• Carbon letters
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• v.5 no.1
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• pp.1-5
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• 2004

The effects of fiber surface-treatment and sizing on the dynamic mechanical properties of unidirectional and 2-directional carbon fiber/nylon 6 composites by means of dynamic mechanical analysis have been investigated in the present study. The interlaminar shear strengths of 2-directional carbon/nylon 6 composites sized with various thermosetting and thermoplastic resins are also measured using a short-beam shear test method. The result suggests that different surface-treatment levels onto carbon fibers may influence the storage modulus and tan ${\delta}$ behavior of carbon/nylon 6 composites, reflecting somewhat change of the stiffness and the interfacial adhesion of the composites. Dynamic mechanical analysis and short-beam shear test results indicate that appropriate use of a sizing material upon carbon fiber composite processing may contribute to enhancing the interfacial and/or interlaminar properties of woven carbon fabric/nylon 6 composites, depending on their resin characteristics and processing temperature.

• Journal of the Korean Wood Science and Technology
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• v.30 no.3
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• pp.34-41
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• 2002

This study investigated the thermogravimetric analysis of two types of cured tannin-based adhesives from wattle and pine, with three hardeners of paraformaldehyde, hexamethylenetetramine and TN (tris(hydroxyl)nitromethan), at a temperature of 170℃ and a heating rate of 5, 10, 20 and 40℃/min for 10 minutes. The 5 minutes cured wattle tannin-based adhesive with each hardener at 170℃ was also tested to compare the degree of curing. It was found that thermogravimetric analysis could be used to measure the degree of curing of a thermosetting adhesive. The TG-DTG curves of all the adhesive systems were similar and showed three steps in a similar way to a phenolic resin. This means that each adhesive system is well cross-linked. However, a high thermal decomposition rate was shown at 150 to 400℃ in the case of the pine tannin sample with TN (tris(hydroxyl)nitromethan). The Flynn & Wall expression was used to evaluate the activation energy for thermal decomposition. As the level of conversion (𝛼) increased, the activation energy of each system increased. The activation energy of the wattle tannin-based adhesive with paraformaldehyde was higher than the others.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.23 no.2
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• pp.161-167
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• 2009

Organic insulating materials which are utilized as insulating materials for the low voltage show unique carbonization characteristics when they are carbonized by a leakage current. Therefore the use of the carbonization characteristics makes it possible to examine the electrical fire which is caused by a leakage current flowing on the surface of the organic insulating material. In order to understand such carbonization characteristics, in this paper, experiments have been done to carbonize typical organic insulating materials such as phenol resin, PVC, and acrylic resin, and the carbonization patterns and the IR absorption spectrum of specimens have been analyzed. According to the analysis of the carbonization patterns, the phenol resin shows the so-called 'spider-leg' carbonization pattern due to a thermosetting property. In contrast to the phenol resin, the thermoplastic property makes it difficult to observe a clear carbonization pattern to verify carbonizing causes on the surfaces of PVC and acrylic resins. In this case, the IR absorption spectrum can be analyzed to examine the specimen carbonized by a leakage current. The analysis result shows that absorption peaks appear at the wave numbers of $3,400[cm^{-1}]$ and $1,618[cm^{-1}]$, which can be an important factor to verify the carbonizing causes.

• Advanced Composite Materials
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• v.16 no.4
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• pp.299-314
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• 2007

In the present study, natural fibers (jute, kenaf and henequen) reinforced thermoplastic (poly(lactic acid) and polypropylene) and thermosetting (unsaturated polyester) matrix composites were well fabricated by a compression molding technique using all chopped natural fibers of about 10 mm long, respectively. Prior to green composite fabrication, natural fiber bundles were surface-treated with tap water by static soaking and dynamic ultrasonication methods, respectively. The interfacial shear strength, flexural properties, and dynamic mechanical properties of each green composite system were investigated by means of single fiber microbonding test, 3-point flexural test, and dynamic mechanical analysis, respectively. The result indicated that the properties of the polymeric resins were significantly improved by incorporating the natural fibers into the resin matrix and also the properties of untreated green composites were further improved by the water treatment done to the natural fibers used. Also, the property improvement of natural fiber-reinforced green composites strongly depended on the treatment method. The interfacial and mechanical results agreed with each other.

