosity effects on the electrical properties and microstructure of RuO2 based thick film resistors (TFR) using alumina modified lead borosilicate glasses were studied. AT 85$0^{\circ}C$, the glass viscosities were increased from 4.24Pa.s to 51.5Pa.s when the alumina was added from none to 14 weight percent to the standard glass of 63% PbO, 25% B2O3 and 12% SiO2. The resistivities of resistors were generally decreased and the microstructure development was retarded as the viscosity of the glass increased. This is contrary to the generally accepted thought that the low resistivity is due to fast microstructure development kinetics in TFR. Even though the glass viscosity retards the microstructure development kinetics, the overall network formations are favored for higher viscosity of glass, such that the sheet resistivities were decreased as the glass viscosity increased.

• Journal of the Korean Ceramic Society
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• v.47 no.5
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• pp.467-473
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• 2010

The objective of this study is to prepare lead-free thick film resistor (TFR) paste compatible with AlN substrate for hybrid microelectronics. For this purpose, CaO-ZnO-$B_2O_3-Al_2O_3-SiO_2$ glass system was chosen as a sintering aid of $RuO_2$. The effects of the weight ratio of CaO to ZnO in glass composition, the glass content and the sintering temperature on the electrical properties of TFR were investigated. $RuO_2$ as a conductive and glass powder were dispersed in an organic binder to obtain printable paste and then thick-film was formed by screen printing, followed by sintering at the range between $750^{\circ}C$ and $900^{\circ}C$ for 10 min with a heating rate of $50^{\circ}C$/min in an ambient atmosphere. The addition of ZnO to glass composition and sintering at higher temperature resulted in increasing sheet resistance and decreasing temperature coefficient of resistance. Using $RuO_2$-based resistor paste containing 40 wt%glass of CaO-20.5%ZnO-25%$B_2O_3$-7%$Al_2O_3$-15%$SiO_2$ composition, it is possible to produce thick film resistor on AlN substrate with sheet resistance of $10.6\Omega/\spuare$ and the temperature coefficient of resistance of 702ppm/$^{\circ}C$ after sintering at $850^{\circ}C$.

• Korean Journal of Materials Research
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• v.14 no.9
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• pp.670-675
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• 2004

Glasses in the $Bi_{2}O_3-SiO_2-ZnO$ glasses system were examined as a potential replacement for lead-oxide glass frits with low firing temperature ($500\sim600^{\circ}C$) for the dielectric layer of a plasma display panel (PDP). The glasses were evaluated for glass transition temperature($T_{g}$) and thermal expansion coefficient(${\alpha}$). After forming transparent thick films by a screen-printing method, it was evaluated for the optical properties. The transmittance of thick films fired at $500-600^{\circ}C$ showed above $80\%$, which was not dependent on the firing temperature. As a result, many pores were observed at samples fired at low temperature, while the number of pores from samples prepared at high temperature decreased and the pores size increased.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.9 no.1
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• pp.50-54
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• 1999

Plasma display panel is a potential candidate for HDTV, due to the fact that the screen size can easily be increased by a thick film technology. In this study, transparent dielectric materials which satisfied the requirements of dielectrics for PDP was developed using lead alumina borosilicate glasses. The Paste which had thixotropic behavior suitable for screen printing was made of this glass composition. the paste became more thixotropic as the particle size decreased. After firing, the cross sectional area of the thick film was analyzed by SEM. The voids in the thick film were removed using bimodal particle system. The dielectric thick film showed good adhesion characteristics.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.29A no.11
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• pp.84-90
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• 1992

The dependence of electrical characteristics of RuO$_2$-based thick film resistors on the RuO$_2$ contents, glass composition variation and the firing temperatures was measured. The sheet resistance of resistors decreased as the contents of RuO$_2$ increased and at firing temperatures higher than C, the sheet resistance increased as the firing temperature increased. In case of using lead borosilicate glass-containing $Bi_{2}O_{3}$, the sheet resistance decreased as the contents of $Bi_{2}O_{3}$ increased. TCR changes from negative to positive values as RuO$_2$ contents increased and from positive to negative values as the firing temperature increased. TCR increased to positive values as $Bi_{2}O_{3}$ increased in the glass.

• Proceedings of the Korea Association of Crystal Growth Conference
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• 1998.09a
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• pp.79-83
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• 1998

Plasma display panel is a potential candidate for HDTV, due to the fact hat the expansion of screen size is much easier using thick film technology. In this study, transparent dielectric materials using lead borosilicate glasses is developed, which satisfy the requirements of dielectrics for PDP. Paste is made of this glass composition. The paste has thixotropic behavior suitable for screen printing. The paste shows more thixotropic behavior as the particle size decrease. After firing, cross sectional area was analyzed by SEM. The void of fired thick film was removed using bimodal particle system. The dielectric showed good adhesion characteristics.

• Nuclear Engineering and Technology
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• v.55 no.10
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• pp.3709-3715
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• 2023

It is an important work to measure the dimensions of underwater spent fuel assemblies in the nuclear power industry during the overhaul, to judging whether the spent fuel assemblies can continue to be used. In this paper, a three dimensional reconstruction method for underwater spent fuel assemblies of nuclear reactor based on linear structured light is proposed, and the topography and size measurement was carried out based on the reconstructed 3D model. Multiple linear structured light sensors are used to obtain contour size data, and the shape data of the whole spent fuel assembly can be collected by one-dimensional scanning motion. In this paper, we also presented a corrected model to correct the measurement error introduced by lead-glass and water is corrected. Then, we set up an underwater measurement system for spent fuel assembly based on this method. Finally, an underwater measurement experiment is carried out to verify the 3D reconstruction ability and measurement ability of the system, and the measurement error is less than ±0.05 mm.