• Title/Summary/Keyword: Thermosetting resin

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Polymer matrices for carbon fiber-reinforced polymer composites

  • Jin, Fan-Long;Lee, Seul-Yi;Park, Soo-Jin
    • Carbon letters
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    • v.14 no.2
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    • pp.76-88
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    • 2013
  • Carbon fibers (CFs) have high service temperature, strength, and stiffness, and low weight. They are widely used as reinforcing materials in advanced polymer composites. The role of the polymer matrix in the composites is to provide bulk to the composite laminate and transfer load between the fibers. The interface between the CF and the resin matrix plays a critical role in controlling the overall properties of the composites. This paper aims to review the synthesis, properties, and applications of polymer matrices, such as thermosetting and thermoplastic resins.

The Role of Inorganic Compounds Additions on the Matrix Microtexture Control of C/C Composite (무기화합물 첨가에 의한 C/C복합재료의 매트릭스 조직제어)

  • ;安田榮
    • Journal of the Korean Ceramic Society
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    • v.34 no.11
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    • pp.1151-1158
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    • 1997
  • Fracture of uni-directional carbon fiber reinforced carbon matrix composite is strongly dependent on the orientation of basal plane in graphite matrix when it is limited within matrix. The orientation of basal planes are vertically stacked to carbon fiber which results in the weakness for applied tensile or shear force in thermosetting resin derived-carbon matrix composite. Microtextural control of the matrix was tried through chemical interaction between metal carbides and furan resin derived-carbon matrix. SiC and TiO2 addition made the orientation disordered. However, porosity increased due to decomposition of SiC. Interfacial bonding could be controlled by TiO2 addition, but carbon fiber was considerably reacted with TiC during thermal treatment higher than 2$600^{\circ}C$. Therefore, it is desirable to control the thermal treatment temperature at which decomposition of SiC was not serious and TiC/C was not formed eutectoid.

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Study on the Curing Safety of Thermosetting Resin Mold Meterial (열경화성수지 성형재료의 경화 안전성에 관한 연구)

  • 최일곤;최재욱;김상렬
    • Journal of the Korean Society of Safety
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    • v.12 no.1
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    • pp.71-76
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    • 1997
  • In this paper, it was described results of study on curing safety of molding meterial, about the variation of phenol resin contents, wood flour contents and moisture of wood flour, under the same condition. The experimental results are summarized as follows ; 1) When the curing temperature was high, the curing time was short in the case of 4~8wt% moisture of wood flour, but in the case of more than l2wt% moisture of wood flour, the curing time was long. 2) The curing time for curing temperature was more short when 6wt% moisture of wood flour than 4wt% moisture of wood flour. 3) The more wood flour content and moisture of wood flour content, the longer curing time and the more mineral filler content, the shorter curing time. 4) When the phenol resin content of main matrix increase, the curing time was short.

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Manufacturing Characteristics of Woodceramics from Thinned Small Logs (II) - Dimensional Change, Weight Change and Compressive Strength -

  • Oh, Seung-Won;Hirose, Takashi;Okabe, Toshihiro
    • Journal of the Korean Wood Science and Technology
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    • v.28 no.4
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    • pp.56-60
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    • 2000
  • A new porous carbon material "woodceramics" was developed by carbonizing wood or woody materials impregnated with thermosetting resin. Steamed board and non-steamed board were made from thinned small log of Aomori Hiba (Thujopsis dolabrata S. et. Z. var. hondae M.). They were impregnated with phenol resin and sintered in a vacuum furnace at $650^{\circ}C$. In this paper, the manufacturing method of woodceramics and changes of dimension, weight and compressive strength were investigated. The changes of dimension, weight and compressive strength depend on the types of board and density.

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Viscoelastic Properties of MF/PVAc Hybrid Resins as Adhesive for Engineered Flooring by Dynamic Mechanical Thermal Analysis

  • Kim, Sumin;Kim, Hyun-Joong;Yang, Han-Seung
    • Journal of the Korean Wood Science and Technology
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    • v.34 no.2
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    • pp.37-45
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    • 2006
  • The viscoelastic properties of blends of melamine-formaldehyde (MF) resin and poly(vinyl acetate) (PVAc) for engineered flooring used on the Korean traditional ONDOL house floor heating system were investigated by dynamic mechanical thermal analysis (DMTA). Because MF resin is a thermosetting adhesive, the effect of MF rein was shown across all thermal behaviors. The addition of PVAc reduced the curing temperature. The DMTA thermogram of MF resin showed that the storage modulus (E') increased as the temperature was further increased as a result of the cross-linking induced by the curing reaction of the resin. The storage modulus (E') of MF resin increased both as a function of increasing temperature and with increasing heating rate. From isothermal DMTA results, peak $T_{tan{\delta}}$ values, maximum value of loss modulus (E") and the rigidities (${\Delta}E$) of MF/PVAc blends at room temperature as a function of open time, peak $T_{tan{\delta}}$ and maximum loss modulus (E") values were found to increase with blend MF content. Moreover, the rigidities of the 70:30 and 50:50 MF/PVAc blends were higher than those of the other blends, especially of 100% PVAc or MF. We concluded that blends the MF/PVAc blend ratios correlate during the adhesion process.