• Composites Research
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• v.26 no.2
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• pp.129-134
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• 2013

The strength of adhesive joints employed in composite structures under cryogenic environments, such as LNG tanks, is affected by thermal residual stress generated from the large temperature difference between the bonding process and the operating temperature. Aramid fibers are noted for their low coefficient of thermal expansion (CTE) and have been used to control the CTE of thermosetting resins. However, aramid composites exhibit poor adhesion between the fibers and the resin because the aramid fibers are chemically inert and contain insufficient functional groups. In this work, electrospun meta-aramid nanofiber-reinforced epoxy adhesive was fabricated to improve the interfacial bonding between the adhesive and the fibers under cryogenic temperatures. The CTE of the nanofiber-reinforced adhesives were measured, and the effect on the adhesion strength was investigated at single-lap joints under cryogenic temperatures. The fracture toughness of the adhesive joints was measured using a Double Cantilever Beam (DCB) test.

• Korean Journal of Materials Research
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• v.3 no.3
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• pp.215-222
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• 1993

Malononitrile(MN) as a reactive additive was added to Diglycidyl ether of bisphenol A (DGEBA)/Methylene dianiline (MDA) system in order to modify a thermosetting epoxy resin. Cure ki. netics and cure mechanism of this modified system were investigated by using DSC(differential scanning calorimetry) and FT-IR(fourier transform infrared spectrometry). Cure kinetics gave an information that the DGEBA/MDA system modified with MN should cure at over $110^{\circ}C$ after curing at about $80^{\circ}C$ for the complete curing. The activation energy of the first cure was nearly constant and that of the second cure was increased as the MN content was increased. Cure mechanism for the system was investigated with the samples cured every $30^{\circ}C$, from $80^{\circ}C$ to $170^{\circ}C$, for Ihr. It was known that the cure reactions of the epoxy-diamine system were composed of PA -E, SA - E and E-OH reactions. Beside these three reactions, in the DGEBA/MDA/MN system PA-CN and CN-OH reaction was found.

• Applied Chemistry for Engineering
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• v.8 no.6
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• pp.960-966
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• 1997

The effects of epoxy resins and content of catalyst on the cure characteristics were studied by FT-IR, DSC and dynamic viscometer for the thermal properties and rheological properties of the catalytic (N-Benzylpyrazinium hexafluoroantimonate, BPH) epoxy thermosetting system. Compared with DSC results of DEGBF containing 0.5wt% BPH, the DSC thermograms of DGEBA containing 0.5wt% BPH indicated that the reaction was faster than that of DGEBF/BPH and the conversion rate of DGEBA/BPH was high in the initial stage of the reaction. As the concentration of BPH increases, the reaction and conversion rates show similar value in both the cases. The influence of hydroxyl group of epoxy resin on gel point defined from the crossover point of storage modulus (G') and loss modulus (G") could be explained by the formation of 3-dimensional network in the initial stage owing to the curing reaction between epoxides and hydroxyl groups of epoxy resin. This was consistent with the gel point obtained from DSC, FT-IR and moduli crossover. The activation energy (Et) obtained from the crossover point (G'/G"=1) are $31-39kJ.mol^{-1}$ for various BPH compositions in case of two epoxy systems.

