• 대한전기학회:학술대회논문집
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• 대한전기학회 1998년도 하계학술대회 논문집 G
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• pp.2541-2543
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• 1998

This paper describes the fabrication process to fabricate metallic structure of high aspect ratio using LlGA-like process. SU-8 is used as an electroplating mold. SU-8 is an epoxy-based photoresist, designed for ultrathick PR structure with single layer coating [1,2]. We can get more than $100{\mu}m$ thick layer by single coating with conventional spin coater, and applying multiple coating can make thicker layers. In the experiments, we used different kinds of SU-8, having different viscosity. To optimize the conditions for mold fabrication process, experiments are performed varying spinning time and speed, soft-bake, develop and PEB (Post Expose Bake) condition. With the optimized condition, minimum line and space of $3{\mu}m$ pattern with a thickness of $40{\mu}m$ and $4{\mu}m$ pattern with a thickness of $130{\mu}m$ were obtained. Using the patterned PR as a plating mold, metallic structure was fabricated by electroplating. We have fabricated a electroplated nickel comb actuator using SU-8 as plating mold. The thickness of PR mold is $45{\mu}m$ and that of plated nickel is$40{\mu}m$. Minimum line of the mold is $5{\mu}m$. Patterned metallic layer or polymer layer, which has selectivity with the structural plated metallic layer, can be used as sacrificial layer for fabrication of free-standing structure.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2005년도 추계학술대회 논문집 Vol.18
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• pp.43-44
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• 2005

SU-8 is a epoxy based photoresist designed for MEMS applications, where a thick, chemically and thermally stable image is desired. But SU-8 has proven to be very sensitive to variation in processing variables and hence difficult to use in the fabrication of useful structures. In this paper, negative SU-8 photoresist processed has been characterized in terms of delamination. Based on a full factorial designed experiment. Employing the design of experiment (DOE), a process parameter is established, and analyzing of full factional design is generated to investigate degree of delamination associated with three process parameters: post exposure bake (PEB) temperature, PEB time, and exposure energy. These results identify acceptable ranges of the three process variables to avoid delamination of SU-8 film, which in turn might lead to potential defects in MEMS device fabrication.

• Journal of information and communication convergence engineering
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• 제3권4호
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• pp.191-194
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• 2005

SU-8 is a epoxy based photoresist designed for MEMS applications, where a thick, chemically and thermally stable image are desired. However SU-8 has proven to be very sensitive to variation in processing variables and hence difficult to use in the fabrication of useful structures. In this paper, negative SU-8 photoresist processed has been characterized in terms of delamination, based on a full factorial designed experiment. Employing the design of experiment (DOE), a process parameter is established, and analyzing of full factorial design is generated to investigate degree of delamination associated with three process parameters: post exposure bake (PEB) temperature, PEB time, and exposure energy. These results identify acceptable ranges of the three process variables to avoid delamination of SU-8 film, which in turn might lead to potential defects in MEMS device fabrication.

• 한국광학회지
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• 제5권2호
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• pp.298-303
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• 1994

두꺼운 Photoresist(PR)로 원기둥 모양을 만들고 이를 용융함으로써 미세렌즈 행렬을 제작하였다. 이 방법으로 직경 $25\mu\textrm{m}$, $50\mu\textrm{m}$, $100\mu\textrm{m}$의 렌즈를 만들고 전자주사현미경과 탐침형 표면측정기를 통해 그 모양을 확인하였다. 그리고 렌즈의 광학적 성능을 측정하기 위해 위상변이 간섭법을 사용하여 평행광의 렌즈 통과 후 파면을 구하였다. 여기서 기준 구면과의 파면오차를 구하여 렌즈 초점거리나 초점광도분포 등을 얻었다. 그 결과 직경 $100\mu\textrm{m}$, 초점거리 $164\mu\textrm{m}$의 미세렌즈는 초점의 spot 직경이 $25\mu\textrm{m}$보다 작은 것으로 측정되었다.

• 한국산학기술학회:학술대회논문집
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• 한국산학기술학회 2002년도 추계학술발표논문집
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• pp.238-242
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• 2002

본 논문에서는 3차원 마이크로구조물을 위한 새로운 Thick Photoresist(TPR) 공정 기술을 개발하였다. 일반적으로 Thin Photoresist는 얇은 두께로 코팅을 할 수 있다. 그러나 SU-8과 같은 TRP은 몇 십 ㎛ 또는 그 이상으로 코팅이 가능하고 높은 종횡비를 얻을 수 있다. SU-8과 같은 TPR을 사용하여 마이크로구조물을 제작할 때 TPR의 crack들은 bake시의 갑작스런 tool down에 의한 stress에 의해 나타나는데, 이러한 crack들은 마이크로구조물의 도금을 어렵게 만든다. 본 논문에서는 TPR의 코팅, baking 시간 조절, cool down과 PEB(Post Expose Sake) 시간 조절을 통하여 stress에 의해 발생되는 crack이 없는 3차원 마이크로구조물을 제작할 수 있는 새로운 공정 기술을 개발하였다.