Functionally Graded Polymer Composites : Simulation of Fiber Distribution

  • Choe, Chul-Rim;C. Klingshirn;K. Friedrich
    • Macromolecular Research
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    • v.10 no.4
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    • pp.236-239
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    • 2002
  • Centrifugation is a method to create functionally graded materials (FGM) with a thermosetting matrix. In this study the movement of short carbon fibers in an epoxy resin during the centrifugation process was modeled to determine the fiber distribution in the final product. For this purpose a form factor K was introduced to modify a set of equations that was previously shown to be valid for the motion of spheres. It was shown that the results of the simulation were in good agreement with the experimental data, when an empirical K factor of four was chosen.

Dielectric Cure Monitoring for Glass/Polyester Prepreg Composites (유리섬유/폴리에스터 복합재료를 위한 유전 경화 모니터링)

  • Kim, Hyoung-Geun;Kim, Jin-Kook;Lee, Dai-Gil
    • Proceedings of the KSME Conference
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    • 2001.11a
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    • pp.797-803
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    • 2001
  • The on-line cure monitoring of fiber reinforced thermosetting resin matrix composite material was performed for the better quality and productivity during manufacturing. Since the dissipation factor measured by dielectrometry method is dependent on the degree of cure and temperature of resin, in this study, a new method to obtain the degree of cure during on-line cure monitoring for glass/polyester composites was developed by employing a combination function of the temperature and the dissipation factor. Two sensor signals from a K-type thermocouple and an interdigitated dielectric sensor were processed during curing process under various cure cycles. The DSC (Differential Scanning Calorimetry) data was also used for the reference of degree of cure.

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A Study on the Pultrusion Process of Thermosetting Composites Considering Thermally induced Deformation (열변형을 고려한 열경화성수지 복합재료의 펄트루젼 공정에 관한연구)

  • 김대환;이우일
    • Proceedings of the Korean Society For Composite Materials Conference
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    • 1999.04a
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    • pp.103-108
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    • 1999
  • A synthesized model of pultrusion process considering thermally induced deformatiion was established. The model was composed of liquid resin flow model thermo-chemical analysis and linear elastic analysis. in order to verify the above-mentioned models several experiments were performed. A laboratory scale pultrusion line was established and glass/polyester composites were fabricated. the experimental results were compared with the calculated ones. The model successfully could estimate degree of cure pulling force and amount of process-induced deformation.

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Electrical Properties of Woodceramics Made from Thinned Logs of Cryptomeria japonica D.DON (삼나무 간벌재로 제조된 우드세라믹의 전기적성질)

  • ;Toshihiro Okabe;Takashi Hirose
    • Journal of the Korea Furniture Society
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    • v.11 no.1
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    • pp.31-36
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    • 2000
  • Woodceramics are new porous carbon materials obtained by carbonization of wood or woody materials impregnated with thermosetting resin in a vacuum furnace. This study examined the electrical properties of woodceramics made from thinned logs of Cryptomeria japonica as a use for electric articles. The summarized results were as follows: 1. The volume resistivity of woodceramics decreased with increasing density of woodceramics made from 3 type board. And the volume resistivity of woodceramics made from non- steamed board was somewhat higher than steamed board. 2. The consumption of electric power of woodceramics decreased with increasing density of woodceramics and resin contents made from 3 type board. And the consumption of electric power of woodceramics made from non-steamed board was somewhat higher than steamed board. 3. When the woodceramics were coated by silicon, the consumption of electric power increased about 7%.

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Development of Phenolic SMC for The Rail (철도차량 및 지하철 불연 내장재 페놀 SMC 개발)

  • Kim Young-keun;Shin Dong-hyok;Kim Young-min;Park Joung-wuk;Min Jae-Jun
    • Proceedings of the Korean Society For Composite Materials Conference
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    • 2004.04a
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    • pp.55-58
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    • 2004
  • Phenolin resin, prepared form phenol and formaldehyde, is one of the oldest thermosetting resins available. Phenolic resins are cured via condensation polymerization with evolution of water, which in molding process is a big problem. The use of phenolic resins in glass fiber composites is growing, primarily due to their low flame spread, low smoke generation and low smoke toxicity properties. SMC of phenolics has been rearched since the 1986. The technology challenge was to match resin viscosity, handling and cure with those for the polyester SMC to avoid any special processing for fabricators and end users. Phenolic SMC was chosen because of the ease of molding to the required shape with light- weight, thin wall structure and with excellent fire protection.

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