• Transactions of the Korean Society of Mechanical Engineers A
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• v.26 no.7
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• pp.1302-1308
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• 2002

Thermo-mechanical and flexural behavior of a wire-bond plastic ball grid array (WB-PBGA) package are characterized by high sensitive moire interferometry. Moire fringe patterns are recorded and analyzed for several bending loads and temperatures. At the temperature higher than $100^{\circ}C$, the inelastic deformation in solder balls become more dominant, so that the bending of the molding compound decreases while temperature increases. The deformation caused by thermally induced bending is compared with that caused by mechanical bending. The strain results show that the solder ball located at the edge of the chip has largest shear strain by the thermal load while the maximum average shear strain by the bending moment occurs in the end solder.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 1995.03a
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• pp.114-123
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• 1995

Hot workability and microstructural development of 7075Al alloy were studied by hot torsion test. With decling temperature from 440$^{\circ}C$ to 340$^{\circ}C$, and strain rate ranges form 5 ${\times}$10-3/sec to 5 ${\times}$10-1/sec , flow stress and microstructural development were analyzed . The hot resoration mechanism was found to be dynamic recrystalization (DRX) form the analysis of the flow curves and the microstructures. In multistage deformation with decreasing temperature grain refinement was obtained effectively compared to conventional thermomechanical treatment (TMT) process. The strain of the 1st stage deformation at 440$^{\circ}C$ was found to play an important role for the next stage deformation behavior at 380$^{\circ}C$.

• Proceedings of the KSME Conference
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• 2003.11a
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• pp.1407-1412
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• 2003

In MEMS devices, packaging induced stress or stress induced structure deformation become increasing concerns since it directly affects the performance of the device. In this paper, deformation behavior of MEMS gyroscope package subjected to temparature change is investigated using high-sensitivity $Moir{\acute{e}}$ interferometry. Using the real-time $Moir{\acute{e}}$ setup, fringe patterns are recorded and analyzed at several temperatures. Temperature dependent analyses of warpages and extensions/contractions of the package are presented. Linear elastic behavior is documented in the temperature region of room temperature to $125^{\circ}C$. Analysis of the package reveals that global bending occurs due to the mismatch of thermal expansion coefficient between the chip, the molding compond and the PCB.

• Journal of Welding and Joining
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• v.25 no.3
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• pp.37-44
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• 2007

Mechanical and thermomechanical properties of the bulk metallic glass (BMG) are so unique that the deformation behavior is largely dependent on the temperature and the strain rate. Impacting behavior of NiTiZrSiSn bulk metallic glass powder during kinetic spraying was investigated in this study. Considering the impact behavior of the BMG, the kinetic spraying system was modified and attached the powder preheating system to make the transition from the inhomogeneous deformation to the homogeneous deformation of impacting BMG particle easy BMG splat formation is considered from the viewpoint of the adiabatic shear instability. It is suggested that the impact behavior of bulk metallic glass particle is determined by the competition between fracture and deformation. The bonding of the impacting NiTiZrSiSn bulk amorphous particle was primarily caused by the temperature-dependent deformation and fracture (local liquid formation) behavior.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 1992.03a
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• pp.115-130
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• 1992

The analysis of thermoplastic automotive bumpers needs not only characterizations of the thermomechanical properties of thermoplastic materials but also the finite element method which can solve the problems with a large deflection, an elastic-inelastic deformation, and a change of a contact state. This paper describes the modeling techniques in the finite element analysis in order to get a good prediction of thermoplastic bumper behaviors. Simplification effects of a complex geometry of thermoplastic bumpers are studied by comparing the results from static loading tests and the finite element analysis.

• 한국정보디스플레이학회:학술대회논문집
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• 2006.08a
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• pp.1436-1441
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• 2006

Each type of optical sheets in a LCD module experiences a characteristic behavior for thermal loading and unloading. During thermal cycling, a polymeric behavior is reversible and recyclable, depending on a material stiffness critically affected by temperature and time. Some critical issues on temperature- and time-dependent themomechanical deformation of the polymeric sheet are addressed by finite-element thermal results, followed by structural simulation results in this study.

• Steel and Composite Structures
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• v.32 no.3
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• pp.389-410
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• 2019

In this article, a simple quasi-3D shear deformation theory is employed for thermo-mechanical bending analysis of functionally graded material (FGM) sandwich plates. The displacement field is defined using only 5 variables as the first order shear deformation theory (FSDT). Unlike the other high order shear deformation theories (HSDTs), the present formulation considers a new kinematic which includes undetermined integral variables. The governing equations are determined based on the principle of virtual work and then they are solved via Navier method. Analytical solutions are proposed to provide the deflections and stresses of simply supported FGM sandwich structures. Comparative examples are presented to demonstrate the accuracy of the present theory. The effects of gradient index, geometrical parameters and thermal load on thermo-mechanical bending response of the FG sandwich plates are examined.

• Composites Research
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• v.27 no.3
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• pp.90-95
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• 2014

Cure shrinkage during cure process of polymer matrix composites develope residual stress that cause some structural deformation, such as spring-in, spring-out and warpage. The carbon/epoxy prepreg used in this study is Hexply M21EV/34%/UD268NFS/IMA-12K supplied by Hexcel corp. Cure shrinkage and degree of cure measured by TMA(thermomechanical analyzer) and DSC(differential scanning calorimetry). Cure shrinkages are measured by TMA within a temperature range of $140{\sim}240^{\circ}C$ in a nitrogen atmosphere, and degree of cure determined by the heat of reaction using dynamic and isothermal DSC runs in argon atmosphere. As a result, the cure shrinkage is increased dramatically in a degree of cure range between 27~80%. the higher the cure temperature, the lower the degree of cure occurring to begin cure shrinkage.

• Journal of Mechanical Science and Technology
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• v.18 no.2
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• pp.230-239
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• 2004

A compact model approach of a network of spring elements for elastic loading is presented for the thermal deformation analysis of BGA package assembly. High-sensitivity moire interferometry is applied to evaluate and calibrated the model quantitatively. Two ball grid array (BGA) package assemblies are employed for moire experiments. For a package assembly with a small global bending, the spring model can predict the boundary conditions of the critical solder ball excellently well. For a package assembly with a large global bending, however, the relative displacements determined by spring model agree well with that by experiment after accounting for the rigid-body rotation. The shear strain results of the FEM with the input from the calibrated compact spring model agree reasonably well with the experimental data. The results imply that the combined approach of the compact spring model and the local FE analysis is an effective way to predict strains and stresses and to determine solder damage of the critical solder ball.

• Journal of the Korean Society for Heat Treatment
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• v.7 no.2
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• pp.88-95
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• 1994

In order to compare mechanical properties of ausformed martensite with those of marformed martemsite in Fe-30%Ni-0.1%C alloy and to investigate their strengthening mechanisms, ausformed martensite and marformed martensite were prepared by ausforming treatment and marforming treatment respectively. The microstructures were observed and the quantities of retained austenite, hardness, yield strength, ultimate tensile strength and elongation were examined. The strength of ausformed martensite was mainly increased because of the lattice defects inherited from austenite. The ductility of ausformed martensite was constant at the rate of 7-8% by ductile matrix formation of the retained austenite in spite of the increase in strength. The strength of marformed martensite was increased by the increment in dislocation density, the crossing of transformation twin with deformation twin and the mutual crossing of deformation twin. The ductility of mar formed martensite was slightly lower than that of ausformed martensite, but the strength of mar formed martensite was prominently higher.