• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.27 no.10
• /
• pp.623-629
• /
• 2014

For the semiconductor device safety from over current in the digital electronic circuit system must be surely designed that it's surface mount type micro fuse device. In this paper, We has analysed to the fusing character of micro fuse as a function changed thickness of thermosetting ink epoxy. To the change of thermosetting ink epoxy thickness with in production lot, in the electrically character (fusing test in the 2 multiple over current and 10 multiple over current, surface temperature test in the 1.25 multiple over current) of micro fuse has been tested. According to the electrically character result, changed thickness of thermosetting ink epoxy in designed micro fuse withheld direct effect in both end resistance changes. Also, because high thermal energy in the micro fuse test of over current was occurred to effect such as thermal runaway and explosion. Therefore, screen printing process in the design of micro fuse using thermosetting ink epoxy is very important for production quality improvement.