• 대한전기학회논문지:전기물성ㆍ응용부문C
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• 제49권2호
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• pp.140-148
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• 2000

In this paper, using surface micromachining technology with thick photoresist and aluminum, an SLM(Spatial Light Modulator), which is applied to the fields of adaptive optics and pattern recognition system, was fabricated and the electromechanical properties of the fabricated micro SLM are measured. In order to maximize fill-factor and remove mechanical coupling between micro SLM actuators, the micro SLM is composed of three aluminum layers so that spring structure and upper electrode are placed beneath the mirror plate, and $10\times10$ each mirror plate is individually actuated. Also, the micro SLM was designed to be able to modulate phase and amplitude of incoming light in order to have a continuity of phase modulation of incoming light. In the case of amplitude and phase modulation, maximum vertical displacement is 4$\mum$, and maximum angular displacement is $\pm4.6^{\corc}$ respectively. The height difference of the fabricated mirror plate was able to be reduced to 1100A with mirror plate planarization method using negative photoresist(AZ5214). The electromechanical properties of the fabricated micro SLM were measured with the optical measurement system using He-Ne laser and PSD(position sensitive device).

• JSTS:Journal of Semiconductor Technology and Science
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• 제8권3호
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• pp.244-250
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• 2008

An inductively coupled plasma etching process to replace an existing slower rate reactive ion etching process for $60{\mu}m$ diameter via-holes using Cl2/BCl3 gases has been investigated. Process pressure and platen power were varied at a constant ICP coil power to reproduce the RIE etched $200{\mu}m$ deep via profile, at high etch rate. Desired etch profile was obtained at 40 m Torr pressure, 950 W coil power, 90W platen power with an etch rate ${\sim}4{\mu}m$/min and via etch yield >90% over a 3-inch wafer, using $24{\mu}m$ thick photoresist mask. The etch uniformity and reproducibility obtained for the process were better than 4%. The metallized via-hole dc resistance measured was ${\sim}0.5{\Omega}$ and via inductance value measured was $\sim$83 pH.

• Journal of information and communication convergence engineering
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• 제1권3호
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• pp.129-132
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• 2003

In this paper, cobalt (Co)-electrode FBAR devices fabricated on seven-layered Bragg Reflectors are presented along with their resonance characteristics. ZnO films are used as the resonating material in FBAR devices where the Co electrode is 3000${\AA}$ thick. All processes are preformed in an RF magnetron sputtering system. As a result of characterization, the resonance characteristics are observed to depend strongly on the quality of ZnO film and Bragg Reflectors. In addition, the FBAR devices with W/$SiO_2$ reflectors show good resonance characteristics in term of return loss and quality-factor (Q-factor).

• 전자공학회논문지A
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• 제33A권12호
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• pp.53-58
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• 1996

In this paper, a simple fabrication technique of an air-bridge for interconnection of isolated electrodes of microwave active and passive devices and MMIC's is proposed. The proposed air-bridge proceses are mainly combinations of thermal evaporation, positive photoresist and image reversal processes for easy lift-off of up to 2.0 .mu.m thick metal. According to the resutls of air-birdge processes, it is confirmed that air-gap and thickness of theair-bridge are about 3.5.mu.m, and 2.0.mu.m, respectively. And it is also possible to make the fine air-bridge with widths of 5~60.mu.m and post-intervals of 25~200.mu.m withot collapse. finally, GaAs power MESFET's and rectangular spiral inductors are fabricatd and measured in order to confirm of feasibility of the proposed air-bridge processes. The MAG of the fabricated power MESFET's is 10dB at 10GHz, and the inductance of the (200.mu. * 6 turns) rectangular spiral inductors 4.5 nH inX-band.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2003년도 International Meeting on Information Display
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• pp.788-790
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• 2003

Closed-cell type barrier ribs of PDP were formed by capillary molding process using molds prepared by inclined UV lithography process. Various types of molds with different inclined angles were prepared by patterning SU-8 thick photoresist film and casting with PDMS. The ribs with various type cells were successfully formed by the process. The effects of inclined angle on the distortion of barrier ribs during sintering were investigated. The results indicated that the barrier ribs with a draft angle and dimensional change does not affect the distortion of the barrier ribs during sintering, suggesting that the closed-cell must be isotropic in sintering shrinkage.