• Polymer(Korea)
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• v.25 no.2
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• pp.199-207
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• 2001

In the present study the cure behavior of diglycidyl ether of bisphenol-A(DGEBA) using an anhydride-based hardener in the presence of N,N-dimethyl benzyl amine (BDMA) or 1-cyanoethyl-2-ethyl-4-methyl imidazole (2E4MZ-CN) as an accelerator has been monitored and interpreted from the viewpoint of photophysical properties by means of fluorescence spectroscopy. To do this, 1,3-bis-(1-pyrene)propane (BPP) was well incorporated in the epoxy resin system by mechanical blending. The BPP probe, which is very sensitive to conformational change of the molecule influenced by the surrounding medium, successfully formed intramolecular excimer fluorescence. It is susceptible to the micro-viscosity or local viscosity and molecular mobility according to the epoxy cure. The cure behavior was explained with monomer fluorescence intensity ($I_{M}$ ), excimer fluorescence intensity ($I_{E}$ ) and $I_{M}$ /$I_{E}$ ratio as a function of cure time, cure temperature and accelerator. The present work agreed with the previous report on the cure behavior of an epoxy-anhydride system studied using DSC or torsion pendulum method. This study also suggests that the use of fluorescence technique may provide information on cure behavior of a thermosetting resin in a low temperature region, which has not been well interpreted by other analytical methods.

• Korean Chemical Engineering Research
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• v.51 no.1
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• pp.111-115
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• 2013

The optimum synthetic conditions of poly(p-phenylphenol) by horseradish peroxidase in dioxane:water (80:20 v/v) mixtures were studied. The stability against thermal degradation and structural properties of the synthesized phenolic resins were investigated by thermogravimetric analysis (TGA) and differential scanning calorimetry (DSC), respectively. The synthetic yield of poly(p-phenylphenol) increased upon the increase of the amount of enzyme up to 0.25 mg HRP/mL, then leveled off for further increase of the enzyme usage. When sodium acetate (100 mM, pH 4~6) and sodium phosphate (100 mM, pH 7~9) were used as the buffering salts for the aqueous component (20% v/v), the synthetic yield of the resin increased at higher pH of the aqueous buffer. But when the pHs of the aqueous buffer were 6 and 9, the synthetic yield strongly depended on the types of the buffering salts; if sodium phosphate was used instead of sodium acetate at pH 6, the yield decreased by about 15% and if sodium bicarbonate was used instead of sodium phosphate, the yield decreased by almost 20%. When the pH range of the aqueous buffer was from 4 to 7, the addition of a radical mediator, 2,2'-azinobis (3-ethylbenzothiazoline-6-sulfonate) (ABTS), up to 2 mM improved the synthetic yield of the resin by about 10%. TGA experiments revealed that the thermal stability of the resin synthesized in dioxane:water (100 mM sodium phosphate, pH 9) (80:20 v/v) was high having the char yield of 47% upon the heating at $800^{\circ}C$. DCS results showed that the structures of the polymers synthesized in acidic aqueous buffers were different from those of the polymers synthesized in the basic aqueous buffers. However, all the synthesized resins were found to have the property of the thermosetting resins.

• Journal of Adhesion and Interface
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• v.21 no.2
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• pp.65-70
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• 2020

Epoxy adhesive was mainly used to combine different composite materials. Epoxy adhesive was a typical thermosetting resin that can be bonded by changing from a linear structure to a three-dimensional network structure by curing reaction of epoxy and hardener. The curing conditions of epoxy adhesive were different with different types of hardener such as mixing ratio, curing time, and temperature. These curing conditions affected to the adhesive property of epoxy adhesive. In industry, it was difficult to proceed the applying epoxy adhesive and combining two parts immediately. The adhesive property decreased by humidity and pre-curing of epoxy adhesive in waiting time between two processes. In this paper, the glass fiber reinforced composite (GFRC) was combined with epoxy adhesive and adhesion property between epoxy adhesive and GFRCs was evaluated using single lap shear test. The different waiting times and humidity conditions were applied to epoxy adhesive in room temperature and adhesive property decreased as the waiting time increased. In small amount of humidity, the adhesive property increased because a small amount of moisture in the surroundings accelerated the curing reaction. In certain amount of humidity, however, the adhesion property decreased.